JPS6073293U

JPS6073293U - Electronic component mounting structure

Info

Publication number: JPS6073293U
Application number: JP16405783U
Authority: JP
Inventors: 博友伊藤; 宇敷　進; 藤川　和男
Original assignee: 沖電気工業株式会社
Priority date: 1983-10-25
Filing date: 1983-10-25
Publication date: 1985-05-23

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は従来の電子部品の実装構造を示す斜視図、第２
図はその拡大側面図、第３図は本考案による電子部品の
実装構造の一実施例を示す斜視図、第４図はその拡大側
断面図、第５図は本考案における電子部品位置決めのた
めの構造の一例を示す一部分の正面図、第６図はその側
面図、第７゜図は電子部品位置決めのための構造の他の
実施例を示す斜視図である。１・・・電子部品、１ａ・・・取付面部、１ｂ・・・封
止部、３・・・絶縁シート、６・・・第１のヒートシン
ク、６ａ・・・本体、６ｂ・・・フィン、６ｃ・・・溝
、６ｄ・・・突条部、７・・・第２のヒートシンク、７
ａ・・・垂直部、７ｂ・・・水平部、７ｃ・・・突起、
７ｄ・・・角穴、７ｅ・・・　−舌片、８・・・タップ
タイトネジ。Figure 1 is a perspective view showing a conventional electronic component mounting structure;
The figure is an enlarged side view, FIG. 3 is a perspective view showing one embodiment of the electronic component mounting structure according to the present invention, FIG. 4 is an enlarged side sectional view thereof, and FIG. 6 is a side view thereof, and FIG. 7 is a perspective view showing another embodiment of the structure for positioning electronic components. DESCRIPTION OF SYMBOLS 1... Electronic component, 1a... Mounting surface part, 1b... Sealing part, 3... Insulating sheet, 6... First heat sink, 6a... Main body, 6b... Fin, 6c...Groove, 6d...Protrusion portion, 7...Second heat sink, 7
a...Vertical part, 7b...Horizontal part, 7c...Protrusion,
7d...square hole, 7e...-tongue piece, 8...tap tight screw.

Claims

[Scope of utility model registration request]

In a structure in which a plurality of electronic components are mounted in parallel on a heat sink, the main body has a flat component mounting surface that contacts the electronic components via an insulating sheet, and the main body has a fin extending in the longitudinal direction on the upper part of the main body. A tap in which an electronic component is inserted between the first heat sink and a second heat sink consisting of a vertical part that presses the electronic component and a horizontal part whose tip abuts a part of the first heat sink, and the electronic component is passed through the second heat sink. An electronic component mounting structure characterized in that a tight screw is screwed into a first heat sink and an electronic component is held between both heat sinks.