JPS6052582A - Nozzle spray type etching machine - Google Patents

Nozzle spray type etching machine

Info

Publication number
JPS6052582A
JPS6052582A JP16070783A JP16070783A JPS6052582A JP S6052582 A JPS6052582 A JP S6052582A JP 16070783 A JP16070783 A JP 16070783A JP 16070783 A JP16070783 A JP 16070783A JP S6052582 A JPS6052582 A JP S6052582A
Authority
JP
Japan
Prior art keywords
nozzle
speed
etching
etched
swinging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16070783A
Other languages
Japanese (ja)
Inventor
Toshihiko Kobayashi
俊彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANRITSU KOGYO KK
Original Assignee
SANRITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SANRITSU KOGYO KK filed Critical SANRITSU KOGYO KK
Priority to JP16070783A priority Critical patent/JPS6052582A/en
Publication of JPS6052582A publication Critical patent/JPS6052582A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068Apparatus for etching printed circuits

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To improve the accuracy of etched parts by properly setting the period of swinging of a nozzle for spraying an etching soln. and by making the speed of transfer of parts to be etched coincide with the peripheral speed of a sprayed etching soln. CONSTITUTION:A nozzle 1 for spraying an etching soln. while carrying out swinging in a direction perpendicular to the direction of transfer of parts 3 to be etched is provided with a variable speed motor capable of regulating the speed of swinging to set the period of swinging of the nozzle 1 at about 0-60Hz. The speed of transfer of the parts 3 is made to coincide with the peripheral speed of at etching soln. sprayed from the nozzle 1. By this mechanism, high density printed boards can be etched to form patterns of a uniform width.

Description

【発明の詳細な説明】 本発明は、エツチング部品の搬送速度にノズルの揺動速
度を同速度に設定可能な機能を持つ、ノズル噴射式エツ
チングマシンに関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nozzle injection type etching machine which has a function of setting the swing speed of the nozzle to the same speed as the transport speed of the etched part.

一般的ニノズル噴射式エツチングマシンは、第1図、第
2図に示す如く、エツチング液を製品の搬送方向と直角
方向に揺動させながら噴射するノズル1と、加工部品を
搬送する搬送ローラ2で構−】− 成され、加工部品3はこの中を搬送ローラで搬送する間
にエツチング加工がなされる。
As shown in Figures 1 and 2, a general two-nozzle spray etching machine has a nozzle 1 that sprays the etching liquid while swinging it in a direction perpendicular to the transport direction of the product, and a transport roller 2 that transports the processed parts. The etching process is performed while the workpiece 3 is conveyed therein by a conveyance roller.

従来のノズル噴射式エツチングマシンは、加工部品の搬
送速度に対し揺動速度が速く、加工部品の材質に応じて
の搬送速度は可変であるが、ノズルの揺動速度の可変、
又は調整は不可変であった。
In conventional nozzle injection etching machines, the swing speed is faster than the transport speed of the processed parts, and the transport speed is variable depending on the material of the processed parts.
or the adjustment was unchanged.

このような機能のノズル噴射式エツチングマシンでエツ
チング加工を行なった場合、加工部品の搬送方向とそれ
に直角な方向とでエツチング穴の大きさが異なる。この
例として第3図は回転スリット板のエツチング加工品で
ある。Y−Ylはエツチング時のスリット板の搬送方向
、X−X+はノズルの揺動方向である。この場合、スリ
ット板の穴の大きさはY −X1方向のスリット穴Aと
比較し、これに直角なX −X1方向のスリット穴Bの
方が、材質・板厚によって差はあるものの、IOμ程度
小さくなる。このことは従来において、エツチングの能
力的限界としてやむを得ない現象とされて来た為、高精
度部品エツチング加工は困難であった。
When etching is performed using a nozzle injection type etching machine having such a function, the size of the etching hole differs between the conveyance direction of the processed part and the direction perpendicular to the conveyance direction. As an example of this, FIG. 3 shows an etched product of a rotary slit plate. Y-Yl is the conveyance direction of the slit plate during etching, and X-X+ is the nozzle swing direction. In this case, the size of the hole in the slit plate is IOμ The degree becomes smaller. In the past, this phenomenon was considered to be an unavoidable limit of etching capability, making it difficult to perform high-precision part etching.

本発明は、かかる欠点を除去したもので、その2− 目的は、ノズル噴射式エツチングマシンの改良により、
エツチング加工部品の精度向上を提供するものである。
The present invention eliminates such drawbacks, and its second purpose is to improve the nozzle injection type etching machine.
This provides improved accuracy of etched parts.

