JPS61120863A - コ−テイング樹脂組成物 - Google Patents

コ−テイング樹脂組成物

Info

Publication number
JPS61120863A
JPS61120863A JP59242812A JP24281284A JPS61120863A JP S61120863 A JPS61120863 A JP S61120863A JP 59242812 A JP59242812 A JP 59242812A JP 24281284 A JP24281284 A JP 24281284A JP S61120863 A JPS61120863 A JP S61120863A
Authority
JP
Japan
Prior art keywords
resin
curing
cobalt naphthenate
methyl ethyl
ethyl ketone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59242812A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0457688B2 (enExample
Inventor
Naomichi Hata
秦 直道
Tatenobu Arai
荒井 建伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59242812A priority Critical patent/JPS61120863A/ja
Publication of JPS61120863A publication Critical patent/JPS61120863A/ja
Publication of JPH0457688B2 publication Critical patent/JPH0457688B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP59242812A 1984-11-16 1984-11-16 コ−テイング樹脂組成物 Granted JPS61120863A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59242812A JPS61120863A (ja) 1984-11-16 1984-11-16 コ−テイング樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59242812A JPS61120863A (ja) 1984-11-16 1984-11-16 コ−テイング樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61120863A true JPS61120863A (ja) 1986-06-07
JPH0457688B2 JPH0457688B2 (enExample) 1992-09-14

Family

ID=17094653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59242812A Granted JPS61120863A (ja) 1984-11-16 1984-11-16 コ−テイング樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61120863A (enExample)

Also Published As

Publication number Publication date
JPH0457688B2 (enExample) 1992-09-14

Similar Documents

Publication Publication Date Title
US5981043A (en) Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
TWI284013B (en) An improved method to embed thick film components
US4396666A (en) Solderable conductive employing an organic binder
DE4016953C2 (enExample)
US5736070A (en) Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
DE69034020T2 (de) Feuchtigkeitsbeständige elektrisch leitfähige Zemente und Methode zur Herstellung und Anwendung derselben
EP0818061B1 (de) Verfahren zur erzeugung elektrisch leitfähiger verbindungsstrukturen
JPS61120863A (ja) コ−テイング樹脂組成物
US4849251A (en) Method of manufacturing an electric resistance element
JPH0323091B2 (enExample)
JPH06184409A (ja) 硬化性導電組成物
JPS6312893B2 (enExample)
JPH0228608B2 (enExample)
JPS6258395B2 (enExample)
JPS61120865A (ja) コ−テイング樹脂組成物
JPS61118414A (ja) 樹脂組成物
JP4396126B2 (ja) 導電性銅ペースト組成物
JPH0678409B2 (ja) 樹脂組成物の混合方法
JPS59106185A (ja) 電子回路の被覆方法
JPH05320313A (ja) 電子部品封止用樹脂組成物
JPS6317851B2 (enExample)
JP3048650B2 (ja) 電子部品用封止材及びそれを用いた電子部品
JPH11144527A (ja) 電子部品接着用導電ペースト
JPH05178947A (ja) 高い絶縁信頼性を有するデュアル硬化型樹脂組成物
JPH0552862B2 (enExample)