JPS607750A - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS607750A
JPS607750A JP58115549A JP11554983A JPS607750A JP S607750 A JPS607750 A JP S607750A JP 58115549 A JP58115549 A JP 58115549A JP 11554983 A JP11554983 A JP 11554983A JP S607750 A JPS607750 A JP S607750A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
resin
type semiconductor
insulation type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58115549A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6350863B2 (index.php
Inventor
Mikio Hatakeyama
畠山　幹男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58115549A priority Critical patent/JPS607750A/ja
Publication of JPS607750A publication Critical patent/JPS607750A/ja
Publication of JPS6350863B2 publication Critical patent/JPS6350863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W70/461—
    • H10W72/0198—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58115549A 1983-06-27 1983-06-27 絶縁型半導体装置 Granted JPS607750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58115549A JPS607750A (ja) 1983-06-27 1983-06-27 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58115549A JPS607750A (ja) 1983-06-27 1983-06-27 絶縁型半導体装置

Publications (2)

Publication Number Publication Date
JPS607750A true JPS607750A (ja) 1985-01-16
JPS6350863B2 JPS6350863B2 (index.php) 1988-10-12

Family

ID=14665286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58115549A Granted JPS607750A (ja) 1983-06-27 1983-06-27 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS607750A (index.php)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269839A (ja) * 1986-06-20 1987-03-31 中塚　善造 両面模様経箔糸原反
JPS6269840A (ja) * 1986-06-20 1987-03-31 中塚　善造 両面模様経箔糸の製造法
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin
JPS6269839A (ja) * 1986-06-20 1987-03-31 中塚　善造 両面模様経箔糸原反
JPS6269840A (ja) * 1986-06-20 1987-03-31 中塚　善造 両面模様経箔糸の製造法

Also Published As

Publication number Publication date
JPS6350863B2 (index.php) 1988-10-12

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