JPS61119094A - 高熱伝導性回路基板の製造方法 - Google Patents

高熱伝導性回路基板の製造方法

Info

Publication number
JPS61119094A
JPS61119094A JP23947184A JP23947184A JPS61119094A JP S61119094 A JPS61119094 A JP S61119094A JP 23947184 A JP23947184 A JP 23947184A JP 23947184 A JP23947184 A JP 23947184A JP S61119094 A JPS61119094 A JP S61119094A
Authority
JP
Japan
Prior art keywords
substrate
circuit board
layer
glass
aλn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23947184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0568877B2 (enExample
Inventor
岩瀬　暢男
和敬 斎藤
五代　儀靖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23947184A priority Critical patent/JPS61119094A/ja
Priority to EP85102159A priority patent/EP0153737B1/en
Priority to DE85102159T priority patent/DE3587481T2/de
Priority to US06/706,280 priority patent/US4659611A/en
Publication of JPS61119094A publication Critical patent/JPS61119094A/ja
Publication of JPH0568877B2 publication Critical patent/JPH0568877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP23947184A 1984-02-27 1984-11-15 高熱伝導性回路基板の製造方法 Granted JPS61119094A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP23947184A JPS61119094A (ja) 1984-11-15 1984-11-15 高熱伝導性回路基板の製造方法
EP85102159A EP0153737B1 (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
DE85102159T DE3587481T2 (de) 1984-02-27 1985-02-27 Schaltungssubstrat mit hoher Wärmeleitfähigkeit.
US06/706,280 US4659611A (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23947184A JPS61119094A (ja) 1984-11-15 1984-11-15 高熱伝導性回路基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP28243294A Division JP2506270B2 (ja) 1994-10-24 1994-10-24 高熱伝導性回路基板及び高熱伝導性外囲器

Publications (2)

Publication Number Publication Date
JPS61119094A true JPS61119094A (ja) 1986-06-06
JPH0568877B2 JPH0568877B2 (enExample) 1993-09-29

Family

ID=17045260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23947184A Granted JPS61119094A (ja) 1984-02-27 1984-11-15 高熱伝導性回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61119094A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246986A (ja) * 1985-08-22 1987-02-28 住友電気工業株式会社 窒化アルミニウム基板およびその製造方法
JPH02174184A (ja) * 1988-12-26 1990-07-05 Toshiba Corp 厚膜回路基板
EP0381242A1 (en) * 1989-02-03 1990-08-08 Mitsubishi Materials Corporation Substrate used for fabrication of thick film circuit
JPH02207554A (ja) * 1989-02-07 1990-08-17 Mitsubishi Metal Corp 放熱性のすぐれた半導体装置用基板
JPH02210894A (ja) * 1989-02-10 1990-08-22 Mitsubishi Metal Corp 内部に導体、抵抗体を配線したＡｌＮ多層基板の製造方法
JPH02263445A (ja) * 1988-12-23 1990-10-26 Toshiba Corp 窒化アルミニウム基板およびそれを用いた半導体装置
US5352482A (en) * 1987-01-22 1994-10-04 Ngk Spark Plug Co., Ltd. Process for making a high heat-conductive, thick film multi-layered circuit board
EP0688047A1 (en) 1994-06-13 1995-12-20 Mitsubishi Materials Corporation Aluminium nitride substrate and method of producing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (enExample) * 1973-11-07 1975-06-20
JPS578176A (en) * 1980-06-20 1982-01-16 Seiko Epson Corp High speed thermal printer head
JPS59121175A (ja) * 1982-12-28 1984-07-13 株式会社東芝 放熱体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (enExample) * 1973-11-07 1975-06-20
JPS578176A (en) * 1980-06-20 1982-01-16 Seiko Epson Corp High speed thermal printer head
JPS59121175A (ja) * 1982-12-28 1984-07-13 株式会社東芝 放熱体の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246986A (ja) * 1985-08-22 1987-02-28 住友電気工業株式会社 窒化アルミニウム基板およびその製造方法
US5352482A (en) * 1987-01-22 1994-10-04 Ngk Spark Plug Co., Ltd. Process for making a high heat-conductive, thick film multi-layered circuit board
JPH02263445A (ja) * 1988-12-23 1990-10-26 Toshiba Corp 窒化アルミニウム基板およびそれを用いた半導体装置
JPH02174184A (ja) * 1988-12-26 1990-07-05 Toshiba Corp 厚膜回路基板
EP0381242A1 (en) * 1989-02-03 1990-08-08 Mitsubishi Materials Corporation Substrate used for fabrication of thick film circuit
JPH02207554A (ja) * 1989-02-07 1990-08-17 Mitsubishi Metal Corp 放熱性のすぐれた半導体装置用基板
JPH02210894A (ja) * 1989-02-10 1990-08-22 Mitsubishi Metal Corp 内部に導体、抵抗体を配線したＡｌＮ多層基板の製造方法
EP0688047A1 (en) 1994-06-13 1995-12-20 Mitsubishi Materials Corporation Aluminium nitride substrate and method of producing the same

Also Published As

Publication number Publication date
JPH0568877B2 (enExample) 1993-09-29

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