JPS6074445A - Manufacture of integrated circuit substrate - Google Patents
Manufacture of integrated circuit substrateInfo
- Publication number
- JPS6074445A JPS6074445A JP18189083A JP18189083A JPS6074445A JP S6074445 A JPS6074445 A JP S6074445A JP 18189083 A JP18189083 A JP 18189083A JP 18189083 A JP18189083 A JP 18189083A JP S6074445 A JPS6074445 A JP S6074445A
- Authority
- JP
- Japan
- Prior art keywords
- case
- integrated circuit
- clip
- circuit substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
＋ａ） 発明の技術分野
本発明は、例えばハイブリッド集積回路基板等の製造方
法に係り、とくに樹脂被覆形状を統一するとともに品質
を向上した集積回路基板の製造方法に関するものである
。[Detailed Description of the Invention] +a) Technical Field of the Invention The present invention relates to a method of manufacturing, for example, a hybrid integrated circuit board, etc., and particularly relates to a method of manufacturing an integrated circuit board in which the shape of the resin coating is unified and the quality is improved. be.
（ｂｌ 技術の背景
近年、電子機器等の小型化の要望が強く、このため印刷
配線板に搭載される電子部品例えばハイブリット集積回
路基板（以下ＨＩ Ｃ基板と略す）等も、樹脂被覆後の
形状および寸法の規制が余儀なくされている。(bl Technology background) In recent years, there has been a strong demand for miniaturization of electronic devices, etc., and for this reason, electronic components mounted on printed wiring boards, such as hybrid integrated circuit boards (hereinafter abbreviated as HI C boards), etc. and size regulations have been forced.
（Ｃ１従来技術の問題点
第１図は、従来のハイブリット集積回路基板の製造方法
を説明するための、（ａｌは斜視図、（ｈ）は要部拡大
図、（Ｃ）は流動浸漬槽の断面図、（ｄ）は樹脂封止後
の斜視図で、ｌはＨＴ Ｃ基板、２はり−１” ＆ｆも
１子、３はクリップビン、４は実装部品、５は流動浸漬
槽、６は樹脂粉末、７は樹脂被覆、 ＩＩはパターンで
ある。(C1 Problems with the Prior Art) Figure 1 is a diagram for explaining the conventional method of manufacturing a hybrid integrated circuit board. Cross-sectional view, (d) is a perspective view after resin sealing, l is the HT C board, 2 beams - 1"&f are also 1 piece, 3 is a clip bin, 4 is a mounted component, 5 is a fluidized immersion tank, 6 is a Resin powder, 7 is resin coating, and II is pattern.
ＨＩＣ基板１にリード醋１子２およびＩＩ Ｉ Ｃ姑板
１の表裏に設けられたパターン１１にクリップピン３を
接続したるのち、所定の実装部品４を搭載した）Ｉ Ｉ
Ｃ基板１を、樹脂粉末６の付着する温度に加熱して流
動浸漬槽５に浸漬ずれば、流動Ｙ琵漬槽５内で流動して
いる樹脂粉末６が、前記ＩＩ Ｉ Ｃ邦；板ｌに１１着
して熔かされ樹脂被覆７を形成するようになっている。After connecting the clip pins 3 to the patterns 11 provided on the front and back of the lead plate 1 and the II IC board 1 on the HIC board 1, predetermined mounting components 4 were mounted).
When the C substrate 1 is heated to a temperature at which the resin powder 6 adheres and is immersed in the fluidized dipping tank 5, the resin powder 6 flowing in the fluidized Y dipping tank 5 is heated to the temperature at which the resin powder 6 adheres. The resin coating 7 is formed by applying 11 layers to the resin coating 7 and melting them.
ところがこの流動浸漬による樹脂被ｒ７７１７は外形寸
法精度及び膜厚が一定でなく、しかも作業能率が悪いと
′いう問題点があった。However, the resin coating R7717 produced by fluid immersion had problems in that the external dimensional accuracy and film thickness were not constant, and work efficiency was poor.
ｌｄｌ 考案の目的
本発明は、上記従来の問題点に鑑み、樹脂封止用ケース
により外形寸法精度及び膜厚の統一を可能にした集積回
路基板の製造方法を提供することを目的とするものであ
る。ldl Purpose of the invention In view of the above-mentioned conventional problems, an object of the present invention is to provide a method for manufacturing an integrated circuit board that enables uniformity of external dimensional accuracy and film thickness using a resin sealing case. be.
＋８１ 発明の構成
前述の目的を達成するために本発明は、所定形状のケー
スの底に、集積回路基板に形成された表裏パターンに対
応する複数の孔を設け、該九に前記表裏パターンを接続
する複数のクリ・ノブビンを挿入した前記ケース内の、
前記クリ・ノブピンに前記集積回路基板の表裏パターン
部を圧入した状態で、前記ケース内に溶融した樹脂を流
入成形するようにしたことによって達成される。+81 Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a plurality of holes corresponding to the front and back patterns formed on the integrated circuit board at the bottom of a case having a predetermined shape, and connects the front and back patterns to the holes. in the case into which a plurality of chestnut knobbins are inserted;
This is achieved by pouring and molding molten resin into the case while the front and back pattern parts of the integrated circuit board are press-fitted into the chestnut knob pin.
（ｆ） 発明の実施例
以下図面を参照しながら本発明に係る集積回路基板の製
造方法の実施例について詳細に説明する。(f) Embodiments of the Invention Hereinafter, embodiments of the method for manufacturing an integrated circuit board according to the present invention will be described in detail with reference to the drawings.
