JPS6052067A - 超格子の構造 - Google Patents

超格子の構造

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Publication number
JPS6052067A
JPS6052067A JP58159813A JP15981383A JPS6052067A JP S6052067 A JPS6052067 A JP S6052067A JP 58159813 A JP58159813 A JP 58159813A JP 15981383 A JP15981383 A JP 15981383A JP S6052067 A JPS6052067 A JP S6052067A
Authority
JP
Japan
Prior art keywords
solid layer
semiconductor
layer
band width
forbidden band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58159813A
Other languages
English (en)
Other versions
JPH037139B2 (ja
Inventor
Toshio Baba
寿夫 馬場
Takashi Mizutani
隆 水谷
Masaki Ogawa
正毅 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58159813A priority Critical patent/JPS6052067A/ja
Priority to US06/624,333 priority patent/US4695857A/en
Priority to DE8484304300T priority patent/DE3480631D1/de
Priority to EP84304300A priority patent/EP0133342B1/en
Publication of JPS6052067A publication Critical patent/JPS6052067A/ja
Priority to US07/043,046 priority patent/US4792832A/en
Publication of JPH037139B2 publication Critical patent/JPH037139B2/ja
Granted legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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    • H01L29/73—Bipolar junction transistors
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    • H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は禁止帯幅が大きなＰ型半導体を実現できる超格
子の構造に関する。
従来の化合物半導体への不純物のドーピング方法は、Ｓ
ｉやＧｅの単元素からなる元素半導体へのドーピングと
同様に、一様に化合物半導体中ζこ不純物を含有させる
ものである。ＧａＡｓ、　ＩｎＰのような禁止帯幅が２
．Ｏｅ　ｖ　以下の化合物半導体では、このようなＰ型
不純物を一様ζこ分有させた構造ζこよっても容易にＰ
型半導体を得ることができるが、Ｚｎ８ｅ、　０ｄ８ｅ
トいッ７．：　Ｉｆ　−■半導体に代表される禁止帯幅
が２．Ｏｅ　ｖ以上のワイドギャップ化合物半導体では
、従来構造ではＰ型半導体が得られないものが多い、 従来のＰ型不純物をドーピングした化合物半導体の構造
について図面を用いて説明する。
第１図は従来のＰ型不純物をドーピングした化合物半導
体の概略断面図である。１は半導体基板、２はＰ型不純
