JPS61100425A - Mold for molding plastic - Google Patents
Mold for molding plasticInfo
- Publication number
- JPS61100425A JPS61100425A JP22248984A JP22248984A JPS61100425A JP S61100425 A JPS61100425 A JP S61100425A JP 22248984 A JP22248984 A JP 22248984A JP 22248984 A JP22248984 A JP 22248984A JP S61100425 A JPS61100425 A JP S61100425A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- surface smoothness
- molding
- ceramic material
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
i匪へ1妊
(産業上の利用分野)
本発明は、表面平滑性に優れたプラスチック製品を成形
するための金型に関する6
(従”来の技術)
近年、プラスチックの用途が広がり、種々の製品に用い
られているが、これに伴ない、高い表面平滑性を要求さ
れることがある0例えば、光ディスクや磁λディスク用
の基板では、中心線平均粗さRaを、0.015ミクロ
ン場合によっては0゜003ミクロン程度のillさに
抑えなければならない、上記のような表面平滑性を有す
る基板を成形するためには、金型の成形面の表面平滑性
を高くしなければならない、しかし、金型材を切削研摩
しても、材質および工作の困難性から上記のような高い
表面平滑性を達成することができない。Detailed Description of the Invention The present invention relates to a mold for molding plastic products with excellent surface smoothness. Its applications are expanding and it is used in various products, but along with this, high surface smoothness is sometimes required.For example, in substrates for optical disks and magnetic λ disks, the center line average roughness Ra In order to mold a substrate with the above-mentioned surface smoothness, it is necessary to suppress the illumination to 0.015 microns or about 0°003 microns in some cases. However, even if the mold material is cut and polished, the above-mentioned high surface smoothness cannot be achieved due to the material and the difficulty of machining.
そこで、特開昭59−135133号公報に見 ゛られ
るように、金属表面皮膜法(真空蒸着やスバッタリング
)によって、金型の成形面にクロム、ロジツム等の金属
皮膜を形成する技術が検討されている。Therefore, as seen in Japanese Unexamined Patent Publication No. 59-135133, a technology to form a metal film of chromium, rhodium, etc. on the molding surface of a mold using a metal surface film method (vacuum deposition or sputtering) has been studied. has been done.
(発明が解決しようとしている問題点)しかし、上記の
技術では、中心線平均粗さRaの大きい金型材を皮膜で
覆うことにより成形面のRaを小さくすることができて
も、金型材の表面のうねりRwを小さくすることができ
ない。また、皮膜を厚くすることができないので、皮膜
の耐久性が悪い。(Problem to be solved by the invention) However, with the above technology, even if Ra of the molding surface can be reduced by covering the mold material with a large center line average roughness Ra with a film, the surface of the mold material It is not possible to reduce the waviness Rw. Moreover, since the film cannot be made thick, the durability of the film is poor.
i」へW炙
(問題点を解決するための手段)
本発明は上記問題点を解消するためになされたちので、
その要旨は、キャビティを構成する成形面の少なくとも
一部をセラミックス材料で形成することをvf徴とする
プラスチック成形用金をにある。i'' W Roasted (Means for Solving the Problems) Since the present invention has been made to solve the above problems,
The gist thereof is to provide a molding metal for plastic molding in which at least a part of the molding surface constituting the cavity is made of a ceramic material.
(作用)
本発明にあっては、切削、研摩によって高い表面平滑性
を実現できるセラミックス材料を、成形面の少なくとも
一部に用いているため、この成形面に接触して成形され
るプラスチック製品の表面平滑性を向上できる。(Function) In the present invention, since a ceramic material that can achieve high surface smoothness by cutting and polishing is used for at least a part of the molding surface, the plastic product that is molded in contact with this molding surface is Surface smoothness can be improved.
(実施例)
以下、本発明の一実施例を図面を参照して説明する。図
示の射出成形金型は、プラスチック製の磁気ディスクま
たは光ディスクを成形するためのものである。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. The illustrated injection mold is for molding a plastic magnetic disk or optical disk.
