JPS6053743B2 - Partial non-plating method in hot-dip plating - Google Patents
Partial non-plating method in hot-dip platingInfo
- Publication number
- JPS6053743B2 JPS6053743B2 JP55137931A JP13793180A JPS6053743B2 JP S6053743 B2 JPS6053743 B2 JP S6053743B2 JP 55137931 A JP55137931 A JP 55137931A JP 13793180 A JP13793180 A JP 13793180A JP S6053743 B2 JPS6053743 B2 JP S6053743B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- hot
- treatment
- plated surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims description 24
- 238000011282 treatment Methods 0.000 claims description 12
- 235000019353 potassium silicate Nutrition 0.000 claims description 7
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-YPZZEJLDSA-N carbon-10 atom Chemical compound [10C] OKTJSMMVPCPJKN-YPZZEJLDSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
- C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Description
【発明の詳細な説明】
この発明は溶融メッキ作業に於て被メッキ材に必要な
非メッキ面を形成するため予め該部面に従来と異る物理
的（桜械的）処置を含ましめて非メッキ処理を施さんと
することに関するものである。[Detailed Description of the Invention] In order to form the necessary non-plated surface of the material to be plated during hot-dip plating work, the present invention includes a physical treatment (mechanical) that is different from the conventional method on the surface of the material to be plated. This relates to applying plating treatment.
従来一般に水ガラスを主成分として不鍍金処理材を当該
箇所に前以て塗布していたが、係る処理材に於ては完全
乾燥に時間を要し、しかも乾燥が不充分な場合は溶融金
属が付着し、後処理が極めて煩雑であつた。それ故水ガ
ラスを使用しない方法として、（１）シリコン樹脂３０
−４０％、炭素１０％、キシレン、トルエン系揮発性溶
剤１０−２０％、残りを二酸化珪又は／及び酸化鉄とし
た成分並びに組成配分を有する溶融メッキに於ける不鍍
金処理剤が公知であり、又（２）溶融メッキにおいて、
鋼板の不メッキとする部位にシリコン樹脂に金属酸化物
、金属水酸化物、金属窒化物、炭化物、炭酸塩、リン酸
塩、珪素塩を単独又は複合添加したものを塗布し、次い
で前処理炉に導入し焼付してメッキすることを特徴とす
る溶融メッキにおける部分メッキ方法等が知られている
。Conventionally, an unplated material containing water glass as the main component was applied to the area in advance, but such treated material requires time to completely dry, and if drying is insufficient, molten metal may be applied. was attached, and the post-processing was extremely complicated. Therefore, as a method that does not use water glass, (1) silicone resin 30
-40%, carbon 10%, xylene, toluene-based volatile solvent 10-20%, and the remainder silicon dioxide or/and iron oxide. , and (2) in hot-dip plating,
A silicone resin containing metal oxides, metal hydroxides, metal nitrides, carbides, carbonates, phosphates, and silicon salts added singly or in combination is applied to the parts of the steel sheet that are not to be plated, and then heated in a pretreatment furnace. A partial plating method in hot-dip plating is known, which is characterized by introducing the hot-dip plating into a hot-dip plating layer, baking it, and plating.
以上（１）、（２）に例示のように水ガラスの使用は処
理上或は効果上の欠点のために使用を排除されて他の化
学的処理を俟たねばならない現状である。そこでこの発
明は水ガラスを非メッキ面の下層に塗布した材料の上層
材として塗布し水ガラスを硬化することによりこの二層
の材料を固定しかつ非メッキ面の完全な被メッキ材とす
ることに成功し、これを溶融メッキ剤に浸漬してメッキ
面と非メッキ面を劃然とさせることが出来るようにした
ものである。以下図面に基づいてその構成を説明する。
被メッキ材７の非メッキ面３の表面に砥の紛、黒鉛、又
は蝋石紛等の単独又はこれらの混合物１を適当の厚さで
一様に塗布し、又その上に水、ガラス及びシリコン樹脂
又はこれらを主成分とする処理材２を適宜の厚さで重ね
塗りし斯くして上記上層処理材２の硬化処理を施した後
その上記処理材２の両端又は全面に押し板５を載置し、
該押し板５を止め金６又は磁石板によつて固定し非メッ
キ面３の、前記処理材２を固定するようにしたものであ
る。斯くして非メッキ面３の処理材２を前記せる如く硬
化処理を施した後で溶融メッキ剤に非メッキ面３とメッ
キ面４よりなる被メッキ材７を浸漬しメッキ面４のみメ
ッキして取出せべ非メッキ面３は、前記止め金６によつ
て固定された押し金５を取外せば、他の物すなわち処理
材２並に塗布混合物３は上下二層共容易に剥離され非メ
ッキ面３は完全な地肌で残り目的は簡単に達成される。
この処置は深い凹面部などの部分分にも実施可能であり
、又剥離作業のため非メッキ面３を傷付けずに済ますこ
とが出来る。以上述べた様にこの発明は極めて簡単な方
法で非メッキ面を完全に保護する事が出来使用する材料
等も簡易な物て、又操作も極めて容易でありメッキ作業
に多大な効果がある。As exemplified in (1) and (2) above, the current situation is that the use of water glass is excluded due to drawbacks in processing or effectiveness, and other chemical treatments must be carried out. Therefore, the present invention is to apply water glass as the upper layer material of the material coated on the lower layer of the non-plated surface and harden the water glass to fix these two layers of material and make it a complete material to be plated on the non-plated surface. This was successfully immersed in a hot-dip plating agent to make the plated and non-plated surfaces look stunning. The configuration will be explained below based on the drawings.
