JPS61102019A - Capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention provides a plastic film with excellent heat resistance.
This invention relates to a wound type capacitor having an inductive structure, in which an element is formed by winding a metallized film coated with a metal material, and the element is covered with a plastic material.

2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, in order to reduce the size of electronic devices and improve the productivity of single circuit boards, the use of chips in electronic components has rapidly progressed. When chip components are mounted, the electronic components themselves become hot, so when making plastic film capacitors into chips, it is necessary to significantly improve heat resistance.

Plastic film capacitors are widely used because they exhibit excellent characteristics in terms of temperature characteristics, frequency characteristics, and component reliability.However, as dielectric materials, they are mainly polyester films such as polyethylene terephthalate, and polyolefin films such as polypropylene. Currently, these dielectric films do not have sufficient heat resistance, so they cannot withstand the high temperatures during mounting using the chip method.

OBJECTS OF THE INVENTION In view of the current situation, it is an object of the present invention to provide a capacitor that has high heat resistance that can withstand high temperatures during mounting using the chip method, and also has the features of a film capacitor.

Structure of the Invention To achieve this object, the present invention provides a wound type metallized film capacitor with an inductive structure, in which a polyphenylene sulfide (hereinafter abbreviated as PPS) film is used as a dielectric material, and the bending elastic modulus is 300 Kp/7 (200 Kp/7).
By using plastic material (e.g. epoxy molding resin) with a minimum thickness of 0.6 m or more and having mechanical properties exceeding We have developed a capacitor that has certain good temperature and frequency characteristics and exhibits high reliability.

In other words, with conventional film capacitors, when mounted in a high-temperature atmosphere using the chip method, the dielectric film shrinks and deforms the element, significantly deteriorating its characteristics and causing damage to the exterior. In contrast, in the capacitor of the present invention, by using a PPS film as the dielectric film, element deformation caused by shrinkage of the film due to high temperatures during mounting using the SAP method can be significantly reduced, and
By using an exterior material with a mechanical property of bending elastic modulus of 300 KPm or more at °C and applying an exterior with a minimum thickness of 0.5wn or more, the SUP construction method secures the retaining force of the exterior and suppresses element deformation. It is designed to withstand high temperatures during mounting.

Description of examples The following will explain based on Examples and Comparative Examples.

The figure shows the structure of a capacitor according to an embodiment of the present invention, where 1 is an exterior part, 2 is a wound element, and 3 is a lead terminal.

Table 1 shows the dielectric film materials, exterior materials and exterior construction methods, flexural modulus (mechanical properties) at 200°C of the exterior materials, and exterior thickness of the capacitors of Examples and Comparative Examples.

Table 2 shows the test results regarding changes in characteristics (rate of change in capacitance) and changes in appearance of the capacitors when the capacitors of the examples and comparative examples shown in Table 1 were mounted using the SAP method.

The mounting conditions in Table 2 are solder bath dipping method, solder temperature 260°C, dip time 5 seconds once, and preheating 1 time.
The temperature was set at 00°C for 50 seconds.

Table 1 Note) PET: Polyethylene terephthalate, PP: Polypropylene Table 2 Note) ΔC/C: Capacitance change rate during mounting using the chip method) Effects of the invention As is clear from the above results, the present invention has Capacitors can withstand high temperatures when mounted using the chip method, and also have the excellent features of film capacitors, making a major contribution to downsizing electronic devices and improving the productivity of circuit boards. be.

[Brief explanation of the drawing]

The figure is a perspective view showing the structure of a capacitor according to an embodiment of the present invention. 1... Exterior part, 2... Winding element.

Claims (1)

[Claims] A wound type metallized film capacitor with an inductive structure uses polyphenylene sulfide as a dielectric material and has a bending modulus of elasticity of 300 kg/m at 200°C.
A capacitor characterized by having an exterior made of a plastic material of m^2 or more and having a minimum thickness of 0.5m or more.