GB1277201A - Improvements in semi-conductor components - Google Patents

Improvements in semi-conductor components

Info

Publication number
GB1277201A
GB1277201A GB2490268A GB2490268A GB1277201A GB 1277201 A GB1277201 A GB 1277201A GB 2490268 A GB2490268 A GB 2490268A GB 2490268 A GB2490268 A GB 2490268A GB 1277201 A GB1277201 A GB 1277201A
Authority
GB
United Kingdom
Prior art keywords
members
semi
wafer
conductor
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2490268A
Inventor
John Duncan Mccoll
Royston Alfred Hammond
John James Laurence Weaver
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Co Ltd
Original Assignee
English Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Co Ltd filed Critical English Electric Co Ltd
Priority to GB2490268A priority Critical patent/GB1277201A/en
Publication of GB1277201A publication Critical patent/GB1277201A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

1277201 Semi-conductor devices ENGLISH ELECTRIC CO Ltd 12 Aug 1969 [24 May 1968] 24902/68 Heading H1K A semi-conductor wafer is sandwiched between two massive thermally conductive members by means of a cap secured to one member and embracing and applying spring pressure to the other member, the two members being joined by a hermetically sealed insulating envelope and the two members having cross-sections not substantially less than that of the wafer throughout their extent within the sealed envelope. As shown, Fig. 1, an SCR comprises a wafer 1 resting on a copper cathode contact member 2 and having its upper face contacted by a second copper contact member 3 having a bore for an insulated gate contact electrode 4. The members 2, 3 are urged towards one another by means of belleville-type spring washers 8 and a metal cap 11 which screws on to a ring 12 brazed to member 2. The cap 11 is insulated by means of ceramic caps 9, 13. The envelope comprises a ceramic ring 15 joined to the members 2, 3 by discs 17, 18; 6, 16 which are soldered to respective members and ring as appropriate and then joined by welding at 19 and 20. Large area heat sinks 22 may be soldered or shrunk on to the members 2, 3. In a modification, Figs. 2 and 3 (not shown), the spring washers are omitted and the metal cap (23) has circumferential slots to increase its resilience so that it forms a spring. The semi-conductor device may be a diode instead of an SCR and the metal cap may be crimped on to the lower body. The contact members 2, 3 may be provided with rims or pips to locate the semi-conductor wafer. Reference has been directed by the Comptroller to Specification 992,472.
GB2490268A 1968-05-24 1968-05-24 Improvements in semi-conductor components Expired GB1277201A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2490268A GB1277201A (en) 1968-05-24 1968-05-24 Improvements in semi-conductor components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2490268A GB1277201A (en) 1968-05-24 1968-05-24 Improvements in semi-conductor components

Publications (1)

Publication Number Publication Date
GB1277201A true GB1277201A (en) 1972-06-07

Family

ID=10219070

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2490268A Expired GB1277201A (en) 1968-05-24 1968-05-24 Improvements in semi-conductor components

Country Status (1)

Country Link
GB (1) GB1277201A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2652348A1 (en) * 1976-10-27 1978-05-03 Bbc Brown Boveri & Cie ARRANGEMENT FOR HIGH-PERFORMANCE SEMICONDUCTOR COMPONENTS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2652348A1 (en) * 1976-10-27 1978-05-03 Bbc Brown Boveri & Cie ARRANGEMENT FOR HIGH-PERFORMANCE SEMICONDUCTOR COMPONENTS

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees