JPS6090836U - エア−テンシヨン制御装置 - Google Patents

エア−テンシヨン制御装置

Info

Publication number
JPS6090836U
JPS6090836U JP18442083U JP18442083U JPS6090836U JP S6090836 U JPS6090836 U JP S6090836U JP 18442083 U JP18442083 U JP 18442083U JP 18442083 U JP18442083 U JP 18442083U JP S6090836 U JPS6090836 U JP S6090836U
Authority
JP
Japan
Prior art keywords
control device
tension control
air tension
wires
metal wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18442083U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0143868Y2 (enrdf_load_stackoverflow
Inventor
三橋　江史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adamant Co Ltd
Original Assignee
Adamant Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adamant Kogyo Co Ltd filed Critical Adamant Kogyo Co Ltd
Priority to JP18442083U priority Critical patent/JPS6090836U/ja
Publication of JPS6090836U publication Critical patent/JPS6090836U/ja
Application granted granted Critical
Publication of JPH0143868Y2 publication Critical patent/JPH0143868Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP18442083U 1983-11-29 1983-11-29 エア−テンシヨン制御装置 Granted JPS6090836U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18442083U JPS6090836U (ja) 1983-11-29 1983-11-29 エア−テンシヨン制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18442083U JPS6090836U (ja) 1983-11-29 1983-11-29 エア−テンシヨン制御装置

Publications (2)

Publication Number Publication Date
JPS6090836U true JPS6090836U (ja) 1985-06-21
JPH0143868Y2 JPH0143868Y2 (enrdf_load_stackoverflow) 1989-12-19

Family

ID=30398882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18442083U Granted JPS6090836U (ja) 1983-11-29 1983-11-29 エア−テンシヨン制御装置

Country Status (1)

Country Link
JP (1) JPS6090836U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0143868Y2 (enrdf_load_stackoverflow) 1989-12-19

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