物、３はＰ型不純物２を均一ζこ含有し半導体基板１の
上に形成した化合物半導体層である。
従来構造ではＰ型が得られない禁止帯幅の大きな半導体
の例としてＺｎ８ｅがあり、このＺｎ５ｅ中へのＡｕの
ドーピングを説明すると次のようになる。分子線エピタ
キシ（ＭＢＥ）法により基板温度を４００℃とし、Ｚｎ
位置ｌこ置換すればＰ型不純物として働くと考えられる
ＡｕをＩＸＩＯＧｎ含有するＺ　ｎ　８　ｅを成長させ
ても、ｎ型のＺｎ５ｅ＋。
か得られない。この理由は、添加不純物に応じてＺｎ５
ｅ内に固有欠陥が生じ、自己補償がなされるためである
。したがって、自己補償効果のあるＺｎ５ｅでは他の成
長方法や他のＰ型不純物を用いても同様にＰ型半導体は
得られない。
この解決手段としては従来構造とは異なり、Ｐ型不純物
と自己補償効果のある半導体とを空間曲に分離する新し
い構造が必要である。
本発明の目的は、かかる従来構造の持つ欠点を除去し、
禁止帯幅が大きなＰ型半導体が実現できる超格子の構造
を提供することにある。
本発明の超格子の構造は、発珪４亡１正孔波長以下の厚
さを有する第１の固体層と、該第１の固体層より電子親
オ１１力と禁止帯幅との和が大きく第た積層構造を持ち
、Ｐ型不純物が第１の固体層だけに含有されていること
を特徴とする。
一般に電子親和力と禁止帯幅とのオ［１が異なる半導体
の積層構造において、電子親和力と禁Ｉヒ帯幅との和が
小さ′１１：半導体の厚さが正孔波長以下になると量子
効果が顕著になり、この半導体内には新たなエネルギ準
位（量子化準位）が形成される。
さらに、電子親和力と禁止帯幅との和が大きな半導体の
厚さがこの半導体中を量子化準位の正孔がトンネルでき
るほどに薄くなると、正孔は量子化準位において積層構
造の膜中を自由に運動できるようになる。本発明の構造
はこの条件を満たしているため、第１の固体層から発生
する正孔は量子化準位において積層構造全体に広がる。
したがって、第１の固体層がＰ型半導体であれば、積層
構造全体もＰ型半導体とすることが可能となる。
以下、本発明について実施例を示す図面を参照して詳細
に説明する。
第２図は本発明の第１の実施例を示した模式的断面図で
ある。第２図において第１図と同じ番号のものは第１図
と同等物で同一機能を果すものであり、４はＰ型不純物
２を含有し正孔波長以下の厚さを有する第１の固体層、
５は該第１の固体層４より電子親和力と禁止帯幅との和
が大きく、第１の固体層４中の正孔がトンネル可能な厚
さを有する第２の固体層である。第１の固体層４と第２
の固体層５とが交互に積層し、積層構造を形成している
。
本実施例を、半導体基板１としてＧ　ａ　Ａ　ｓ、不純
物２．：！：Ｌ、てＢｅ、第１の固体層４として厚さ５
ＡのＧａＡ、ｓ、第２の固体層５として厚さ１５ＡのＺ
ｎ５ｅを用いて説明すると次のようｌこなる。
Ｇ　ａ　Ａ　ｓ中での室温におけるＢｅの活性化率はほ
ぼ１００％であるので、５ＡのＧ　ａ　Ａ　ｓ中ｌこは
ドープし７．ｚＢｅのほとんどが活性化してＢｅｉとほ
ぼ同量の正孔はＧ　ａ　Ａ　ｓの充満帯端より０．７ｅ
ｖ低い量子化準位においてこの膜全体に広がる。（）ａ
Ａｓとカ Ｚｎ８ｅの電子親給≦は占んど等しいため、電子の量子
化準位はほとんど現われない。したがって、この膜の等
測的な禁止帯幅は２．１ｅＶ（！：なる。
結晶ル又長方法としてＭＢＥを用い、膜全体の平均的な
りｅ濃度としてｌＸｌ０ｃｍ　をドーピングした結果、
室温での正孔濃度として１×１０ｃｒｎ（５） が得られた。この結果より、禁止帯幅が２．１ｅｖと大
きな半導体であるのにかかわらず、高い正孔濃度を有す
るＰ型半導体が得られることがわかる。
第３図は本発明の第２の実施例を示した模式的断面図で
ある。第３図において第１、第２図と同じ番号のものは
第１、第２図さ同等物で同一機能を果すものであり、６
は不純物２を含有し正孔波長以下の厚さを有する半導体
層、７は該半導体層６より電子親和力と禁止帯幅との和
が大きく半導体層６中の正孔がトンネル可能な厚さを有
する絶縁体層である。
