JPS61100138U - - Google Patents

Info

Publication number
JPS61100138U
JPS61100138U JP18527084U JP18527084U JPS61100138U JP S61100138 U JPS61100138 U JP S61100138U JP 18527084 U JP18527084 U JP 18527084U JP 18527084 U JP18527084 U JP 18527084U JP S61100138 U JPS61100138 U JP S61100138U
Authority
JP
Japan
Prior art keywords
wafer
prober
protrusions
stage
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18527084U
Other languages
Japanese (ja)
Other versions
JPH0331077Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185270U priority Critical patent/JPH0331077Y2/ja
Publication of JPS61100138U publication Critical patent/JPS61100138U/ja
Application granted granted Critical
Publication of JPH0331077Y2 publication Critical patent/JPH0331077Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図のプローバの従来例をモデ
ル的にあらわす側面図および部分的斜視図、第３
図は従来のプローバによつてウエハの導通検査を
行つた際の結果を示すグラフ、第４図および第５
図はこの考案にかかるプローバの一実施例をモデ
ル的にあらわす部分的断面図、第６図は第４図の
プローバによつてウエハの導通検査を行つた際の
結果を示すグラフである。 １…ウエハ、７…プローバ、８…ステージ、８
ａ…凹部底面、９…プローブ、１０…突起、１０
ａ…台、１０ｂ…凹部、１３…載置台、１４…ゴ
ム。 A side view and a partial perspective view of the conventional example of the prober shown in FIGS. 1 and 2;
Figures 4 and 5 are graphs showing the results of conducting continuity tests on wafers using a conventional prober.
The figure is a partial cross-sectional view schematically showing an embodiment of the prober according to the invention, and FIG. 6 is a graph showing the results of conducting a continuity test on a wafer using the prober of FIG. 4. 1... Wafer, 7... Prober, 8... Stage, 8
a...bottom of recess, 9...probe, 10...protrusion, 10
a...stand, 10b...recess, 13...mounting table, 14...rubber.

Claims (1)

【実用新案登録請求の範囲】 (1) ウエハを載置する金属製のウエハステージ
と、このステージ上のウエハの表面を探触するた
めのプローブとを備え、ステージとプローブとの
間に電圧をかけた状態でプローブによりウエハ表
面を探触してウエハの導通状態を確認するプロー
バであつて、ステージが、上端が同一平面となる
よう立て並べられた多数の突起と、これらの突起
を支持する台とを備え、前記突起群の先端でウエ
ハを受けるようになつていることを特徴とするプ
ローバ。 (2) ウエハが真空吸着により突起群の先端に押
し付けられるようになつている実用新案登録請求
の範囲第１項記載のプローバ。 (3) ステージの台の表面に凹部が形成されてい
て、その凹部内に突起群が形成され、凹部の周壁
からはウエハ周縁部を載置する載置台が延出して
おり、この載置台と凹部底面との間に弾性体が介
在している実用新案登録請求の範囲第１項または
第２項記載のプローバ。[Claims for Utility Model Registration] (1) A metal wafer stage on which a wafer is placed and a probe for detecting the surface of the wafer on this stage, and a voltage is applied between the stage and the probe. A prober that checks the conductivity state of the wafer by probing the surface of the wafer with a probe in the suspended state, and the stage supports a large number of protrusions arranged vertically so that their upper ends are on the same plane, and these protrusions. 1. A prober comprising: a base, the prober being adapted to receive a wafer at the tips of the group of protrusions. (2) The prober according to claim 1, wherein the wafer is pressed against the tips of the group of protrusions by vacuum suction. (3) A recess is formed on the surface of the stage base, a group of protrusions are formed within the recess, and a mounting table on which the peripheral edge of the wafer is placed extends from the peripheral wall of the recess. The prober according to claim 1 or 2, wherein an elastic body is interposed between the prober and the bottom surface of the recess.
JP1984185270U 1984-12-05 1984-12-05 Expired JPH0331077Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185270U JPH0331077Y2 (en) 1984-12-05 1984-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185270U JPH0331077Y2 (en) 1984-12-05 1984-12-05

Publications (2)

Publication Number Publication Date
JPS61100138U true JPS61100138U (en) 1986-06-26
JPH0331077Y2 JPH0331077Y2 (en) 1991-07-01

Family

ID=30742748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185270U Expired JPH0331077Y2 (en) 1984-12-05 1984-12-05

Country Status (1)

Country Link
JP (1) JPH0331077Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027864A (en) * 2008-07-18 2010-02-04 Sumco Corp Method of manufacturing semiconductor device
JP2015049137A (en) * 2013-09-02 2015-03-16 三菱電機株式会社 Semiconductor chip tester and semiconductor chip test method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4123701Y1 (en) * 1966-02-22 1966-12-02
JPS546867U (en) * 1977-06-16 1979-01-17
JPS56147076A (en) * 1980-04-18 1981-11-14 Hitachi Ltd Characteristic testing electrode
JPS6080772A (en) * 1983-10-08 1985-05-08 Rohm Co Ltd Probe needle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4123701Y1 (en) * 1966-02-22 1966-12-02
JPS546867U (en) * 1977-06-16 1979-01-17
JPS56147076A (en) * 1980-04-18 1981-11-14 Hitachi Ltd Characteristic testing electrode
JPS6080772A (en) * 1983-10-08 1985-05-08 Rohm Co Ltd Probe needle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027864A (en) * 2008-07-18 2010-02-04 Sumco Corp Method of manufacturing semiconductor device
JP2015049137A (en) * 2013-09-02 2015-03-16 三菱電機株式会社 Semiconductor chip tester and semiconductor chip test method

Also Published As

Publication number Publication date
JPH0331077Y2 (en) 1991-07-01

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