JPS6111471B2 - - Google Patents
Info
- Publication number
- JPS6111471B2 JPS6111471B2 JP3433378A JP3433378A JPS6111471B2 JP S6111471 B2 JPS6111471 B2 JP S6111471B2 JP 3433378 A JP3433378 A JP 3433378A JP 3433378 A JP3433378 A JP 3433378A JP S6111471 B2 JPS6111471 B2 JP S6111471B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- multilayer board
- conductive plate
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3433378A JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3433378A JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54126474A JPS54126474A (en) | 1979-10-01 |
| JPS6111471B2 true JPS6111471B2 (enrdf_load_html_response) | 1986-04-03 |
Family
ID=12411207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3433378A Granted JPS54126474A (en) | 1978-03-24 | 1978-03-24 | High-density package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54126474A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE39788T1 (de) * | 1982-09-09 | 1989-01-15 | Siemens Ag | Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen. |
-
1978
- 1978-03-24 JP JP3433378A patent/JPS54126474A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54126474A (en) | 1979-10-01 |
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