JPS6045278B2 - How to partially plate electrical terminals and partially plated electrical terminals - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for partially plating a plate-shaped electrical terminal (hereinafter simply referred to as a terminal) and a partially plating terminal.

In FIG. 1, two identical plate-shaped terminals 1 are soldered to through-holes 3 of a connector board (hereinafter simply referred to as the board) 2 at the intermediate portions of the electrical connectors (
(hereinafter simply referred to as a connector).

4 is a soldering part, 5 is an insulator formed integrally with the board 2,
6 is a contact surface with a mating member connected to this connector.

As the material for the terminal 1, phosphor bronze or the like is usually used. Oxidation and oxidation caused by the environmental atmosphere on the surface of materials such as phosphor bronze,
In order to prevent oxidation during electrical contact operation and deterioration of connector performance due to these, conventionally, the entire surface of the terminal was plated with a corrosion-resistant good conductor, such as gold, or areas where plating was not required were plated with anti-plating material. For this purpose, masking was applied, and gold plating was applied only to the contact surface and the entire soldering gate area. The above-mentioned method of applying gold plating to the entire surface is expensive, and
The method of applying one-roll masking to areas where plating is unnecessary has the drawback of being complicated and requiring a large number of man-hours. In view of the drawbacks of the prior art described above, the present invention provides the following methods: using a jig, the surface of the terminal is tightly sandwiched, leaving the part that requires plating of the terminal;
Saves plating metal by spraying plating liquid only on the parts that require plating, that is, the contact surface of the terminal with the mating member, both sides of that part, and the entire surface of the soldering part. To provide a method for partially plating a terminal with a small number of measuring and man-hours, and to provide a defect-free partially plated terminal at low cost. One embodiment of the invention will be described with reference to FIGS. 2-6.

In FIG. 2, a terminal 1 made of a phosphor bronze plate has a bent portion near its tip where the downwardly convex surface becomes a contact surface 6, and the intermediate portion thereof becomes a soldering portion 4.

The jig 7 consists of a lower mold 8 and an upper mold 9 made of an insulating elastic material made of synthetic rubber. The lower mold 8 has an upper surface shape that allows the surface on the contact surface 6 side of the terminal 1 and both side surfaces adjacent thereto to be in close contact with each other, and is fixed in a fixed position by known means (not shown). Upper mold 9
has a lower surface shape that can be brought into close contact with the back surface of the contact surface 6 of the terminal 1, and the terminal 1 is connected between the terminal 1 and the lower die 8 by known means (not shown).
It is designed so that it can be inserted closely. The lower mold 8 is provided with cavities 10 (FIG. 3) and 11 (FIG. 4) of appropriate size on both sides of the contact surface 6 and on both sides of the soldering portion 4, respectively. . At positions corresponding to the contact surface 6 of the lower mold 8 and the soldering portion 4, jet ports 12 and 13 having a rectangular cross section are provided at substantially right angles to the surface of the terminal 1. On the upper surface of the soldering part 4 of the upper mold 9, there is a rectangular seat having the same cross-sectional shape as the jet port 13. A hole 14 is provided. The jet ports 12 and 13 are
They communicate with the voids 10 and 11 and the rectangular counterbore hole 14, respectively,
It passes through the lower mold 8 along with the voids 10 and 11. 15
, 16 are the accumulating liquid spout ports arranged at fixed positions directly below the jet ports 12 and 13, respectively! It is connected to a known separate liquid feeding device (not shown) via a conduit equipped with a flow rate regulating valve (not shown), and a gold anode plate is immersed in the liquid feeding device.

The terminal 1 is connected to an electric circuit (not shown) and has a negative polarity. Next, a method of partially plating the terminal 1 using the apparatus having the above configuration will be described.

Gold molecules in the gold plating solution sprayed from the spout 15 through the spout 12 onto the contact surface 6 in the direction shown by the arrow 17 are attracted to the anode terminal 1, adhere to the contact surface 6, and become gold. Plating is performed.

The thickness of the gold plating layer 18 (FIG. 5) on the contact surface 6 is adjusted by the injection amount and injection time of the plating liquid. At this time, part of the plating liquid goes around to both sides of the contact surface 6 of the terminal 1, but since the back side of that part of the terminal 1 is in close contact with the upper die 9, the plating liquid flows onto the back side of the contact surface 6 of the terminal 1. Therefore, on both sides of the terminal 1, as shown in FIG. A gold plating ceremony will be held. On the other hand, in the case of the soldering part 4 of the terminal 1, the plating liquid is sprayed onto the surface of the soldering part 4 from the spout 16 through the spout 13 in the direction shown by the arrow 20. Ingredient 7
There is a suitable space in between as mentioned above, and the plating liquid spreads over all sides, so the entire surface is plated with gold.

