JPS6053469B2 - 高電力半導体素子装置 - Google Patents

高電力半導体素子装置

Info

Publication number
JPS6053469B2
JPS6053469B2 JP52079777A JP7977777A JPS6053469B2 JP S6053469 B2 JPS6053469 B2 JP S6053469B2 JP 52079777 A JP52079777 A JP 52079777A JP 7977777 A JP7977777 A JP 7977777A JP S6053469 B2 JPS6053469 B2 JP S6053469B2
Authority
JP
Japan
Prior art keywords
power semiconductor
high power
casing
explosion
arc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52079777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5353963A (en
Inventor
パトリツク・ド・ブリユ−ン
ルツツ・ニ−マイヤ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
Original Assignee
BBC BROWN BOVERI and CIE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE filed Critical BBC BROWN BOVERI and CIE
Publication of JPS5353963A publication Critical patent/JPS5353963A/ja
Publication of JPS6053469B2 publication Critical patent/JPS6053469B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings

Landscapes

  • Die Bonding (AREA)
  • Fuses (AREA)
  • Thyristors (AREA)
JP52079777A 1976-10-27 1977-07-04 高電力半導体素子装置 Expired JPS6053469B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH13521/76 1976-10-27
CH1352176A CH601917A5 (enExample) 1976-10-27 1976-10-27

Publications (2)

Publication Number Publication Date
JPS5353963A JPS5353963A (en) 1978-05-16
JPS6053469B2 true JPS6053469B2 (ja) 1985-11-26

Family

ID=4393129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52079777A Expired JPS6053469B2 (ja) 1976-10-27 1977-07-04 高電力半導体素子装置

Country Status (6)

Country Link
US (1) US4162514A (enExample)
JP (1) JPS6053469B2 (enExample)
CH (1) CH601917A5 (enExample)
DE (2) DE2652348A1 (enExample)
FR (1) FR2369773A1 (enExample)
GB (1) GB1552876A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563761U (ja) * 1992-02-12 1993-08-24 株式会社イチグチ 研磨具

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
JPS5750008Y2 (enExample) * 1978-04-22 1982-11-02
JPS54151337A (en) * 1978-05-09 1979-11-28 Fujitsu Ltd Data collector unit
CH630490A5 (de) 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
DE2915862C2 (de) * 1979-04-19 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenförmigem Gehäuse
JPS5635443A (en) * 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
JPS59215627A (ja) * 1983-05-23 1984-12-05 三菱電機株式会社 開閉器
JPS60100439A (ja) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp 樹脂封止形半導体装置
US4931906A (en) * 1988-03-25 1990-06-05 Unitrode Corporation Hermetically sealed, surface mountable component and carrier for semiconductor devices
DE3941041A1 (de) * 1989-07-31 1991-02-07 Siemens Ag Anordnung mit einem halbleiterbauelement
DE8909244U1 (de) * 1989-07-31 1989-09-21 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement
DE9114268U1 (de) * 1991-11-15 1992-01-09 Siemens AG, 8000 München Hochspannungs-Isolierscheibe
DE19534607C2 (de) * 1995-09-18 2002-02-07 Eupec Gmbh & Co Kg Gehäuse mit Leistungs-Halbleiterbauelementen
DE19839422A1 (de) * 1998-08-29 2000-03-02 Asea Brown Boveri Explosionsschutz für Halbleitermodule
DE10306767A1 (de) 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
DE112006004135A5 (de) * 2006-09-14 2009-08-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leistungshalbleitermodul für die Energieverteilung mit Explosionsschutz
CN101512757A (zh) 2006-09-14 2009-08-19 西门子公司 具有爆炸保护的功率半导体模块
WO2011018106A1 (en) * 2009-08-11 2011-02-17 Abb Research Ltd. Gateway device and communication system in a process control system
WO2012175112A1 (en) * 2011-06-21 2012-12-27 Abb Technology Ag Power semiconductor housing with contact mechanism
WO2015172956A1 (en) * 2014-05-14 2015-11-19 Abb Technology Ag Power semiconductor device
DE102016202734A1 (de) * 2016-02-23 2017-08-24 Siemens Aktiengesellschaft Elektrische Einrichtung mit elektrischen Modulen
US11972991B2 (en) * 2019-02-01 2024-04-30 Mitsubishi Electric Corporation Semiconductor device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA484965A (en) * 1947-03-20 1952-07-15 J. Berberich Leo Circuit interrupters embodying polytetrafluoroethylene
US2883574A (en) * 1958-04-07 1959-04-21 Ralph R Pittman Lightning arrester
US3230411A (en) * 1963-04-01 1966-01-18 Gen Electric Low voltage protective gaps provided with arc running surfaces for circulating arcs
US3274458A (en) * 1964-04-02 1966-09-20 Int Rectifier Corp Extremely high voltage silicon device
US3415963A (en) * 1964-05-15 1968-12-10 Dow Chemical Co Ethyl cellulose composition for use in arc extinguishing apparatus
GB1277201A (en) * 1968-05-24 1972-06-07 English Electric Co Ltd Improvements in semi-conductor components
US3581160A (en) * 1968-12-23 1971-05-25 Gen Electric Semiconductor rectifier assembly having high explosion rating
US3632926A (en) * 1970-04-20 1972-01-04 Gen Electric Current-limiting circuit breaker having arc extinguishing means which includes improved arc initiation and extinguishing chamber construction
US3885243A (en) * 1971-06-25 1975-05-20 Bbc Brown Boveri & Cie Semiconductor device
LU66762A1 (enExample) * 1972-04-27 1973-03-15
DE2364728A1 (de) * 1973-12-27 1975-07-03 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563761U (ja) * 1992-02-12 1993-08-24 株式会社イチグチ 研磨具

Also Published As

Publication number Publication date
JPS5353963A (en) 1978-05-16
FR2369773B1 (enExample) 1983-11-04
GB1552876A (en) 1979-09-19
US4162514A (en) 1979-07-24
CH601917A5 (enExample) 1978-07-14
DE2652348A1 (de) 1978-05-03
FR2369773A1 (fr) 1978-05-26
DE2652348C2 (enExample) 1990-03-08
DE2661120C2 (enExample) 1990-07-12

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