JPS6045427U - 半導体製造装置 - Google Patents
半導体製造装置Info
- Publication number
- JPS6045427U JPS6045427U JP13783483U JP13783483U JPS6045427U JP S6045427 U JPS6045427 U JP S6045427U JP 13783483 U JP13783483 U JP 13783483U JP 13783483 U JP13783483 U JP 13783483U JP S6045427 U JPS6045427 U JP S6045427U
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- semiconductor manufacturing
- shroud
- manufacturing equipment
- consumption amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783483U JPS6045427U (ja) | 1983-09-07 | 1983-09-07 | 半導体製造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783483U JPS6045427U (ja) | 1983-09-07 | 1983-09-07 | 半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6045427U true JPS6045427U (ja) | 1985-03-30 |
JPH019151Y2 JPH019151Y2 (enrdf_load_stackoverflow) | 1989-03-13 |
Family
ID=30309463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13783483U Granted JPS6045427U (ja) | 1983-09-07 | 1983-09-07 | 半導体製造装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6045427U (enrdf_load_stackoverflow) |
-
1983
- 1983-09-07 JP JP13783483U patent/JPS6045427U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH019151Y2 (enrdf_load_stackoverflow) | 1989-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6045427U (ja) | 半導体製造装置 | |
JPS59103441U (ja) | 半導体集積回路 | |
JPS602834U (ja) | 位置決め機構 | |
JPS5929052U (ja) | 集積回路装置 | |
JPS5854108U (ja) | 室内用アンテナ | |
JPS6071152U (ja) | 半導体装置 | |
JPS6056467U (ja) | 半導体ウェハダイシングブレ−ド | |
JPS58135957U (ja) | 半導体装置 | |
JPS6073257U (ja) | 半導体装置 | |
JPS58193631U (ja) | 半導体製造装置 | |
JPS6031964U (ja) | ウエハ−ポリッシング装置用重り構造 | |
JPS59124553U (ja) | スプリンクラ−ヘツド凍結防止法 | |
JPS59181796U (ja) | 製図用型板 | |
JPS6142831U (ja) | 半導体製造装置 | |
JPS59162980U (ja) | 洗浄装置 | |
JPS606236U (ja) | 半導体装置 | |
JPS5812938U (ja) | 半導体ウエ−ハ | |
JPS60143623U (ja) | ウエハ−チヤツク | |
JPS60181045U (ja) | 半導体素子の強制空冷装置 | |
JPS59161256U (ja) | マグネトロン装置 | |
JPS609293U (ja) | 強制空冷装置 | |
JPS6127720U (ja) | 車両用ドレン処理装置 | |
JPS5995636U (ja) | Ic固定装置 | |
JPS59194119U (ja) | 回転ヘツド装置 | |
JPS6094835U (ja) | 半導体装置 |