以下実施例に基づいて、本発明の詳細な説明する。第1
図におじで、エツチング液を製品の搬送方向と直角方向
に揺動しながら噴射するノズル1に揺動速度調整が可能
な可変速モーコー(図示していない〕を使用し、ノズル
の揺動周期は0〜60Hzの範囲で設定して、加工部品
の搬送速度とノズルより噴射されるスプレーの周速度の
合わせを可能にする。
The present invention will be described in detail below based on Examples. 1st
As shown in the figure, a variable speed mokko (not shown) that can adjust the swing speed is used for nozzle 1, which sprays the etching liquid while swinging in a direction perpendicular to the conveying direction of the product. is set in the range of 0 to 60 Hz, making it possible to match the conveyance speed of the workpiece and the circumferential speed of the spray sprayed from the nozzle.

この様な機能をノズルに持たせることによシ、エツチン
グ材の適正搬送速度に合わせてノズルの揺動速度を設定
することにより、第3図に示す回転スリット板の搬送方
向Y −Ylのスリット穴径Aと、これに直角なX −
X1方向のスリット穴は同一寸法に加工できる。
By equipping the nozzle with such a function, by setting the swinging speed of the nozzle in accordance with the appropriate transport speed of the etching material, the slits in the transport direction Y - Yl of the rotary slit plate shown in Fig. 3 can be set. Hole diameter A and X - perpendicular to it
Slit holes in the X1 direction can be machined to the same size.

本発明を用いたエツチング加工品の効果として【11 
円形を抜いた場合、ピッにならない。
Effects of etched products using the present invention [11]
If you remove the circular shape, it will not fit.

121 高密度プリント基板のパターン幅が均一にな3
− る。
121 Pattern width of high-density printed circuit board becomes uniform3
-

【31 回転メタルスリット板の幅が全周に渡って均一
にカリ、従来、スリット板の分解能は200μが限界で
あったが、50μまで可能になった。
[31 The width of the rotating metal slit plate is uniform over the entire circumference. Conventionally, the resolution of the slit plate was limited to 200μ, but it has become possible to achieve resolutions up to 50μ.

141 その他いかなる加工部品においても第3図A・
Bの寸法差がなくなる。
141 For any other processed parts, see Figure 3A.
The dimensional difference in B is eliminated.

など優れlζ効果を有するものである。It has an excellent lζ effect.

尚、本発明は、フォトレジストの現像機においても同様
な効果が得られる。
Incidentally, the present invention can also provide similar effects in a photoresist developing machine.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、ノズル噴射式エツチングマシンの正面図。第
2図は、ノズル噴射式エツチングマシンの側面図で、1
はスプレー、2は搬送ローラ、3は加工部品。第3図は
、エツチング加工部品であるスリット板である。 以 上 出願人 サンリツ工業株式会社 4− 第1図 第21!l 業5閲
FIG. 1 is a front view of a nozzle jet etching machine. Figure 2 is a side view of the nozzle jet etching machine.
is a sprayer, 2 is a conveyance roller, and 3 is a processed part. FIG. 3 shows a slit plate which is an etched part. Applicant: Sanritsu Kogyo Co., Ltd. 4- Figure 1, Figure 21! l Work 5 review

Claims (1)

【特許請求の範囲】[Claims] エツチング液をノズル噴射した噴霧液下に、コンベア、
又はローラ等により加工部品を搬送し、エツチング加工
を行なうエツチングマシンにおいて、加工部品の搬送速
度にノズルの揺動速度を同速度に設定可能な機能を持つ
、ノズル噴射式エツチングマシン。
A conveyor is placed under the etching solution sprayed by the nozzle.
Or, in an etching machine that carries out etching by transporting the processed parts using rollers, etc., a nozzle injection type etching machine has a function that allows the swinging speed of the nozzle to be set to the same speed as the transport speed of the processed parts.
JP16070783A 1983-08-31 1983-08-31 Nozzle spray type etching machine Pending JPS6052582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16070783A JPS6052582A (en) 1983-08-31 1983-08-31 Nozzle spray type etching machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16070783A JPS6052582A (en) 1983-08-31 1983-08-31 Nozzle spray type etching machine

Publications (1)

Publication Number Publication Date
JPS6052582A true JPS6052582A (en) 1985-03-25

Family

ID=15720722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16070783A Pending JPS6052582A (en) 1983-08-31 1983-08-31 Nozzle spray type etching machine

Country Status (1)

Country Link
JP (1) JPS6052582A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103147078A (en) * 2013-03-08 2013-06-12 苏州新协力特种工业模板有限公司 Etched swing pool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103147078A (en) * 2013-03-08 2013-06-12 苏州新协力特种工业模板有限公司 Etched swing pool

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