不純物としてＢ、半導体層６として厚さ５Ａの８１、絶
縁体層７として厚さ１５ＡのＯａＦ、を用い、ＭＢＥ法
により本構造を構成した結果、新しい正孔の量子化準位
は８４の充満帯端より０．７　ｅ　ｖ低くなり、さらに
新しい電子の量子化準位がＳ＋の伝導帯端よりｌｅｖ　
高くなるため、禁止帯幅として２．８　ｅ　ｖが得られ
た。そして膜全俸の平均のＢ濃度としてｌＸ１０１１ｍ
　ドープｂｒ、＝のに対し、１×１０ｃ／ＩＬの正孔濃
度が得られた。
（６） 上記の本発明の２つの実施例については、Ｐ型不純物が
第１の固体層全体に含有されているとしたが、Ｐ型不純
物のドーピングを第１の固体層全体ではなく、第１の固
体層のうち第２の固体層との界面近傍を除く領域だけと
してもよく、またＰ型不純物を含有しないηＦ；】の固
体層がデバイ長以上の厚さに積層していなけれＣず積層
構造の中に存在しても良い。すなわち（責層構造中のす
べての第１の固体層中に不純物が含まれている必要は必
ずしもない。また、積層構造としては２種類の固体層を
交互にｔＩｔ層したものだけしか示さなかったが、３種
類具−ヒの固体層を積層したものであっても、正孔が量
子化準位で膜全体に広がる構造であれば良く、この構造
でもＰ型半導体が得られることは明らかである。３種類
の固体層を積層したものの例としては、ＧａＡ、ｓ／Ａ
／Ａｓ／Ｚｎ５ｅがあり、ＧａＡｓ／Ｚｎ５ｅ糸よりも
さらに禁止帯幅の広いものが容易に実現できる。
第１の固体層中に含有するＰ型不純物としては、第１の
固体層がＳｉ、’Ｇｅ等の元紫半導体ではＢ。
Ａ、ｌｌ　、　Ｇａ　、　Ｉｎ　、　Ｔ／等、ＧａＡ、
ｓ、　ＩｎＰ等の■−■化合物半導体ではＨｅ、Ｍｇ、
Ｚｎ、Ｏｄ、０等、ＺｎＴｅ、０ｄＴｅのＩＴ−ＶＩ化
合物半導体ではＡｕ。
Ａｇ、Ｏｕ　等であっても良い。
本発明の実施例では積層する固体層として格子整合のさ
れた半導体または絶縁体について述べたが、一般に積層
構造においては各層の界面において格子不整合によるス
トレスが緩和されるため、格子整合のとれてない半導体
または絶縁体の積層構造でも本発明を実現することは可
能である。さらｆこ、Ｍｉｓｃｉｂｉｌｉｔｙ　Ｇａｐ
に相当する組成（ＩｎＧａＡｓＳｂ、ＩｎＡｓＰＳｂ等
）で予想される光学的および電気的特性を有するＰ型半
導体も本発明ζこより実現することができる。
本発明の構造は実施例で示した材料以外のあらゆる半導
体および絶縁体の組合せに対し適用可能である。例えば
、ＴＩ−■化合物半導体間の組合せではＺｎ’１１．’
ｅ／（ｊｄｓｅ、　ｍ−ＶとＩｆ−Ｗの化合物半導体の
組合せではＧ　ａ　’、Ｐ　／　Ｚ　ｎ　Ｓ　、　Ｉ　
ｎ　Ｐ　／　Ｏｄ　Ｓ　、その他の半導体の組合せ占し
ては０ｕＧａＳｅ２／Ｚｎ８ｅ、半導体と絶縁体の、ａ
Ｉ合せでは８　ｉ　／Ｍｇ０−Ａ４０Ｂスピネル化合物
、Ｇａ　Ｐｌｏ　ａ　Ｆ２　ｆ、ｉどかある。
本発明の構造を得る方法としては、原理的にはどんな結
晶成長方法でｉ）っても良いが、数Ｘの膜厚制御性が必
要となるため、ＭＢＢ法やＭＯＯＶＤ（１’ｖｉｅｔａ
ｌ　Ｏｒｇａｎｉｃ　ＣｈｅｍｉｃａｌＶａｐｏｒＤｅ
ｐｏｓｉｔｉｏｎ）法が適している。中でもＭ　ＩＪ　
Ｅ法は原料の入った炉から出る分子線をシャッタの開閉
だけで制御できるため、遷移層が数Ａの急峻な界面を容
易に実現することができ、さらにコンビーータによる自
動制御が容易であるため最も適した方法である。
本発明Ｊこより禁止帯幅が広いＰ型半導体を実現できる
ので本発明を用いたＰ型半導体により青色発光の光デバ
イスや高温での使用が可能なトランスポートデバイスが
実現できる。
【図面の簡単な説明】
第１図は従来構造のＰ型不純物をドープした半導体の模
式的断面図、第２．第３図は本発明の第（９） １、第２の実施例を示した模式的断面図である。 １・・・半導体基板、　２・・・Ｐ型不純物、３・・・
化合物半導体層、　４・・・第１の半導体層、５・・・
第２の半導体層、　６・・・半導体層、７・・・絶縁体
層。 代理人り「理士内　原　晋 （１０）

