JPS6048262A - Diamond grindstone - Google Patents
Diamond grindstoneInfo
- Publication number
- JPS6048262A JPS6048262A JP15470883A JP15470883A JPS6048262A JP S6048262 A JPS6048262 A JP S6048262A JP 15470883 A JP15470883 A JP 15470883A JP 15470883 A JP15470883 A JP 15470883A JP S6048262 A JPS6048262 A JP S6048262A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- diamond
- segment
- center hole
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、シリコン、セラミック、硬質ガラス等の硬脆
材料、特にシリコンウェハーの研削に用いるダイヤモン
ド砥石に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a diamond grindstone used for grinding hard and brittle materials such as silicon, ceramics, and hard glass, particularly silicon wafers.
従来のこの槌のダイヤモンド砥石は、円環状ベースの下
面に多数の略■形状横断面のダイヤモンド砥石セグメン
トを突設して円上に等間隔に配列している。ところが、
略■形状横断面のダイヤモンド砥石セグメントは、刃先
剛性が充分に高いとは言い難い。刃先剛性が低いと、刃
先が研削抵抗によって振動したり変形したりして、研削
面が悪化する。The conventional diamond grinding wheel of this mallet has a large number of diamond grinding wheel segments having a substantially square cross section projecting from the lower surface of an annular base and arranged on a circle at equal intervals. However,
It is difficult to say that the cutting edge rigidity of a diamond grinding wheel segment with an approximately ■-shaped cross section is sufficiently high. If the rigidity of the cutting edge is low, the cutting edge will vibrate or deform due to grinding resistance, which will deteriorate the ground surface.
また、ダイヤモンド砥石セグメントは、刃先剛性のみを
考慮して、剛性の高い横断面形状にすると、研削液によ
る刃先の冷却と研削チップの排出が悪化する。Furthermore, if the diamond grinding wheel segment is made to have a highly rigid cross-sectional shape by considering only the rigidity of the cutting edge, cooling of the cutting edge by the grinding fluid and evacuation of the grinding chips will deteriorate.
本発明の目的は、上記のような従来の状況からして、刃
先剛性が高く、マた、刃先の冷却と研削チップの排出が
良好なダイヤモンド砥石を提供することである。In view of the above-mentioned conventional situation, an object of the present invention is to provide a diamond grindstone that has high cutting edge rigidity, good cooling of the cutting edge, and good discharge of grinding chips.
本発明は、上記の目的を達成するため、ダイヤモンド砥
石セグメントを筒状にし、その中心孔に研削液が流通す
るようにしたものである。即ち、ホイールベースにその
下端外周縁から中心側に突出したフランジ部を設け、フ
ランジ部にその上面と下面間を貫通し次多数の通孔を設
け、各通孔に筒状のダイヤモンド砥石セグメントの上端
部を嵌着して、各ダイヤモンド砥石セグメントの中心孔
をフランジ部の上面側に連通ずる一方、各ダイヤモンド
砥石セグメントの下端部をフランジ部の下面から突出し
たことを特徴とするダイヤモンド砥石である。In order to achieve the above object, the present invention provides a diamond grindstone segment having a cylindrical shape so that a grinding fluid flows through its center hole. That is, the wheelbase is provided with a flange portion that protrudes from the outer peripheral edge of the lower end toward the center, and the flange portion is provided with a number of through holes passing through between the upper and lower surfaces of the flange portion, and a cylindrical diamond grinding wheel segment is inserted into each through hole. The diamond grinding wheel is characterized in that the upper end portion is fitted so that the center hole of each diamond grinding wheel segment communicates with the upper surface side of the flange portion, while the lower end portion of each diamond grinding wheel segment protrudes from the lower surface of the flange portion. .
本発明のダイヤモンド砥石においては、ダイヤモンド砥
石セグメントは、筒状をしているので、略■形状横断面
の従来品に比して、刃先剛性が高い。また、筒状のダイ
ヤモンド砥石セグメントの中心孔がホイールベースのフ
ランジ部の上面側に連通しているので、研削液がフラン
ジ部の上面側からダイヤモンド砥石セグメントの中心孔
に流入して流通し、ダイヤモンド砥石セグメントの下端
部即ち刃先から流出する。従って、研削液による刃先の
冷却と研削チップの排出が良好である。In the diamond grindstone of the present invention, since the diamond grindstone segment is cylindrical, the cutting edge rigidity is higher than that of a conventional product having a substantially square cross section. In addition, since the center hole of the cylindrical diamond grinding wheel segment communicates with the upper surface of the flange of the wheel base, the grinding fluid flows from the upper surface of the flange into the center hole of the diamond grinding wheel segment. It flows out from the lower end or cutting edge of the grinding wheel segment. Therefore, cooling of the cutting edge by the grinding fluid and discharge of the grinding chips are good.
次に、本発明の実施例について説明する。Next, examples of the present invention will be described.
