JPS6111230Y2 - - Google Patents
Info
- Publication number
- JPS6111230Y2 JPS6111230Y2 JP4262182U JP4262182U JPS6111230Y2 JP S6111230 Y2 JPS6111230 Y2 JP S6111230Y2 JP 4262182 U JP4262182 U JP 4262182U JP 4262182 U JP4262182 U JP 4262182U JP S6111230 Y2 JPS6111230 Y2 JP S6111230Y2
- Authority
- JP
- Japan
- Prior art keywords
- steel strip
- plating
- protrusion
- anode
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000873 masking effect Effects 0.000 claims description 28
- 238000009713 electroplating Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 description 31
- 239000010959 steel Substances 0.000 description 31
- 238000007747 plating Methods 0.000 description 22
- 238000009826 distribution Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000002265 prevention Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4262182U JPS58143863U (ja) | 1982-03-25 | 1982-03-25 | 連続電気メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4262182U JPS58143863U (ja) | 1982-03-25 | 1982-03-25 | 連続電気メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58143863U JPS58143863U (ja) | 1983-09-28 |
| JPS6111230Y2 true JPS6111230Y2 (ko) | 1986-04-09 |
Family
ID=30053735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4262182U Granted JPS58143863U (ja) | 1982-03-25 | 1982-03-25 | 連続電気メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58143863U (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3822136B2 (ja) * | 2002-05-15 | 2006-09-13 | 日鉱金属株式会社 | 銅箔の連続表面処理方法及び同装置 |
| JP5109821B2 (ja) * | 2008-06-09 | 2012-12-26 | 日立電線株式会社 | 電解めっき装置及び電解めっき方法 |
-
1982
- 1982-03-25 JP JP4262182U patent/JPS58143863U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58143863U (ja) | 1983-09-28 |
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