JPS63141394A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS63141394A JPS63141394A JP28937686A JP28937686A JPS63141394A JP S63141394 A JPS63141394 A JP S63141394A JP 28937686 A JP28937686 A JP 28937686A JP 28937686 A JP28937686 A JP 28937686A JP S63141394 A JPS63141394 A JP S63141394A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- liquid resin
- case
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はケース入りの混成集積回路の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a cased hybrid integrated circuit.
第２図は従来の混成集積回路の製造方法の一例を示す断
面図である。FIG. 2 is a cross-sectional view showing an example of a conventional method for manufacturing a hybrid integrated circuit.
従来、この種の混成集積回路の製造方法は、第２図に示
すように、プラスチック製ケース１４内に厚膜基板１１
と電子部品１２とクリップ端子１３とから成る混成集積
回路を挿入した後、液状樹脂１５を所定の位置まで注入
し、加熱硬化させるようになっていた。Conventionally, a method for manufacturing this type of hybrid integrated circuit has been to place a thick film substrate 11 in a plastic case 14, as shown in FIG.
After inserting a hybrid integrated circuit consisting of an electronic component 12 and a clip terminal 13, liquid resin 15 is injected to a predetermined position and cured by heating.
上述した従来の混成集積回路の製造方法によれば、液状
樹脂がケースいっばいに充填されるようになるので、重
量が重くなって混成集積回路の軽量化が図れず、また資
材費が高くつく等という欠点がある。According to the conventional method of manufacturing a hybrid integrated circuit described above, the liquid resin is filled all over the case, which increases the weight, making it impossible to reduce the weight of the hybrid integrated circuit, and increasing material costs. There are drawbacks such as.
本発明の混成集積回路の製造方法は、底部に流出孔を有
するケースを用い、電子部品を搭載した厚膜基板を前記
ケース内に挿入する工程と、前記ケース内の前記厚膜基
板に液状樹脂を吹き付ける工程と、前記液状樹脂が前記
流出孔からほぼ流出した時点で前記流出孔を一時的に塞
いで前記厚膜基板に残った前記液状樹脂を加熱硬化させ
る工程とを含んでいる。The method for manufacturing a hybrid integrated circuit according to the present invention uses a case having an outflow hole at the bottom, and includes a step of inserting a thick film substrate carrying electronic components into the case, and applying a liquid resin to the thick film substrate in the case. and a step of temporarily closing the outflow hole when the liquid resin has almost flowed out of the outflow hole and heating and hardening the liquid resin remaining on the thick film substrate.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ＞ないしくｄ）は本発明の一実施例を製造工
程順に示す断面図である。FIG. 1 (a> to d) are cross-sectional views showing an embodiment of the present invention in the order of manufacturing steps.
まず第１図（ａ＞に示すように、厚膜基板１と電子部品
２とクリップ端子３とから成る混成集積回路を、底面に
流出孔４３を有する孔付きプラスチック製ケース４に挿
入する。次に第１図（ｂ）に示すように、液状樹脂５を
樹脂噴出ノズル６により厚膜基板１に吹き付ける。そう
することにより、余分な液状樹脂５は流出孔４ａから流
れ出してくる。このとき流出孔４３の下方にガイド板８
を設置しておけば、液状樹脂５はスムーズに外部に排出
される。そこで液状樹脂５がほぼ外部に流出し終った時
点で、第１図（ｃ）に示すように、流出孔４３の所に押
え板７をあてがって乾燥炉の中に入れ、液状樹脂５を加
熱し硬化させる。その後、押え板７を取りはずすと、第
１図（ｄ）に示すように、流出孔４３が硬化した液状樹
脂５によ−）て塞がれ、本実施例の混成集積回路の製造
が終了する。First, as shown in FIG. 1 (a), a hybrid integrated circuit consisting of a thick film substrate 1, an electronic component 2, and a clip terminal 3 is inserted into a perforated plastic case 4 having an outflow hole 43 on the bottom surface. As shown in FIG. 1(b), the liquid resin 5 is sprayed onto the thick film substrate 1 by the resin jetting nozzle 6. By doing so, the excess liquid resin 5 flows out from the outflow hole 4a. A guide plate 8 is placed below the hole 43.
