JPH0732263A - Surface polishing device with abrasive liquid splash preventive mechanism - Google Patents

Abstract

PURPOSE:To provide a splash preventive mechanism of simple structure capable of certainly preventing splash of an abrasive liquid dropping from a surface plate and not disturbing maintenance and inspection as well as supplying and offtaking of a work. CONSTITUTION:On the outer periphery of a surface plate 11, an brasive liquid splash preventive jig 24 of a short and cylindrical shape to surround the surface plate 11 is integrally installed in the state of keeping a required interval between the surface plate 11 and its outer periphery, an abrasive liquid dropping from the marginal part of the surface plate 11 is caught by the preventive jig 24 and dropped inside of a recovery groove 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat polishing apparatus for polishing various works such as semiconductor wafers, glass plates, metal plates, and the like. The present invention relates to a flat surface polishing apparatus having a scattering prevention mechanism that prevents the particles from scattering.

[0002]

2. Description of the Related Art Generally, a flat polishing apparatus such as a lapping apparatus or a polishing apparatus presses various works such as a semiconductor wafer, a glass plate and a metal plate against a surface plate which rotates in a horizontal plane, and supplies the polishing liquid to the work. Is polished. At this time, the polishing liquid supplied onto the surface plate is scattered around by the centrifugal force caused by the rotation of the surface plate and adheres to various parts of the device or the periphery of the device to contaminate the part or rotate. Inconveniences such as sticking to parts and fixing members to each other have occurred.

Therefore, conventionally, for example, as shown in FIG. 3, a dustproof cover 2 is provided so as to cover the surface plate 1 from a side portion to an upper portion thereof, or as shown in FIG. 4, a polishing liquid recovery groove provided in a machine body 3 is provided. The cowl 5 was attached so as to surround the surface plate 1 along 4 but in the former case, not only is the dust cover 2 large in size and costly, but also when the work 6 is supplied or taken out. There is a drawback in that the dust cover 2 is an obstacle during maintenance and inspection, making it difficult to perform work. In the latter case, since the cowl 5 is fixedly installed by being attached to the fuselage 3 side, it does not rotate. When the polishing liquid vigorously flowing down from the plate 1 hits the cowl 5, the polishing liquid scatters around and easily contaminates the machine body.
The polishing liquid that flows down from the surface plate 1 becomes finer and spreads over a wider range as it moves away from the surface plate 1. Therefore, with the cowl 5 mounted at a distance from the surface plate 1, a sufficient diffusion preventing effect can be obtained. In addition, since the cowl 5 is attached so as to project above the surface plate 1, it becomes an obstacle when supplying or taking out the work 6, maintenance or inspection, and the workability is poor. there were.

[0004]

The object of the present invention is to reliably prevent the scattering of the polishing liquid that flows down from the surface plate, and not to hinder the supply or removal of the work, maintenance or inspection, etc. To obtain a scattering prevention mechanism having a simple structure.

[0005]

In order to solve the above problems, the present invention relates to a flat polishing apparatus for pressing a work against a surface plate rotating in a horizontal plane and polishing the work while supplying a polishing liquid. On the outer periphery of the surface plate, a polishing liquid scattering prevention jig in the shape of a short cylinder that surrounds the surface plate is integrally attached to the surface plate while maintaining a required distance from the outer surface of the surface plate. To do.

[0006]

The polishing liquid flowing down from the outer periphery of the surface plate by the rotation of the surface plate hits the scattering prevention jig and falls into the recovery groove to be recovered. At this time, since the scattering prevention jig is rotating together with the surface plate, even if the polishing liquid hits the prevention jig with a certain amount of force, the case where the prevention jig is attached to the machine side The liquid does not splatter. Further, since the polishing liquid does not vigorously flow out horizontally from the surface plate and flows down slightly downward from the horizontal surface, it is not necessary to make the prevention jig higher than the surface plate. It does not interfere with the work such as supply, removal, maintenance and inspection.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. FIGS. 1 and 2 show a single-side polishing apparatus,
In the figure, reference numeral 10 is a machine body, 11 is a polishing surface plate arranged at a predetermined position of the machine body 10 so as to be rotatable in a horizontal plane, and the surface plate 11 is connected to a motor (not shown). , Is driven and rotated at a required speed. A plurality of pressure heads 12 that can be moved up and down by cylinders are arranged in a desired arrangement on the upper surface of the surface plate 11. A work 13 is attached to the lower surface of each pressure head 12 and pressed against the upper surface of the surface plate 11. A liquid supply pipe 14 for supplying a polishing liquid onto the surface plate 11 at the time of polishing is disposed above the central portion of the surface plate 11, and the upper surface of the surface plate 11 has a center portion at the center thereof. A conical cone 15 for evenly dispersing the polishing liquid supplied by the liquid supply pipe 14 is provided.

A recovery groove 18 is formed in the machine body 10 along the outer periphery of the surface plate 11 for receiving the polishing liquid flowing down from the peripheral edge of the surface plate 11, and the recovery groove 18 forms a recovery pipe 19. It is connected to the recovery tank 20 via the recovery tank 20, and the polishing liquid recovered in the recovery tank 20 is reused in a circulating manner by the pump 21.