Claims (1)

    【特許請求の範囲】
  1. 正孔波長以下の厚さを有する第１の固体層と、該第１の
    固体層より電子親和力と禁止帯幅との和が大きく第１の
    固体層中の正孔がトンネル可能な厚さを有する第２の固
    体層の少なくとも２種類の固体層を交互に積層した積層
    構造を持ち、Ｐ型不純物が第１の固体層だけに含有され
    ていることを特徴とする超格子の構造。
JP58159813A 1983-06-24 1983-08-31 超格子の構造 Granted JPS6052067A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58159813A JPS6052067A (ja) 1983-08-31 1983-08-31 超格子の構造
US06/624,333 US4695857A (en) 1983-06-24 1984-06-25 Superlattice semiconductor having high carrier density
DE8484304300T DE3480631D1 (de) 1983-06-24 1984-06-25 Halbleiterstruktur mit uebergitter hoher traegerdichte.
EP84304300A EP0133342B1 (en) 1983-06-24 1984-06-25 A superlattice type semiconductor structure having a high carrier density
US07/043,046 US4792832A (en) 1983-06-24 1987-04-24 Superlattice semiconductor having high carrier density

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159813A JPS6052067A (ja) 1983-08-31 1983-08-31 超格子の構造

Publications (2)

Publication Number Publication Date
JPS6052067A true JPS6052067A (ja) 1985-03-23
JPH037139B2 JPH037139B2 (ja) 1991-01-31

Family

ID=15701806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159813A Granted JPS6052067A (ja) 1983-06-24 1983-08-31 超格子の構造

Country Status (1)

Country Link
JP (1) JPS6052067A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144078A (ja) * 1984-12-17 1986-07-01 Toshiba Corp 半導体発光素子
JPS6294923A (ja) * 1985-10-22 1987-05-01 Nec Corp 半導体材料への不純物ド−ピング方法
JPS62179714A (ja) * 1986-02-04 1987-08-06 Sony Corp 化合物半導体
JPH01296679A (ja) * 1988-05-24 1989-11-30 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JP2021027242A (ja) * 2019-08-07 2021-02-22 キヤノン株式会社 光電変換装置、放射線撮像システム、光電変換システム、移動体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742116A (en) * 1980-08-26 1982-03-09 Nippon Telegr & Teleph Corp <Ntt> Semiconductor superlattice crystal
JPS57164573A (en) * 1982-02-26 1982-10-09 Hitachi Ltd Semiconductor device
JPS5815892A (ja) * 1981-07-17 1983-01-29 松下電器産業株式会社 一槽式脱水洗濯機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742116A (en) * 1980-08-26 1982-03-09 Nippon Telegr & Teleph Corp <Ntt> Semiconductor superlattice crystal
JPS5815892A (ja) * 1981-07-17 1983-01-29 松下電器産業株式会社 一槽式脱水洗濯機
JPS57164573A (en) * 1982-02-26 1982-10-09 Hitachi Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144078A (ja) * 1984-12-17 1986-07-01 Toshiba Corp 半導体発光素子
JPS6294923A (ja) * 1985-10-22 1987-05-01 Nec Corp 半導体材料への不純物ド−ピング方法
JPS62179714A (ja) * 1986-02-04 1987-08-06 Sony Corp 化合物半導体
JPH01296679A (ja) * 1988-05-24 1989-11-30 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JP2021027242A (ja) * 2019-08-07 2021-02-22 キヤノン株式会社 光電変換装置、放射線撮像システム、光電変換システム、移動体

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