If this is installed, the liquid resin 5 can be smoothly discharged to the outside. When the liquid resin 5 has almost completely flowed out, a presser plate 7 is placed on the outflow hole 43 and the liquid resin 5 is heated in a drying oven, as shown in FIG. 1(c). and harden. Thereafter, when the holding plate 7 is removed, the outflow hole 43 is closed with the hardened liquid resin 5, as shown in FIG. 1(d), and the manufacturing of the hybrid integrated circuit of this embodiment is completed. .
１″発明の効果〕
以上説明したように本発明は、底部に孔をあけたケース
を用い、混成集積回路のコーティング工程終了時にこの
孔が硬化樹脂によって塞がれることにより、重量が軽く
て且つ工数低減が可能なケース入りの混成集積回路を得
ることができる効果がある。1" Effects of the Invention] As explained above, the present invention uses a case with a hole in the bottom, and this hole is closed with a cured resin at the end of the coating process of a hybrid integrated circuit, thereby reducing weight and This has the effect of making it possible to obtain a case-encased hybrid integrated circuit that can reduce the number of man-hours.
第１図（ａ）ないしくｄ）は本発明の一実施例を製造工
程順に示す断面図、第２図は従来の混成集積回路の製造
方法の一例を示す断面図である。
１．１１・・・厚膜基板、２．１２・・・電子部品、３
゜１３・・・クリップ端子、４・・・孔付きプラスチッ
ク製ケース、４３・・・流出孔、５．１５・・・液状樹
脂、６・・・樹脂噴出ノズル、７・・・押え板、８・・
・ガイド板、１４・・・プラスチック製ケース。
躬１図FIGS. 1(a) to d) are cross-sectional views showing an embodiment of the present invention in the order of manufacturing steps, and FIG. 2 is a cross-sectional view showing an example of a conventional method for manufacturing a hybrid integrated circuit. 1.11...Thick film substrate, 2.12...Electronic component, 3
゜13... Clip terminal, 4... Plastic case with hole, 43... Outflow hole, 5.15... Liquid resin, 6... Resin jet nozzle, 7... Holding plate, 8・・・
・Guide plate, 14...Plastic case. Figure 1
Claims (1)
した厚膜基板を前記ケース内に挿入する工程と、前記ケ
ース内の前記厚膜基板に液状樹脂を吹き付ける工程と、
前記液状樹脂が前記流出孔からほぼ流出した時点で前記
流出孔を一時的に塞いで前記厚膜基板に残つた前記液状
樹脂を加熱硬化させる工程とを含むことを特徴とする混
成集積回路の製造方法。using a case having an outflow hole at the bottom, inserting a thick film board carrying electronic components into the case; spraying liquid resin onto the thick film board in the case;
Manufacturing a hybrid integrated circuit characterized by comprising the step of temporarily closing the outflow hole when the liquid resin has almost flowed out from the outflow hole and heating and curing the liquid resin remaining on the thick film substrate. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28937686A JPS63141394A (en) | 1986-12-03 | 1986-12-03 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28937686A JPS63141394A (en) | 1986-12-03 | 1986-12-03 | Manufacture of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63141394A true JPS63141394A (en) | 1988-06-13 |
Family
ID=17742407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28937686A Pending JPS63141394A (en) | 1986-12-03 | 1986-12-03 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63141394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115746A (en) * | 2005-10-18 | 2007-05-10 | Jtekt Corp | Coating agent applying method and electronic controller |
-
1986
- 1986-12-03 JP JP28937686A patent/JPS63141394A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115746A (en) * | 2005-10-18 | 2007-05-10 | Jtekt Corp | Coating agent applying method and electronic controller |
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