第２図は、本発明に係る集積回路基板の製造方法の一実
施例を説明するための、（ａｌはケースの斜視図、（ｂ
）はＨＩＣ基板をケースに挿入する側面図。FIG. 2 is a perspective view of a case, (b is a perspective view of a case, and FIG. 2 is a perspective view of a case.
) is a side view of the HIC board inserted into the case.
（ｃｌはケース内に溶融樹脂を注入する側面図で、前回
と同等の部分については同一符号をイ」シており、８は
ケース、９は注入瓶、 １０ば溶融樹脂、旧はクリップ
ビン挿入孔である。(cl is a side view of injecting the molten resin into the case, and the same parts as the previous one are marked with the same numbers. 8 is the case, 9 is the injection bottle, 10 is the molten resin, and the old one is the clip bottle insertion. It is a hole.
金属からなるケース８の底面に複数のクリップビン挿入
孔８１を搾設し、該クリップビン挿入孔８Ｉにクリップ
ピン３を挿入した前記ケース８内に、ＨＩＣ基板基板リ
ード端７−２および実装部品４を搭載したＨＩＣ基板１
を、前記ケース８内に挿入するとともに、前記ＨＩＣ基
板１のパターン１１をクリップピン３に押し込んだ状態
で、前記ケースの中へ注入瓶９の溶融樹脂１０を注入し
て、前記溶融樹脂１０が固形化した時点で抜けば、ケー
ス８に規制された形状寸法のＨＩＣ基板が形成されるご
とになる。A plurality of clip bin insertion holes 81 are formed in the bottom surface of the case 8 made of metal, and the HIC board board lead ends 7-2 and the mounted components are inserted into the case 8 in which the clip pins 3 are inserted into the clip bin insertion holes 8I. HIC board 1 equipped with 4
is inserted into the case 8, and with the pattern 11 of the HIC board 1 pushed into the clip pin 3, the molten resin 10 in the injection bottle 9 is injected into the case, and the molten resin 10 is injected into the case. If it is removed once it is solidified, a HIC substrate with a shape and size regulated by the case 8 will be formed.
ｔｇ） 発明の効果
以上の説明から明らかなように、本発明に係る集積回路
基板の製造方法によれば、従来の粉体流動による樹脂被
覆にくらべて、形状寸法が統一されしかも樹脂被覆の品
質が向上するとともに、作業能率の向上に寄与するとこ
ろが大である。tg) Effects of the Invention As is clear from the above explanation, according to the method for manufacturing an integrated circuit board according to the present invention, compared to the conventional resin coating using powder flow, the shape and dimensions are unified, and the quality of the resin coating is improved. This greatly contributes to improving work efficiency.
第１図は、従来のハイブリッド集積回路基板の製造方法
を説明するための、（ａｌは斜視図、（ｂ）は要部拡大
図、（Ｃ）は流動浸漬槽の断面図、（ｄ）は樹脂封止後
の斜視図、第２図は、本発明に係る集積回路基板の製造
方法の一実施例を説明するための、（ａｌはケースの斜
視図、（ｂ）はＨＩＧ基板をケースに挿入する側面図、
（Ｃ）はケース内に溶融樹脂を注入する側面図である。
図において、１はＨＩＣ基板、２ばリード端子。
３はクリップピン、４は実装部品、５は流動浸漬槽、６
は樹脂粉末、７は樹脂被覆、８ばケース。
９は注入瓶、１０は溶融樹脂、１１はパターン、８１は
クリップビン挿入孔をそれぞれ示す。
第１１４
（ｒ−’１
第２図Figure 1 shows a conventional method for manufacturing a hybrid integrated circuit board (al is a perspective view, (b) is an enlarged view of main parts, (C) is a cross-sectional view of a fluidized immersion tank, and (d) is a FIG. 2 is a perspective view after resin sealing, for explaining an embodiment of the method for manufacturing an integrated circuit board according to the present invention. Side view to insert,
(C) is a side view of injecting molten resin into the case. In the figure, 1 is the HIC board, 2 is the lead terminal. 3 is a clip pin, 4 is a mounting component, 5 is a fluidized immersion tank, 6
is resin powder, 7 is resin coating, and 8 is case. 9 is an injection bottle, 10 is a molten resin, 11 is a pattern, and 81 is a clip bottle insertion hole. 114 (r-'1 Fig. 2
Claims (1)
裏パターンに対応する複数の孔を設け、線孔に前記表裏
パターンを接続する複数のクリップピンを挿入した前記
ケース内の、前記クリ・ノブビンに前記集積回路基板の
表裏パターン部を圧入した状態で、前記ケース内に溶融
した樹脂を流入成形するようにしたことを特徴とする集
積回路基板の製造方法。A plurality of holes corresponding to the front and back patterns formed on the integrated circuit board are provided at the bottom of the case having a predetermined shape, and a plurality of clip pins for connecting the front and back patterns are inserted into the wire holes. A method of manufacturing an integrated circuit board, characterized in that molten resin is poured into the case and molded with the front and back pattern parts of the integrated circuit board press-fitted into the knob bin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18189083A JPS6074445A (en) | 1983-09-29 | 1983-09-29 | Manufacture of integrated circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18189083A JPS6074445A (en) | 1983-09-29 | 1983-09-29 | Manufacture of integrated circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6074445A true JPS6074445A (en) | 1985-04-26 |
Family
ID=16108667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18189083A Pending JPS6074445A (en) | 1983-09-29 | 1983-09-29 | Manufacture of integrated circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6074445A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2191178B (en) * | 1986-05-30 | 1990-05-16 | Guala Angelo Spa | Pilfer-proof closure |
-
1983
- 1983-09-29 JP JP18189083A patent/JPS6074445A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2191178B (en) * | 1986-05-30 | 1990-05-16 | Guala Angelo Spa | Pilfer-proof closure |
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