JPS6088532A - Endoscope - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to an endoscope using a solid-state imaging device, and the present invention relates to an endoscope that uses a solid-state imaging device, and includes an illumination means and an imaging optical system at the tip of an insertion section that is inserted into a body cavity. In the device in which the solid-state image sensor is disposed within the tip structure in which the system is incorporated, the solid-state image sensor is formed into a circular or semicircular shape and arranged in a radial direction or an oblique direction, and the illumination means is disposed within the tip structure. - This invention relates to an endoscope in which each element such as an ovum channel, an air/water supply channel, etc. can be arranged efficiently, and the diameter of the distal end component is reduced.

[Background of the invention technique i6 and its problems] In recent years, solid-state Wn f'f+ such as charge-coupled devices (COD)
Various endoscopes using the element as an imaging means have been proposed.

This solid-state image sensor is generally rectangular and has a relatively large diameter, although it depends on the number of pixels. Therefore, when this solid-state image sensor is placed inside the distal end component of the endoscope insertion section, an air/water channel and a forceps channel are formed in the axial direction within the distal end component, as well as illumination means and imaging optics. Because of the arrangement of the channels, etc., the diameter of the tip component inevitably has to be large (or the space for the channels etc. is restricted by the corners of the rectangular solid-state image sensor and cannot be moved sufficiently). There are problems like this.

For this reason, as disclosed in Japanese Patent Application Laid-open No. 58-46922, a mirror or the like is used to deflect the image and guide it to the decoy image plane of a solid-state image sensor placed parallel to the axis of the insertion section or tip. There is a conventional example.

However, even in this conventional example, since the light guiding member such as a mirror forming the image carrying means is disposed at the center of the tip, as described above, the illumination means (illumination optical system) or the forceps channel etc. There are problems such as the space for fish treatment becoming narrower, the lighting intensity becoming insufficient, and the number of treatment tools such as forceps that can be used being limited, making it difficult to fully perform fish treatment using treatment tools.

[Object of the Invention] The present invention has been made in view of these circumstances, and allows each element such as the forceps channel, air/water supply canal 2 illumination means, etc. to be efficiently operated without being restricted by the arrangement of the solid-state image sensor. The tip component can be placed in the inner axial direction,
It is an object of the present invention to provide an endoscope in which the diameter of the distal end component can be reduced.

[Summary of the Invention] In order to achieve the above object, an endoscope according to the present invention includes an imaging optical system and a solid-state imaging device disposed at the imaging position within the distal end component on the distal end side of the insertion section inserted into a body cavity. In an endoscope in which illumination means and channels are arranged in the axial direction of the outer periphery of the imaging/imaging system, the positive and
It is characterized in that the outer shape on the back surface side is formed into a circular or semicircular shape and arranged in a radial direction or an oblique direction.

[Embodiments of the invention] The present invention will be described in detail below with reference to the drawings.

1 and 2 relate to a first embodiment of the present invention, in which FIG. 1 is a cross-sectional view of the distal end component, and FIG. 2 is a cross-sectional view taken along the line A--A in FIG. 1. Further, FIG. 3 is a cross-sectional view of the tip component when a conventional rectangular solid-state image sensor is used, and is shown for comparison with the present invention.

In FIGS. 1 and 2, reference numeral 1 denotes a distal end assembly provided at the distal end of the endoscope insertion section, and this distal end (within the axially extending cylindrical frame 2 3H) is located at the distal end. ing. A saw glass 3 is disposed on the front surface of the frame 2, while an imaging optical system 4 and a solid body with a retraction surface located at the imaging position of the imaging optical system 4 are disposed inside the frame. An image sensor 5 is provided.

The solid MS element 5 is held by a cylindrical support member 6 made of an insulating material such as synthetic resin or ceramics, and is attached to the frame 2 via the support member 6. has a cylindrical protrusion 6a that protrudes backward from the back surface of the solid-state image sensor 5, and the necessary prints 1 to 61) of the solid-state image sensor 5 are formed on the inner periphery of this protrusion 6a, and the printed wiring 61 ] and each electrode of the solid-state image sensing device 5 are connected by solder A' (), while connecting heirs or pins 6C are extended from the printed wirings 6t and +.

Further, the solid-state imaging element 5 has a circular outer shape on its front and back sides, and is arranged eccentrically within the component 1. A light guide 7 as an illumination means, a forceps channel 8, an air/water supply channel 9, etc. are arranged in the axial direction within the crescent-shaped tip component on the outer periphery of the circular solid-state image sensor 5.