本例のダイヤモンド砥石は、第１図に示すｘ９に、アル
ミニュウム製のホイールベース（１）を、外周部を下側
に傾斜した円輪板状の基板部（２）とその下端外周縁か
ら中心側に突出したフランジ部（４）から構成し、第７
図と第２図に示すように、ホイールベースのフランジ部
（４）にその傾斜上面と水平下面間を貫通した多数の通
孔（５）を３個の同志円錐面上に等間隔に配置して設け
、各通孔（５）の下端部を大径の砥石セグメン１−取付
孔（６）に形成し、各通孔（５）の残部を研削液通路（
７）にし、各通孔の砥石セグメント取付孔（６）に円筒
状のダイヤモンド砥石セグメント（８）の上端部を嵌合
して接着し、各ダイヤモンド砥石セグメントの中心孔（
９）を各通孔の研削液通路（７）を経てフランジ部（４
〕の上面側に連通し、各ダイヤモンド砥石セグメント（
８）の下端部即ち刃先をフランジ部（４）の下面から外
周側に傾斜して突出し、各ダイヤモンド砥石セグメント
（８）の傾斜下端面を同一水平面内に配置している。な
お、ダイヤモンド砥石セグメント（８）は、電着法によ
ってニッケルの母材に多数のダイヤモンド粒子を分散し
て含有させたものであり、内径がＸ５〜２５門で、肉厚
が０２〜Ｏ，Ｓ ｔｘｍである。The diamond whetstone of this example has an aluminum wheel base (1) mounted on x9 shown in Fig. 1, and a circular plate-shaped base plate (2) whose outer periphery is inclined downward, and its lower end from the outer periphery to the center. Consisting of a flange portion (4) projecting to the side, the seventh
As shown in the figure and Fig. 2, a large number of through holes (5) penetrating the flange portion (4) of the wheel base between its inclined upper surface and horizontal lower surface are arranged at equal intervals on three conical surfaces. The lower end of each through hole (5) is formed into a large-diameter grindstone segment 1-attachment hole (6), and the remainder of each through hole (5) is formed into a grinding fluid passage (
7), fit and glue the upper end of the cylindrical diamond whetstone segment (8) into the whetstone segment attachment hole (6) of each through hole, and attach the center hole of each diamond whetstone segment (
9) through the grinding fluid passage (7) of each through hole to the flange part (4).
] communicates with the top side of each diamond grinding wheel segment (
8) The lower end portion, ie, the cutting edge, projects obliquely from the lower surface of the flange portion (4) toward the outer circumferential side, and the inclined lower end surfaces of each diamond grindstone segment (8) are arranged in the same horizontal plane. The diamond grinding wheel segment (8) is made by dispersing and containing a large number of diamond particles in a nickel base material using an electrodeposition method, and has an inner diameter of X5 to 25 mm and a wall thickness of 02 to O,S. txm.
本例のダイヤモンド砥石を使用する場合、ホイールベー
ス（１）を、その基板部（２）に貫設した複数個の取付
孔（３）を利用して、図示しない研削機の主軸の下端に
取付け、ホイールベース（１）内に研削液供給パイプを
配置し、主軸を回転すると共に研削液を供給して、ダイ
ヤモンド砥石セグメント（８）の傾斜下端面をテープμ
上のシリコンウェハーの上面に当接する。すると、ダイ
ヤモンド砥石セグメント（８）の傾斜下端面がシリコン
ウェハーの上面を摺動して研削する一方、研削液がフラ
ンジ部（４）の上面側から研削液通路（７）を経てダイ
ヤモンド砥石セグメントの中心孔（９）に流入して流通
し、ダイヤモンド砥石セグメント（８）の下端面の中心
孔（９）から流出する。従って、研削液がダイヤモンド
砥石セグメントの中心孔（９）ひ流通するので、研削に
より発熱シタダイヤモンド砥石セグメント（８）の刃先
が充分に冷却され、また、研削液がダイヤモンド砥石セ
グメントの下端面の中心孔（９）から流出するので、１
ｔｌにより生じたダイヤモンド砥石セグメント（８）下
端面とシリコンウェハー上面間の研削チップが確実に排
出される。When using the diamond grindstone of this example, the wheel base (1) is attached to the lower end of the main shaft of a grinding machine (not shown) using the plurality of attachment holes (3) penetrated through the base plate (2). , a grinding fluid supply pipe is arranged inside the wheel base (1), the main shaft is rotated, and the grinding fluid is supplied to tape the slanted lower end surface of the diamond grinding wheel segment (8)
It comes into contact with the top surface of the upper silicon wafer. Then, the inclined lower end surface of the diamond grinding wheel segment (8) slides and grinds the upper surface of the silicon wafer, while the grinding fluid flows from the upper surface of the flange portion (4) through the grinding fluid passage (7) to the diamond grinding wheel segment. It flows into the central hole (9) and flows out from the central hole (9) in the lower end face of the diamond grinding wheel segment (8). Therefore, since the grinding fluid flows through the center hole (9) of the diamond grinding wheel segment, the cutting edge of the heat-generating diamond grinding wheel segment (8) is sufficiently cooled by grinding, and the grinding fluid flows through the center hole (9) of the diamond grinding wheel segment. Since it flows out from the hole (9), 1
Grinding chips generated between the lower end surface of the diamond grindstone segment (8) and the upper surface of the silicon wafer due to tl are reliably ejected.
