JPS61121489A - 基板製造用Ｃｕ配線シ−ト - Google Patents

基板製造用Ｃｕ配線シ−ト

Info

Publication number
JPS61121489A
JPS61121489A JP24410784A JP24410784A JPS61121489A JP S61121489 A JPS61121489 A JP S61121489A JP 24410784 A JP24410784 A JP 24410784A JP 24410784 A JP24410784 A JP 24410784A JP S61121489 A JPS61121489 A JP S61121489A
Authority
JP
Japan
Prior art keywords
layer
wiring sheet
substrate
active
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24410784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518477B2 (enrdf_load_stackoverflow
Inventor
中橋　昌子
博光 竹田
白兼　誠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24410784A priority Critical patent/JPS61121489A/ja
Publication of JPS61121489A publication Critical patent/JPS61121489A/ja
Publication of JPH0518477B2 publication Critical patent/JPH0518477B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP24410784A 1984-11-19 1984-11-19 基板製造用Ｃｕ配線シ−ト Granted JPS61121489A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24410784A JPS61121489A (ja) 1984-11-19 1984-11-19 基板製造用Ｃｕ配線シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24410784A JPS61121489A (ja) 1984-11-19 1984-11-19 基板製造用Ｃｕ配線シ−ト

Publications (2)

Publication Number Publication Date
JPS61121489A true JPS61121489A (ja) 1986-06-09
JPH0518477B2 JPH0518477B2 (enrdf_load_stackoverflow) 1993-03-12

Family

ID=17113855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24410784A Granted JPS61121489A (ja) 1984-11-19 1984-11-19 基板製造用Ｃｕ配線シ−ト

Country Status (1)

Country Link
JP (1) JPS61121489A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016805A1 (en) * 1990-04-16 1991-10-31 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
WO1997004483A1 (fr) * 1995-07-21 1997-02-06 Kabushiki Kaisha Toshiba Plaquette de circuits imprimes de ceramique
JP2594475B2 (ja) * 1990-04-16 1997-03-26 電気化学工業株式会社 セラミックス回路基板
JPH09181423A (ja) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk セラミックス回路基板
JP2009071297A (ja) * 2007-08-22 2009-04-02 Mitsubishi Materials Corp パワーモジュール用基板の製造装置及びパワーモジュール用基板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016805A1 (en) * 1990-04-16 1991-10-31 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
US5354415A (en) * 1990-04-16 1994-10-11 Denki Kagaku Kogyo Kabushiki Kaisha Method for forming a ceramic circuit board
JP2594475B2 (ja) * 1990-04-16 1997-03-26 電気化学工業株式会社 セラミックス回路基板
JPH09181423A (ja) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk セラミックス回路基板
WO1997004483A1 (fr) * 1995-07-21 1997-02-06 Kabushiki Kaisha Toshiba Plaquette de circuits imprimes de ceramique
JP2009071297A (ja) * 2007-08-22 2009-04-02 Mitsubishi Materials Corp パワーモジュール用基板の製造装置及びパワーモジュール用基板の製造方法

Also Published As

Publication number Publication date
JPH0518477B2 (enrdf_load_stackoverflow) 1993-03-12

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