On the surface of the non-plated surface 3 of the material to be plated 7, abrasive powder, graphite, or wax powder, etc., alone or in a mixture 1, are uniformly applied to an appropriate thickness, and water, glass, and silicon are applied on the surface of the material 7 to be plated. After applying a resin or a treatment material 2 mainly composed of resin or resin to an appropriate thickness and curing the upper layer treatment material 2, a push plate 5 is placed on both ends or the entire surface of the treatment material 2. Place,
The push plate 5 is fixed by a stopper 6 or a magnet plate, and the treated material 2 on the non-plated surface 3 is fixed. After the treated material 2 on the non-plated surface 3 is hardened as described above, the material 7 to be plated consisting of the non-plated surface 3 and the plated surface 4 is immersed in a hot-dip plating agent, and only the plated surface 4 is plated. The non-plated surface 3 that can be taken out can be removed by removing the pusher 5 fixed by the stopper 6, and the other objects, that is, the treated material 2 as well as the coating mixture 3, can be easily peeled off in both upper and lower layers, leaving the non-plated surface 3. 3 is a perfect background and the remaining objectives are easily achieved.
This treatment can be carried out even in areas such as deep concavities, and the non-plated surface 3 can be avoided without being damaged due to the peeling operation. As described above, the present invention can completely protect non-plated surfaces using an extremely simple method, uses simple materials, and is extremely easy to operate, which has a great effect on plating work.
第１図及ひ第２図はこの発明の態様を示す側面図である
。
１・・・・・・砥の紛、黒鉛又は蝋石紛等の単独又はこ
れらの混合物、２・・・・・・水ガラス及びシリコン樹
脂又はこれらを主成分とする処理材、３・・・・・・非
メッキ面、４・・・・・・メッキ面、５・・・・・・押
え板（金）、６・・・・・・止め金（磁石板）、７・・
・・・・メッキ材。1 and 2 are side views showing aspects of the invention. 1... Abrasive powder, graphite or Rouseki powder, etc. alone or a mixture thereof, 2... Water glass and silicone resin, or a treatment material containing these as main components, 3... ...Non-plated surface, 4...Plated surface, 5...Press plate (gold), 6...Stop plate (magnetic plate), 7...
...Plating material.
Claims (1)
、又は蝋石紛等の単独又はこれらの混合物１を適当の厚
さで一様に塗布し、又その上に水ガラス又はシリコン樹
脂又はこれらを主成分とする処理材２を適宜の厚さで重
ね塗りし、斯くして上記上層処理剤２の硬化処理後、処
理材２の両端又は全面に押し板５を載置し、該押し板５
を止め金６又は磁石板によつて固定し非メッキ面３の、
前記処理材２を固定するようにした溶融メッキに於ける
部分非メッキ処理法。1. On the surface of the non-plated surface 3 of the material to be plated 7, abrasive powder, graphite, or wax powder, etc., alone or in a mixture 1, are uniformly applied to an appropriate thickness, and water glass or silicon is applied on top of it. Resin or a treatment material 2 mainly composed of these is coated in an appropriate thickness, and after the upper layer treatment agent 2 is cured, a push plate 5 is placed on both ends or the entire surface of the treatment material 2, The push plate 5
of the non-plated surface 3 by fixing it with a stopper 6 or a magnetic plate.
A partial non-plating treatment method in hot-dip plating in which the treated material 2 is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55137931A JPS6053743B2 (en) | 1980-09-30 | 1980-09-30 | Partial non-plating method in hot-dip plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55137931A JPS6053743B2 (en) | 1980-09-30 | 1980-09-30 | Partial non-plating method in hot-dip plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5763672A JPS5763672A (en) | 1982-04-17 |
| JPS6053743B2 true JPS6053743B2 (en) | 1985-11-27 |
Family
ID=15210028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55137931A Expired JPS6053743B2 (en) | 1980-09-30 | 1980-09-30 | Partial non-plating method in hot-dip plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053743B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101182051B1 (en) * | 2010-05-17 | 2012-09-11 | 동부제철 주식회사 | Method for producing of one side hot-dip plated steel sheet |
| CN109680231A (en) * | 2019-01-25 | 2019-04-26 | 中海油能源发展股份有限公司 | A kind of pipeline hot galvanizing flange sealing surface partition method |
-
1980
- 1980-09-30 JP JP55137931A patent/JPS6053743B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5763672A (en) | 1982-04-17 |
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