JPS61111570A - 冷却素子の製造方法 - Google Patents

冷却素子の製造方法

Info

Publication number
JPS61111570A
JPS61111570A JP59214609A JP21460984A JPS61111570A JP S61111570 A JPS61111570 A JP S61111570A JP 59214609 A JP59214609 A JP 59214609A JP 21460984 A JP21460984 A JP 21460984A JP S61111570 A JPS61111570 A JP S61111570A
Authority
JP
Japan
Prior art keywords
cooling
bellows
outer periphery
cooling plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59214609A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320072B2 (cg-RX-API-DMAC7.html
Inventor
Katsuhide Natori
名取　勝英
Yukihisa Katsuyama
勝山　幸寿
Tsutomu Iikawa
勤 飯川
Isao Kawamura
勲 川村
Takeaki Sakai
酒井　武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59214609A priority Critical patent/JPS61111570A/ja
Publication of JPS61111570A publication Critical patent/JPS61111570A/ja
Publication of JPH0320072B2 publication Critical patent/JPH0320072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59214609A 1984-10-13 1984-10-13 冷却素子の製造方法 Granted JPS61111570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59214609A JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59214609A JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Publications (2)

Publication Number Publication Date
JPS61111570A true JPS61111570A (ja) 1986-05-29
JPH0320072B2 JPH0320072B2 (cg-RX-API-DMAC7.html) 1991-03-18

Family

ID=16658548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59214609A Granted JPS61111570A (ja) 1984-10-13 1984-10-13 冷却素子の製造方法

Country Status (1)

Country Link
JP (1) JPS61111570A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPH0320072B2 (cg-RX-API-DMAC7.html) 1991-03-18

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