上記の図示実施例のダイヤモンド砥石は、ダイ ５−
ヤモンド砥石を３列に配列しているが、７列又は２列若
しくはグ列に配列してもよい。また、３列に配列したダ
イヤモンド砥石セグメントがほぼ同じ粒径のダイヤモン
ドを含有しているが、外周側の列のダイヤモンド砥石セ
グメントを粒径の大きいダイヤモンドを含有した荒研削
用のものとし、中心側の列のダイヤモンド砥石セグメン
Ｆを粒径の小さいダイヤモンドを含有した仕上研削用の
ものとして、荒研削と仕上研削を一工程で行うようにし
てもよい。Although the diamond grindstones in the illustrated embodiment are arranged in three rows, they may be arranged in seven rows, two rows, or one row. In addition, the diamond grinding wheel segments arranged in three rows contain diamonds with approximately the same particle size, but the diamond grinding wheel segments in the outer row are for rough grinding and contain diamonds with larger particle sizes, and The diamond grinding wheel segment F in the row may be used for finish grinding containing diamond with a small particle size, so that rough grinding and finish grinding can be performed in one step.
第１図は本発明の実施例のダイヤモンド砥石の一部縦断
正面図、第２図は同ダイヤモンド砥石の一部斜視図であ
る。
１：ホイールベース ４：フランジ部 ５：通孔８：ダ
イヤモンド砥石セグメント ９：中心孔 ６−FIG. 1 is a partially longitudinal sectional front view of a diamond grindstone according to an embodiment of the present invention, and FIG. 2 is a partially perspective view of the same diamond grindstone. 1: Wheel base 4: Flange part 5: Through hole 8: Diamond grinding wheel segment 9: Center hole 6-
Claims (1)
フランジ部を設け、フランジ部にその上面と下面間を貫
通した多数の通孔を設け、各通孔に筒状のダイヤモンド
砥石セグメントの上端部を嵌着して、各ダイヤモンド砥
石セグメントの中心孔をフランジ部の上面側に連通ずる
一方、各ダイヤモンド砥石セグメントの下端部をフラン
ジ部の下面から突出したことを特徴とするダイヤモンド
砥石。The wheelbase is provided with a flange portion that protrudes from the outer peripheral edge of the lower end toward the center, and the flange portion is provided with a number of through holes passing through between the upper and lower surfaces of the flange portion, and the upper end portion of a cylindrical diamond grinding wheel segment is provided in each through hole. A diamond whetstone characterized in that the diamond whetstone segments are fitted so that the center hole of each diamond whetstone segment communicates with the upper surface of the flange, and the lower end of each diamond whetstone segment protrudes from the lower surface of the flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15470883A JPS6048262A (en) | 1983-08-24 | 1983-08-24 | Diamond grindstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15470883A JPS6048262A (en) | 1983-08-24 | 1983-08-24 | Diamond grindstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6048262A true JPS6048262A (en) | 1985-03-15 |
| JPS6339385B2 JPS6339385B2 (en) | 1988-08-04 |
Family
ID=15590216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15470883A Granted JPS6048262A (en) | 1983-08-24 | 1983-08-24 | Diamond grindstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048262A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1136183A2 (en) * | 2000-03-14 | 2001-09-26 | KREBS & RIEDEL SCHLEIFSCHEIBENFABRIK GMBH & CO. KG | Diamond grinding segment and grinding tool for surface machining of workpieces |
| JP2015231647A (en) * | 2014-06-09 | 2015-12-24 | 株式会社ディスコ | Manufacturing method of grinding wheel |
| CN106985003A (en) * | 2015-09-17 | 2017-07-28 | 株式会社迪思科 | It is ground emery wheel and method for grinding |
-
1983
- 1983-08-24 JP JP15470883A patent/JPS6048262A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1136183A2 (en) * | 2000-03-14 | 2001-09-26 | KREBS & RIEDEL SCHLEIFSCHEIBENFABRIK GMBH & CO. KG | Diamond grinding segment and grinding tool for surface machining of workpieces |
| EP1136183A3 (en) * | 2000-03-14 | 2003-08-13 | KREBS & RIEDEL SCHLEIFSCHEIBENFABRIK GMBH & CO. KG | Diamond grinding segment and grinding tool for surface machining of workpieces |
| JP2015231647A (en) * | 2014-06-09 | 2015-12-24 | 株式会社ディスコ | Manufacturing method of grinding wheel |
| CN106985003A (en) * | 2015-09-17 | 2017-07-28 | 株式会社迪思科 | It is ground emery wheel and method for grinding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6339385B2 (en) | 1988-08-04 |
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