In order to prevent the polishing liquid flowing down from the peripheral portion of the surface plate 11 from scattering, a short cylindrical scattering prevention jig 24 surrounding the surface plate 11 is provided on the outer periphery of the surface plate 11. By the mounting jigs 25 provided at a plurality of positions on the surface plate 11
It is attached so as to rotate integrally with the surface plate 11 while maintaining a required distance from the outer circumference. The optimum distance L between the scattering prevention jig 24 and the surface plate 11 is such that after the polishing liquid flowing down from the surface plate 11 hits the scattering prevention jig 24 and is once received, the polishing liquid travels through the scattering prevention jig 24 and is collected. The size is such that it falls into the groove 18, and it depends on the processing conditions such as the rotation speed of the surface plate 11 and the supply amount of the polishing liquid, the mounting height of the scattering prevention jig 24 with respect to the surface plate 11, and the like. Although slightly different, when the anti-scattering jig 24 is attached so that its upper end is substantially level with the upper surface of the surface plate 11 and processing is performed under normal conditions, 5 to 2
The intervals are about 0 mm.

According to an experiment conducted by the present inventor, the surface plate 11
The polishing liquid supplied above flows down from the peripheral edge of the surface plate to the outside due to the centrifugal force accompanying the rotation of the surface plate 11, but the number of rotations of the surface plate (20 to 100 rpm) during normal polishing.
It was found that within the range of the polishing liquid supply amount (100 to 400 cc / min) or the like, the polishing liquid did not vigorously jump out of the surface plate 11 in the horizontal direction, but a little below the horizontal direction. Therefore, it is not necessary to make the scattering prevention jig 24 higher than the surface plate 11 as long as an appropriate space is maintained between the surface plate 11 and the surface plate 11, and the height of the surface of the surface plate 11 is almost the same as or slightly lower than the upper surface. By attaching it, the polishing liquid can be reliably received. Moreover, the scattering prevention jig 2
4 does not interfere with work such as supply and removal of the work 13 and maintenance and inspection. Of course, the scattering prevention jig 24 can be set slightly higher than the upper surface of the surface plate 11 as long as it is within the range that does not interfere with the work such as supply and removal of the work 13, maintenance and inspection.

The lower end of the scattering prevention jig 24 may be suspended in the recovery groove 18, but it should be kept as low as possible in order to prevent the falling polishing liquid from hitting the groove bottom and splashing. Is desirable.

The cylindrical shape of the shatterproof jig 24 may have a uniform diameter as shown in the figure, a narrowed shape or a spreaded shape, or any other cylindrical shape. .

In the surface polishing apparatus having the above structure,
The work 13 to be polished is mounted and held on the lower surface of each pressure head 12 by an appropriate means, and is pressed against the surface plate 11 rotating by the pressure head 12 for polishing. At this time, the polishing liquid is supplied to the central portion of the upper surface of the surface plate 11 through the liquid supply pipe 14, and is evenly distributed in the radial direction by the cone 15.

The polishing liquid supplied onto the surface plate 11 flows outward from the peripheral portion of the surface plate due to the centrifugal force caused by the rotation of the surface plate 11, but as described above, under normal processing conditions. Since the polishing liquid does not vigorously flow out in the horizontal direction and flows down slightly downward from the horizontal direction, the polishing liquid surely hits the scattering prevention jig 24 and is then received by the scattering prevention jig 24. Therefore, it does not fall over the scattering prevention jig 24 and scatter around, or directly hit the groove bottom of the recovery groove 18 and scatter. Moreover, the scattering prevention jig 24
Is rotating together with the surface plate 11, even if the polishing liquid hits the prevention jig 24 with a certain amount of force, the liquid is still generated as in the case where the prevention jig 24 is fixed to the machine body 10 side. It doesn't scatter.

The polishing liquid flowing down from the surface plate 11 is
The farther from the surface plate 11, the more finely the particles spread and the range of diffusion increases. However, by directly attaching the prevention jig 24 to the surface plate 11, the polishing liquid becomes finer particles and diffuses at a position relatively close to the surface plate 11. Since it is received before, the scattering of the polishing liquid can be prevented more efficiently and reliably.

In the above embodiment, the single-side polishing machine has been described, but it goes without saying that a double-side polishing machine can be similarly constructed.

[0017]

As described above, according to the present invention, the polishing liquid flowing down from the surface plate can be removed by a simple structure in which the short cylindrical scattering prevention jigs are attached to the outer periphery of the surface plate at a required interval. It is possible to reliably receive and prevent scattering, and since the scattering prevention jig is rotated together with the surface plate, even if the polishing liquid hits the prevention jig with a certain amount of force. Also, unlike the case where the prevention jig is fixed to the machine body side, the liquid does not splash. Also, the polishing liquid does not vigorously jump out horizontally from the surface plate,
Since it flows down slightly downward from the horizontal, it is not necessary to make the above-mentioned prevention jig higher than the surface plate. Therefore, the prevention jig is attached so that it does not interfere with work supply, removal, maintenance and inspection work. You can also

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts showing an embodiment of a flat surface polishing apparatus according to the present invention.

FIG. 2 is an enlarged view of a main part of the flat-surface polishing apparatus of FIG.

FIG. 3 is a cross-sectional view of essential parts showing an example of a conventional planar polishing apparatus.

FIG. 4 is a cross-sectional view of essential parts showing another example of a conventional flat-surface polishing apparatus.

[Explanation of symbols]

 11 surface plate 13 work 24 prevention jig L interval

Claims (1)

[Claims] 1. A flat polishing apparatus for pressing a work against a surface plate rotating in a horizontal plane and polishing the work while supplying a polishing liquid, wherein a short cylindrical shape surrounding the surface plate is provided on the outer periphery of the surface plate. A flat polishing apparatus with a polishing liquid scattering prevention mechanism, characterized in that a polishing liquid scattering prevention jig is integrally attached to the surface plate while maintaining a required space between the polishing liquid scattering prevention jig and the outer periphery of the surface plate.