金型は互いに開割、閉合される固定型10と移動型20
によって構成されている。固定型10には、円形の凹部
11が形成されており、この凹部11の中央に金属から
なる補助プレート12、周囲にセラミックス材料からな
る環状の補助プレート13が、それぞれ貼り付けられて
いる。池方、移動型20にも凹部21が形成されており
、この凹部21の中央に金属製の補助プレー)22、周
囲にセラミックス材料からなる環状の補助プレート23
が、それぞれ貼り付けられている。The molds include a fixed mold 10 and a movable mold 20 that are opened and closed with each other.
It is made up of. A circular recess 11 is formed in the fixed mold 10, and an auxiliary plate 12 made of metal is attached to the center of the recess 11, and an annular auxiliary plate 13 made of a ceramic material is attached around the periphery. Ikegata: A recess 21 is also formed in the movable mold 20, and a metal auxiliary plate 22 is placed in the center of this recess 21, and an annular auxiliary plate 23 made of a ceramic material is placed around the periphery.
are pasted on each.
固定型10と移動型20の閉会時には、補助プ
トレー)13.23間に偏平な成形用のキャ
ビティ30が形成される。そして、補助プレート13゜
23の表面が成形面13a、23aとなる。この成形面
13a、23aは、表面切削、研摩により、非常に高い
表面平滑性を有している。補助プレート13.23は耐
久性等の観点から、100ミクロン以上であるのが望ま
しい。When the fixed type 10 and mobile type 20 are closed, the auxiliary platform
A flat molding cavity 30 is formed between the trays 13 and 23. The surface of the auxiliary plate 13.degree. 23 becomes the molding surface 13a, 23a. The molding surfaces 13a, 23a have extremely high surface smoothness due to surface cutting and polishing. From the viewpoint of durability, it is desirable that the auxiliary plates 13, 23 have a thickness of 100 microns or more.
上記補助プレー)13.23のセラミックス材料として
は、高誘電性で高周波吸収能の高い材料が望ましく、U
に炭化けい素SiCが望ましい。As the ceramic material in 13.23 (auxiliary play) above, it is desirable to use a material with high dielectricity and high frequency absorption ability;
Silicon carbide SiC is preferable.
セラミックス材料は通常焼結体が用いられるが、より高
い表面平滑性を要求される場合には単結晶体が用いられ
る。A sintered body is usually used as the ceramic material, but a single crystal body is used when higher surface smoothness is required.
固定型10にはスプルー14が形成されており。A sprue 14 is formed on the fixed mold 10.
対向する補助プレー)12.22間にはランナー15が
形成されている。また、移動型20おより補助プレー)
22.23には、突き出しピン24が挿入されている。A runner 15 is formed between the opposing auxiliary plays) 12 and 22. Also, mobile type 20 auxiliary play)
An ejector pin 24 is inserted into 22 and 23.
上記構成において、まず固定型10と移動型2・ Oと
を開いた状態で、高周波発生装置(図示しない)によっ
て各補助プレー)13.23を高周波誘電加熱する。こ
の際、高周波は金属材料からなる固定型10.移動型2
0では反射され、高誘電性のセラミックス材料からなる
補助プレート13゜23でのみ吸収されるから、この補
助プレート13.23を効率良く加熱でき、短時間で樹
脂変形温度以上にすることができる。補助プレート13
゜23の材料としてSiCを用いた場合、必要な高周波
は2450±50MHz程度である。なお、上記高周波
誘電加熱は、型閉会状態でキャビティ30の内部に発信
素子を挿入して行なうことも可能である。In the above configuration, first, with the fixed mold 10 and the movable mold 2.O open, each auxiliary plate 13, 23 is heated by high frequency dielectric using a high frequency generator (not shown). At this time, the high frequency is a fixed type 10 made of metal material. Mobile type 2
Since the light is reflected at 0 and absorbed only by the auxiliary plate 13.23 made of a highly dielectric ceramic material, the auxiliary plate 13.23 can be efficiently heated to a temperature higher than the resin deformation temperature in a short time. Auxiliary plate 13
When SiC is used as the material of ゜23, the required high frequency is about 2450±50 MHz. Note that the above-mentioned high-frequency dielectric heating can also be performed by inserting a transmitting element into the cavity 30 while the mold is closed.