In this way, since the necessary wiring of the solid-state image sensor 5 is printed on the support member 6, the necessary wiring is easy, and it does not take up any area in the radial direction, contributing to a reduction in diameter. In addition, the solid-state imaging device 5 located inside the endoscope tip component 1 can be easily replaced.

In addition, since the solid-state image sensor 5 has a circular outer shape on the front and back sides, there are no corners compared to the square shape of the conventional example, and the arrangement of the light guide 7 and channels 8 and 9 can be made more efficient. . That is, FIG. 3 shows an example of the arrangement of light chi 1 to 7° channels 8 and 9 when the solid-state image sensor 5 is rectangular.
FIG. 1 13 shows examples of the arrangement of lines 1 to 7 and channels 8 and 9 when the solid-state imaging device 5 of the present invention has a circular shape, but in the case of a conventional rectangular shape, The parts get in the way, making efficient arrangement impossible. In addition, as in the present application, by making the outer shape of the front and back sides of the solid-state R image element 5 circular, a light guide 7, channels 8, 9, etc. are installed on the outer circumferential side of the solid-state imaging element 5. Can be arranged efficiently,
As a result, as shown in FIG. 2, it is possible to increase the diameter of the dividing channels, etc., where the corners of the conventional rectangular shape were obstructive, or to reduce the diameter of the tip end.

FIG. 4 is a cross-sectional view according to a second embodiment of the present invention. In this embodiment, a light kite 7 is disposed in a circumferential manner around the outer periphery of a circular solid-state dancing image element 5 to improve the C light distribution characteristic.

FIG. 5 is a cross-sectional view according to a third embodiment of the present invention. In this embodiment, the outer shape of the front and back sides of the solid-state image sensor 5 is semicircular.

FIG. 6 is a cross-sectional view according to a fourth embodiment, in which the back surface of the cylindrical support member G holding the solid-state image sensor 5 is covered almost flush with the back surface of the solid-state image sensor 5, and the radial thickness is is made thicker, and the wires 1 to 6 of the solid-state image sensor 5 are connected to this part.
It forms b.

FIG. 7 is a cross-sectional view of a fifth embodiment, in which a printed wiring 6b of a solid-state image pickup device 5 is formed on the tip end edge of a cylindrical support member 6 or (or on) its outer periphery.

In the present invention, in the above embodiment, the solid-state image sensor 5 is attached to the frame 2 via the support member 6, but this frame 2 may be omitted and the support member 6 may be directly attached to the tip component. Alternatively, the cylindrical frame 2 may be formed so that the imaging optical system 4 and the solid-state image sensor 5 are directly attached, and the frame 2 may be
A synthetic resin.

It is formed of an insulating material such as ceramics, and the solid-state image sensor 5 is placed on this frame 2 as necessary. 61.1
may be formed.

Furthermore, in the present invention, the circular or semicircular solid-state imaging device is arranged not only in the inner diameter direction of the tip component as in the embodiment, but also in an oblique direction. Further, as the illumination means, instead of the light guide, a light source such as a light emitting diode may be provided inside the tip component.

[Effect of the Invention 1] As explained above, according to the present invention, each element such as the forceps channel, air/water supply channel, and illumination means can be efficiently arranged on the inner shaft of the tip component without being restricted by the arrangement of the solid-state image sensor. This has the effect of allowing the distal end component to be arranged in a small diameter.

[Brief explanation of the drawing]

1 and 2 relate to the first embodiment of the present invention, FIG. 1 is a cross-sectional view of the tip component, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a conventional FIG. 4 is a cross-sectional view of the tip component of the second embodiment, and FIG. 5 is a cross-sectional view of the tip component of the third embodiment. FIG. 6 is a sectional view of the support member of the fourth embodiment, and FIG. 7 is a sectional view of the support member of the fifth embodiment. 1...Tip component 4...Imaging optical system 5...Solid-state imaging device 7...Lie-i-Kite 8.9...Channel Figure 4 Figure 6 Figure 5 Figure 7

Claims (1)

[Claims] An imaging optical system and a solid-state imaging device are arranged in the distal end component of the distal end of the insertion section inserted into a body cavity, etc., and an illumination means and channels are arranged in the axial direction of the outer circumferential side of these imaging/reflection imaging systems. In an endoscope in which the solid-state image pickup devices are arranged in a circular or semicircular shape on the front and back sides, and arranged in a radial direction or an oblique direction, the endoscope is particularly preferred.