JPS607485Y2 - 半導体素子の剥離装置 - Google Patents

半導体素子の剥離装置

Info

Publication number
JPS607485Y2
JPS607485Y2 JP14171479U JP14171479U JPS607485Y2 JP S607485 Y2 JPS607485 Y2 JP S607485Y2 JP 14171479 U JP14171479 U JP 14171479U JP 14171479 U JP14171479 U JP 14171479U JP S607485 Y2 JPS607485 Y2 JP S607485Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
sheet
push
vacuum suction
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14171479U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5658861U (https=
Inventor
勝 高坂
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP14171479U priority Critical patent/JPS607485Y2/ja
Publication of JPS5658861U publication Critical patent/JPS5658861U/ja
Application granted granted Critical
Publication of JPS607485Y2 publication Critical patent/JPS607485Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
JP14171479U 1979-10-12 1979-10-12 半導体素子の剥離装置 Expired JPS607485Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14171479U JPS607485Y2 (ja) 1979-10-12 1979-10-12 半導体素子の剥離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14171479U JPS607485Y2 (ja) 1979-10-12 1979-10-12 半導体素子の剥離装置

Publications (2)

Publication Number Publication Date
JPS5658861U JPS5658861U (https=) 1981-05-20
JPS607485Y2 true JPS607485Y2 (ja) 1985-03-13

Family

ID=29373033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14171479U Expired JPS607485Y2 (ja) 1979-10-12 1979-10-12 半導体素子の剥離装置

Country Status (1)

Country Link
JP (1) JPS607485Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7240422B2 (en) * 2004-05-11 2007-07-10 Asm Assembly Automation Ltd. Apparatus for semiconductor chip detachment

Also Published As

Publication number Publication date
JPS5658861U (https=) 1981-05-20

Similar Documents

Publication Publication Date Title
US6503130B2 (en) Protective film separator in semiconductor wafer grinding process
EP1178521A3 (en) Method and apparatus for processing composite member
JPH0837395A (ja) 半導体チップ供給装置および供給方法
JPS6271215A (ja) ウエハ接合装置
JPS607485Y2 (ja) 半導体素子の剥離装置
CN209076743U (zh) 一种药物研磨装置
TWI485786B (zh) Grain Stripping Method and Device
US20010002569A1 (en) Apparatus for cutting adhesive tape mounted on semiconductor wafer
CN112208880B (zh) 撕膜方法
JP4079679B2 (ja) 半導体ウエハの不要物除去方法およびその装置
JPH061771B2 (ja) ウエハ保護フイルムの切断方法
CN220333218U (zh) 窄边框贴膜离型纸撕除工装
JPS63136527A (ja) 半導体基板処理用粘着シ−ト
JPH0354858B2 (https=)
JP4041344B2 (ja) 脆質部材の転着装置
CN221935988U (zh) 一种壳盖零件钻孔工装
JPS61117064A (ja) 両面ポリシング装置
CN223097245U (zh) 一种薄玻璃片无印记涂胶用夹具
JPS607487Y2 (ja) ペレツト剥離装置
JPH01221225A (ja) 粘着シートの貼着方法
CN216671589U (zh) 用于芯片散热贴的取标机构
CN218836654U (zh) 一种用于无边框显示模组的拆卸机构
CN217641274U (zh) 一种用于吸附晶圆片的吸笔
CN222135007U (zh) 一种石英Dome辅助装夹取放工装
TWI262542B (en) Apparatus and method for separating dice