次に、移動型20を固定型10に閉合させ、廿(脂を射
出する。11脂はスプルー14からランナー15お上り
細いゲート(図示せず)を経てキャビティ30に充填さ
れる。この結果、ディスクAが成形される。ディスクA
は、補助プレー)13.23が高い表面平滑性を有して
いるため、高い表面平滑性を得ることができる。しかも
、補助プレート13.23が予め樹脂変形温度以上に加
熱されていて樹脂への転写を良好に行なえるから、より
高い表面平滑性を得ることができる。Next, the movable mold 20 is closed to the fixed mold 10, and the lubricant is injected. The lubricant rises from the sprue 14 to the runner 15 and fills the cavity 30 through a thin gate (not shown).As a result, Disc A is molded. Disc A
Since auxiliary play) 13.23 has high surface smoothness, high surface smoothness can be obtained. Moreover, since the auxiliary plates 13, 23 are heated in advance to a temperature higher than the resin deformation temperature, good transfer to the resin can be achieved, so that higher surface smoothness can be obtained.
次に、樹脂が冷却固化した後、移動型20を後退させて
開き、突き出しビン24の作動により、ディスクAを離
型するとともに、このディスクAをスプル一部B、ラン
ナ一部Cがら分離する。Next, after the resin has cooled and solidified, the movable mold 20 is moved back and opened, and the ejector pin 24 is activated to release the disk A from the mold and separate the disk A from the sprue part B and the runner part C. .
本発明は上記実施例に制約されず種々の態様が可能であ
る0例えば、本発明は、上述の射出成形金型に限らず、
圧縮成形金型、射出圧綿成形金型にも適用できる。The present invention is not limited to the above-mentioned embodiments, and various embodiments are possible.For example, the present invention is not limited to the above-mentioned injection mold,
It can also be applied to compression molding molds and injection compression molding molds.
発1と炊1− 以上説明したように、本発明にあっては、切削。Cooking 1 and Cooking 1- As explained above, in the present invention, cutting is performed.
研摩によって高い表面平滑性を実現できるセラミックス
材料を、成形面の少なくとも一部に用いているため、こ
の成形面に接触して成形されるプラス゛ チック製品
の表面平滑性を向上できる。Since a ceramic material that can achieve high surface smoothness by polishing is used for at least a portion of the molding surface, the surface smoothness of the plastic product that is molded in contact with this molding surface can be improved.
第1図は本発明の一実施例をなす金型の開割状態の断面
図、第2図は同じく閉会状態の断面図である。
10・・・固定型、20・・・移動型、13.23・・
・セラミックス材料からなる補助プレート、+3a、2
3a・・・成型面、30・・・キャビティ、A・・・デ
ィスク(プラスチック製品)FIG. 1 is a cross-sectional view of a mold according to an embodiment of the present invention in an open state, and FIG. 2 is a cross-sectional view of the mold in a closed state. 10...Fixed type, 20...Movable type, 13.23...
・Auxiliary plate made of ceramic material, +3a, 2
3a... Molding surface, 30... Cavity, A... Disc (plastic product)
Claims (6)
セラミックス材料で形成することを特徴とするプラスチ
ック成形用金型。(1) A mold for plastic molding, characterized in that at least a part of the molding surface constituting the cavity is formed of a ceramic material.
範囲第1項に記載のプラスチック成形用金型。(2) The plastic mold according to claim 1, wherein the ceramic material is a sintered body.
