JPS61111598A - ガラスセラミツクス多層基板の製造方法 - Google Patents
ガラスセラミツクス多層基板の製造方法Info
- Publication number
- JPS61111598A JPS61111598A JP21461084A JP21461084A JPS61111598A JP S61111598 A JPS61111598 A JP S61111598A JP 21461084 A JP21461084 A JP 21461084A JP 21461084 A JP21461084 A JP 21461084A JP S61111598 A JPS61111598 A JP S61111598A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- ceramic multilayer
- circuit board
- nitride
- multilayer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21461084A JPS61111598A (ja) | 1984-10-13 | 1984-10-13 | ガラスセラミツクス多層基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21461084A JPS61111598A (ja) | 1984-10-13 | 1984-10-13 | ガラスセラミツクス多層基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111598A true JPS61111598A (ja) | 1986-05-29 |
| JPS6355238B2 JPS6355238B2 (cg-RX-API-DMAC10.html) | 1988-11-01 |
Family
ID=16658566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21461084A Granted JPS61111598A (ja) | 1984-10-13 | 1984-10-13 | ガラスセラミツクス多層基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111598A (cg-RX-API-DMAC10.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163696A (ja) * | 1985-01-11 | 1986-07-24 | 日本特殊陶業株式会社 | 多層回路基板 |
| JPS6273799A (ja) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | 多層セラミツク配線基板 |
| JPS6327094A (ja) * | 1986-07-18 | 1988-02-04 | 富士通株式会社 | 光通信用セラミツク基板の製造方法 |
| JP2006500783A (ja) * | 2002-09-27 | 2006-01-05 | メドトロニック ミニメド インコーポレイテッド | 多層基板 |
| US7514791B2 (en) | 2002-09-27 | 2009-04-07 | Medtronic Minimed, Inc. | High reliability multilayer circuit substrates |
| US8003513B2 (en) | 2002-09-27 | 2011-08-23 | Medtronic Minimed, Inc. | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
-
1984
- 1984-10-13 JP JP21461084A patent/JPS61111598A/ja active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61163696A (ja) * | 1985-01-11 | 1986-07-24 | 日本特殊陶業株式会社 | 多層回路基板 |
| JPS6273799A (ja) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | 多層セラミツク配線基板 |
| JPS6327094A (ja) * | 1986-07-18 | 1988-02-04 | 富士通株式会社 | 光通信用セラミツク基板の製造方法 |
| JP2006500783A (ja) * | 2002-09-27 | 2006-01-05 | メドトロニック ミニメド インコーポレイテッド | 多層基板 |
| US7514791B2 (en) | 2002-09-27 | 2009-04-07 | Medtronic Minimed, Inc. | High reliability multilayer circuit substrates |
| US7659194B2 (en) | 2002-09-27 | 2010-02-09 | Medtronic Minimed, Inc. | High reliability multilayer circuit substrates and methods for their formation |
| US7781328B2 (en) | 2002-09-27 | 2010-08-24 | Medtronic Minimed, Inc. | Multilayer substrate |
| US8003513B2 (en) | 2002-09-27 | 2011-08-23 | Medtronic Minimed, Inc. | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| JP2009246401A (ja) * | 2003-09-26 | 2009-10-22 | Medtronic Minimed Inc | 高信頼性多層回路基板およびその形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6355238B2 (cg-RX-API-DMAC10.html) | 1988-11-01 |
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