The amount of plating liquid sprayed on the contact surface 6 is adjusted so that the thickness of the gold plating layer 21 (FIG. 6) on the soldering part 4 is almost uniform and considerably thinner than the thickness on the contact surface 6. Adjust by decreasing. The entire remaining surface of the terminal 1, excluding the soldering part 4, the contact surface 6, both sides of the contact surface 6, and both end surfaces, is as follows:
Since it is tightly sandwiched between the jigs 7, it is not exposed to the plating solution and therefore no gold plating is applied.

The tamping liquid sprayed onto the surface to be plated is received in a storage tank (not shown) and used for circulation.

According to the method of the present invention, as described above, the contact surface of the terminal is thick, the both sides of the contact surface are gradually thinner toward the back surface of the contact surface, and the soldered portion of the other terminal is coated almost on all four sides. It is possible to plate the corrosion-resistant conductive metal uniformly and thinly, that is, thickly or thinly only in the necessary areas, saving expensive plating metal and eliminating the need to mask each terminal to prevent plating. Because there is no need for this process, partial plating can be performed on terminals with less man-hours.

A terminal partially plated by this method has a thick plating layer of a corrosion-resistant good conductor metal on the contact surface, and also has a graded plating layer of a corrosion-resistant good conductor metal on both sides of the contact surface as described above. Therefore, the surface may suffer from sulfurization, oxidation, or corrosion due to electrical contact caused by the surrounding atmosphere, and if both sides are not provided with corrosion-resistant plating, sulfurization and oxidation phenomena may intrude into the base metal of the contact surface. There is no risk of an increase in contact resistance or deterioration of connector performance due to There is no risk of surface sulfidation or oxidation, and therefore there is no problem with soldering during soldering or increasing the electrical resistance of the soldered part. Since the terminals are plated thickly or thinly only in the necessary areas and on all the necessary areas, the present invention can provide defect-free partially plated terminals at low cost.

[Brief explanation of the drawing]

Fig. 1 is a side view including a partial cross section of an electrical connector using the electrical terminal of the present invention, Fig. 2 is an explanatory diagram of an apparatus for carrying out the method of the present invention, and Figs. 3 and 4 are cross sections of the electrical connector shown in Fig. 2. ■−■,■
5 and 6 are enlarged sectional views of the contact surface portion and the soldering portion of the electrical terminal of the present invention, respectively. 1...Electrical terminal, 2...Connector board, 3...Through hole, 4...Soldering part, 6...
...Contact surface, 7...Jig, 10, 11...
...Vacancy, 12,13... Jet outlet, 14.
...Counterbore.

Claims (1)

[Scope of Claims] 1. A plate-shaped electrical terminal having a rectangular cross section and forming an electrical connector by having one pair of two electrical terminals, and near one tip of the electrical terminal, the two electrical terminals are arranged opposite to each other. In the electrical terminal, which has a contact surface with a mating member to be connected to the electrical connector on the side to be connected to the electrical connector, and whose intermediate part is soldered to the through hole of the connector board, the electrical terminal itself is divided into two appropriately shaped electrical terminals. These jigs include both sides of the contact surface of the electrical terminal, and the surface of the soldered part opposite the contact surface. Appropriate voids are provided on both side surfaces, and two jet ports are provided on the contact surface side that penetrate one of the elastic bodies at a substantially right angle to the electrical terminal surface and communicate with the voids, respectively. , from this jet port, a separately installed liquid feeding device sprays the pampering liquid in which the anodic, dumpling-resistant, electrically conductive material is immersed onto the surface exposed in the void of the electrical terminal that has been given the cathodic polarity; A method for partially plating electrical terminals. 2 A plate-shaped electrical terminal with a rectangular cross section that forms an electrical connector by having one pair of two electrical terminals, and near the tip of the electrical terminal 1, the electrical terminal is placed on the side where the two electrical terminals face each other. In an electrical terminal that has a contact surface with a mating member to be connected to a connector, and whose intermediate portion is soldered to a through hole of a connector board, the contact surface has a thick plating layer, and the contact surface has a thick plating layer. There is no plating layer on the back surface of the board, and there is a plating layer on both sides between the contact surface and the back surface, the thickness of which gradually decreases from the contact surface to the back surface, and the part to be soldered has a plating layer on the entire surface. 1. A partially plated electrical terminal having a thin plating layer, wherein each of the plating layers is made of a corrosion-resistant and highly conductive metal.