の範囲第1項に記載のプラスチック成形用金型。(3) The plastic molding die according to claim 1, wherein the ceramic material is a single crystal.
求の範囲第1項に記載のプラスチック成形用金型。(4) The plastic molding die according to claim 1, wherein the ceramic material has high dielectricity.
求の範囲第4項に記載のプラスチック成形用金型。(5) The plastic mold according to claim 4, wherein the ceramic material is silicon carbide.
さを有する特許請求の範囲第1項に記載のプラスチック
成形用金型。(6) The plastic molding die according to claim 1, wherein the ceramic material has a thickness of 100 microns or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22248984A JPS61100425A (en) | 1984-10-23 | 1984-10-23 | Mold for molding plastic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22248984A JPS61100425A (en) | 1984-10-23 | 1984-10-23 | Mold for molding plastic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61100425A true JPS61100425A (en) | 1986-05-19 |
Family
ID=16783227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22248984A Pending JPS61100425A (en) | 1984-10-23 | 1984-10-23 | Mold for molding plastic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61100425A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61123035A (en) * | 1984-11-20 | 1986-06-10 | Matsushita Electric Ind Co Ltd | Negative disc for optical disc and its production |
JPS62181118A (en) * | 1986-02-05 | 1987-08-08 | Showa Denko Kk | Mold for molding |
JPS63194913A (en) * | 1987-02-09 | 1988-08-12 | Tosoh Corp | Plastic injection mold |
WO1988007924A1 (en) * | 1987-04-10 | 1988-10-20 | Opt Engineering Ag | Mould insert with scratch-resistant polished mould surface for manufacture of plastic parts |
JPS63283921A (en) * | 1987-05-18 | 1988-11-21 | Showa Denko Kk | Molding mold |
JPH0288722U (en) * | 1988-12-27 | 1990-07-13 | ||
US6165407A (en) * | 1997-05-28 | 2000-12-26 | Mitsubishi Engineering-Plastics Corp. | Mold assembly for molding thermoplastic resin and method of manufacturing molded article of thermoplastic resin |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58191133A (en) * | 1982-04-30 | 1983-11-08 | Seikosha Co Ltd | Mold |
JPS5912806A (en) * | 1982-07-13 | 1984-01-23 | Seikosha Co Ltd | Mold |
-
1984
- 1984-10-23 JP JP22248984A patent/JPS61100425A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58191133A (en) * | 1982-04-30 | 1983-11-08 | Seikosha Co Ltd | Mold |
JPS5912806A (en) * | 1982-07-13 | 1984-01-23 | Seikosha Co Ltd | Mold |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61123035A (en) * | 1984-11-20 | 1986-06-10 | Matsushita Electric Ind Co Ltd | Negative disc for optical disc and its production |
JPH0630170B2 (en) * | 1984-11-20 | 1994-04-20 | 松下電器産業株式会社 | Optical disc master and method of manufacturing the same |
JPS62181118A (en) * | 1986-02-05 | 1987-08-08 | Showa Denko Kk | Mold for molding |
JPH0336653B2 (en) * | 1986-02-05 | 1991-06-03 | Showa Denko Kk | |
JPS63194913A (en) * | 1987-02-09 | 1988-08-12 | Tosoh Corp | Plastic injection mold |
WO1988007924A1 (en) * | 1987-04-10 | 1988-10-20 | Opt Engineering Ag | Mould insert with scratch-resistant polished mould surface for manufacture of plastic parts |
JPS63283921A (en) * | 1987-05-18 | 1988-11-21 | Showa Denko Kk | Molding mold |
JPH0444890B2 (en) * | 1987-05-18 | 1992-07-23 | Showa Denko Kk | |
JPH0288722U (en) * | 1988-12-27 | 1990-07-13 | ||
US6165407A (en) * | 1997-05-28 | 2000-12-26 | Mitsubishi Engineering-Plastics Corp. | Mold assembly for molding thermoplastic resin and method of manufacturing molded article of thermoplastic resin |
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