JPS609079A - Method of producing lead terminal - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a method for manufacturing a lead terminal, and particularly to a sheared surface of a lead terminal punched by a press.
-Relates to a method for manufacturing lead terminals that allows for good soldering.

[Prior art and its problems]

Generally, ICs, transistors, resistors, capacitors, and various other electronic components are mounted on the printed circuit board, and the lead terminals of these electronic components are attached automatically to the copper foil part of the pattern area using a device or manually. ...will be marked down. The lead terminals of this type of electronic component are often punched out using a press, and the sheared surface by the punch and die becomes a rough surface, which is an obstacle to good soldering.

Conventionally, after pressing, bending, and soldering, a surface treatment such as plating is applied to improve the properties, but this type of lead terminal is small and requires bending, etc., and the shape is different. Because there are many complicated things.

During work such as plating, parts become tangled and deformed, which hinders subsequent processing and assembly work, and requires additional man-hours for correction work. Another method is to plate the plate material in the form of a hoop material and then press it, but this has the problem that the sheared surface is exposed during the press process, reducing the freshness of the plate. [Object of the Invention] Therefore, the object of the present invention is to provide a method for manufacturing lead terminals that eliminates the drawbacks of conventional manufacturing methods, improves the properties of the sheared surface punched by pressing, and improves the soldering properties. It is about providing.

[Key points of the invention]

In order to achieve the above object, the present invention provides a method for manufacturing a lead terminal by punching a plate material along a predetermined contour line, in which the edge of the contour line is locally reduced in thickness along the contour line. It is characterized by being stamped and then punched out along the contour line.

[Detailed description of the invention]

According to the present invention, the width of the sheared surface due to punching can be reduced by locally reducing the thickness along the outer periphery of the lead terminal in the process before punching. It can be made good.

Hereinafter, a method for manufacturing a lead terminal according to the present invention will be explained with reference to the drawings.

FIG. 1 shows a relay 2 as an example of an electronic component to be mounted on a printed circuit board 1, and this relay 2 is provided with a plurality of lead terminals 3.3.3. The lead terminals 3 of this relay 2 are soldered to a copper foil forming a pattern, and are usually manufactured by punching out a plate material.

Next, a method for manufacturing this lead terminal 3 according to the present invention will be explained.

First, a strip-shaped plate material 5 is placed on a lower mold 4 having a flat surface. This plate material 5 is a flat plate having a uniform thickness t, and a punch 6 is pushed into the plate material 5 from two sides to a certain depth h. This punch 6 is provided with a tooth portion 9 for forming a reduced thickness portion 8 inside the contour line 7 of the lead terminal 3, and when pushed in by a depth h, a groove 10 is formed on the surface of the plate material 5. Then, the peak portion 11 whose thickness is not reduced forms the main body portion of the lead terminal 3.

The pushing operation of the punch 6 is performed at a pitch of ■
] It is best to form them continuously.

Next, the lead terminal 3 is punched out along the contour line 7 using a punch and a die. The shear thickness at this time is approximately 0.25 in the thickness-reduced portion, so it can be easily cut.

In the lead terminal 3 that has been sheared in this way, a reduced thickness portion 8 having a uniform width is formed at the edge of the contour line 7, and the thickness of the sheared surface of this reduced thickness portion 8 is The original thickness of the plate material 5 is also smaller. Therefore, when soldering the lead terminal 3 to the copper foil of the printed board, it is possible to improve the soldering properties.

In the embodiment shown in FIG. 2 (5) a3), the punch 6 was pushed into the plate material 5 only from one side.

As shown in FIGS. 3(A) and 3(CB), punches 6.6 may be pushed into both sides of the plate material 5. That is,
As shown in Figure 3 FB), a punch 6.6 of the same shape and size.
When pressed from both sides of the plate material 5, the peaks 11. ], 1, a reduced thickness portion 8 is formed.

〔Effect of the invention〕

, the thickness of the cut surface due to punching is reduced.
・Dandering can improve sex0

[Brief explanation of drawings]

Fig. 1 is a side view showing a relay main body equipped with lead terminals, Figs. 2 (A) and (B) are explanatory diagrams showing the process of reducing the thickness of the lead terminal with a punch, and Fig. 3 (5) (B). ) is an explanatory diagram showing a thickness reduction process according to another embodiment of the present invention. 1... Printed circuit board, 3... Lead terminal, 5...
Plate material 6... Punch, 7... Contour line Patent applicant Fuji Electric Manufacturing Co., Ltd.

Claims (1)

[Claims] 1. In a method of manufacturing a lead terminal by punching out a plate material, the edge of the outline of the lead terminal is locally reduced in thickness along the outline, and then the outline is A method for manufacturing a lead terminal, characterized in that a punching process is performed along the line. 2. A method for manufacturing a lead terminal according to claim 1, characterized in that the thickness reduction process is performed only on one side of the plate material 3. Claim 1 A method for manufacturing a lead terminal as described in Section 1, characterized in that the thickness reduction process is performed from both sides of the plate material.