JPS6045427U - semiconductor manufacturing equipment - Google Patents
semiconductor manufacturing equipmentInfo
- Publication number
- JPS6045427U JPS6045427U JP13783483U JP13783483U JPS6045427U JP S6045427 U JPS6045427 U JP S6045427U JP 13783483 U JP13783483 U JP 13783483U JP 13783483 U JP13783483 U JP 13783483U JP S6045427 U JPS6045427 U JP S6045427U
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- semiconductor manufacturing
- shroud
- manufacturing equipment
- consumption amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の分子線エピタキシャル装置の縦断面図
、第２図は、本考案による分子線エピタキシャル装置の
一実施例を示す縦断面図である。
３．４・・・・・・ＬＮ２シュラウド、８・・・・・・
冷媒補給管、１６・・・・・・冷媒連通管。FIG. 1 is a vertical cross-sectional view of a conventional molecular beam epitaxial apparatus, and FIG. 2 is a vertical cross-sectional view showing an embodiment of the molecular beam epitaxial apparatus according to the present invention. 3.4...LN2 shroud, 8...
Refrigerant supply pipe, 16... Refrigerant communication pipe.
Claims (1)
シュラウドを複数個有する半導体製造装置において、前
記冷媒の消費量が少ない前記シュラウドに冷媒補給管を
連結すると共に、該シュラウドと冷媒の消費量が多いシ
ュラウドとを冷媒連通管で連結したことを特徴とする半
導体製造装置。In a semiconductor manufacturing device having a plurality of shrouds each having an independent space for holding a refrigerant and having a different consumption amount of the refrigerant, a refrigerant supply pipe is connected to the shroud having a small consumption amount of the refrigerant, and the shroud and the refrigerant consumption amount are A semiconductor manufacturing device characterized in that a shroud having a large amount of air is connected to the shroud by a refrigerant communication pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13783483U JPS6045427U (en) | 1983-09-07 | 1983-09-07 | semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13783483U JPS6045427U (en) | 1983-09-07 | 1983-09-07 | semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6045427U true JPS6045427U (en) | 1985-03-30 |
| JPH019151Y2 JPH019151Y2 (en) | 1989-03-13 |
Family
ID=30309463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13783483U Granted JPS6045427U (en) | 1983-09-07 | 1983-09-07 | semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045427U (en) |
-
1983
- 1983-09-07 JP JP13783483U patent/JPS6045427U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH019151Y2 (en) | 1989-03-13 |
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