JPS6050945A - センサ素子の接着固定方法 - Google Patents

センサ素子の接着固定方法

Info

Publication number
JPS6050945A
JPS6050945A JP58158697A JP15869783A JPS6050945A JP S6050945 A JPS6050945 A JP S6050945A JP 58158697 A JP58158697 A JP 58158697A JP 15869783 A JP15869783 A JP 15869783A JP S6050945 A JPS6050945 A JP S6050945A
Authority
JP
Japan
Prior art keywords
glass
sealing
shell
disk
sensor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58158697A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0116008B2 (enExample
Inventor
Keiji Kobayashi
啓二 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58158697A priority Critical patent/JPS6050945A/ja
Publication of JPS6050945A publication Critical patent/JPS6050945A/ja
Publication of JPH0116008B2 publication Critical patent/JPH0116008B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Light Receiving Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Die Bonding (AREA)
JP58158697A 1983-08-30 1983-08-30 センサ素子の接着固定方法 Granted JPS6050945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58158697A JPS6050945A (ja) 1983-08-30 1983-08-30 センサ素子の接着固定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58158697A JPS6050945A (ja) 1983-08-30 1983-08-30 センサ素子の接着固定方法

Publications (2)

Publication Number Publication Date
JPS6050945A true JPS6050945A (ja) 1985-03-22
JPH0116008B2 JPH0116008B2 (enExample) 1989-03-22

Family

ID=15677377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58158697A Granted JPS6050945A (ja) 1983-08-30 1983-08-30 センサ素子の接着固定方法

Country Status (1)

Country Link
JP (1) JPS6050945A (enExample)

Also Published As

Publication number Publication date
JPH0116008B2 (enExample) 1989-03-22

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