JP3400671B2 - Long metal strip plating method - Google Patents
Long metal strip plating methodInfo
- Publication number
- JP3400671B2 JP3400671B2 JP05696497A JP5696497A JP3400671B2 JP 3400671 B2 JP3400671 B2 JP 3400671B2 JP 05696497 A JP05696497 A JP 05696497A JP 5696497 A JP5696497 A JP 5696497A JP 3400671 B2 JP3400671 B2 JP 3400671B2
- Authority
- JP
- Japan
- Prior art keywords
- metal strip
- plating
- solder
- gold
- long metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気機器用接続部
品であるコネクタなどの各種端子、ＩＣリードフレーム
などのリード材などに用いられる長尺の金属条に金、半
田などのストライプめっきを施すためのめっき方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention applies a stripe plating such as gold or solder to a long metal strip used for various terminals such as connectors which are connecting parts for electric equipment and lead materials such as IC lead frames. The present invention relates to a plating method for
【０００２】[0002]
【従来の技術】従来、電気機器用接続部品であるコネク
タなどの各種端子或はＩＣリードフレームなどのリード
材などを製造するためには、例えば黄銅、バネ用りん青
銅のような銅合金などからなる長尺の金属条を用い、こ
の長尺金属条をプレス成形加工し、雄及び雌の連続端子
が形成される。2. Description of the Related Art Conventionally, for manufacturing various terminals such as connectors which are connecting parts for electric equipment or lead materials such as IC lead frames, copper alloys such as brass and phosphor bronze for springs have been used. By using this long metal strip, the long metal strip is press-formed to form male and female continuous terminals.
【０００３】つまり、図３に、電気機器用接続部品であ
るコネクタなどの各種端子を製造するための、従来使用
されている長尺金属条１の一例を示すが、プレス成形加
工後の長尺金属条１は、長手方向に連続したキヤリヤ部
２を有し、このキャリヤ部２に所定の間隔（Ｇ）にて端
子３が互に離間して接続された形状とされる。このよう
なプレス成形された長尺金属条１は、キヤリヤ部２が駆
動装置に係合駆動されることにより、連続してめっき設
備へと供給される。長尺金属条１にＮｉ或はＰｄ−Ｎｉ
などにて下地めっき（単に「下地Ｎｉめっき」とい
う。）をした後、この長尺金属条１の長手方向にストラ
イプ状に、即ち、端子先端部、即ち、接点部４には長さ
ＬA 領域に金或は金−コバルト合金などのめっき（単に
「金めっき」という。）が、又、端子３のキヤリヤ部
側、即ち、接続部５にはキヤリヤ部２をも含めて長さＬ
S 領域に半田めっきが施される。That is, FIG. 3 shows an example of a long metal strip 1 which has been conventionally used for manufacturing various terminals such as connectors which are connection parts for electric equipment. The metal strip 1 has a carrier portion 2 which is continuous in the longitudinal direction, and terminals 3 are connected to the carrier portion 2 at a predetermined distance (G) from each other. The press-formed long metal strip 1 is continuously supplied to the plating equipment by the carrier 2 being engaged and driven by the drive device. Ni or Pd-Ni on the long metal strip 1
After performing undercoating (simply referred to as "undercoating Ni plating") with a strip or the like, a striped pattern is formed in the longitudinal direction of the elongated metal strip 1, that is, the terminal tip portion, that is, the contact portion 4, has a length L A. The area is plated with gold or a gold-cobalt alloy (hereinafter simply referred to as "gold plating"), and the carrier portion side of the terminal 3, that is, the connecting portion 5 including the carrier portion 2, has a length L.
Solder plating is applied to the S area.
【０００４】このようなストライプ状めっき方法につい
て簡単に説明すると、図３に示すような端子３がプレス
成形された長尺金属条１は、先ず、Ｎｉめっき槽にて下
地Ｎｉめっきが施される。長尺金属条１は、水洗処理
後、キヤリヤ部２を上方に位置して搬送され、金めっき
槽にて長尺金属条１の接点部４が金めっきされる。次い
で、水洗処理後、長尺金属条１を、キャリヤ部２が下方
に位置するように反転して、半田めっき槽へと搬送して
接続部５及びキヤリヤ部２に半田めっきが施される。半
田めっき後は、水洗処理などをした後、封孔処理が行な
われる。封孔処理は、金めっき厚を薄くした場合に被膜
層に生じたピンホールを密封するための処理であって、
封孔処理には、各種の有機系或は無機系の薬品が使用さ
れる。The striped plating method will be briefly described. A long metal strip 1 on which terminals 3 as shown in FIG. 3 are press-molded is first plated with Ni as a base in a Ni plating bath. . After washing with water, the long metal strip 1 is conveyed with the carrier portion 2 positioned above, and the contact portion 4 of the long metal strip 1 is gold-plated in a gold plating bath. Next, after the water washing treatment, the long metal strip 1 is inverted so that the carrier portion 2 is located below and is conveyed to the solder plating tank, and the connection portion 5 and the carrier portion 2 are subjected to solder plating. After the solder plating, a sealing treatment is performed after a water washing treatment or the like. The sealing treatment is a treatment for sealing the pinhole generated in the coating layer when the gold plating thickness is reduced,
Various organic or inorganic chemicals are used for the sealing treatment.
【０００５】[0005]
【発明が解決しようとする課題】本発明者らは、上記め
っき方法について多くの研究実験を行なった結果、図３
に示すように、半田めっき領域（ＬS ）は、金めっき領
域（ＬA ）からＬG だけ離間して設定されているにもか
かわらず、半田めっきが金めっき領域にも付着してしま
い、品質の点で問題があることが分かった。DISCLOSURE OF THE INVENTION The present inventors have conducted many research experiments on the above plating method, and as a result, FIG.
As shown in, solder plating area (L S), despite the gold plated region (L A) is set spaced apart by L G, will solder plating adheres to the gold-plated region, It turned out to be a quality issue.
【０００６】本発明者らは、この問題を解決するべくそ
の原因を調べたところ、長尺金属条１に成形された端子
３と端子３との間の間隔（Ｇ）が、例えば０．３ｍｍ以
下といった極めて狭いものとされていることから、半田
めっきを行なう際に毛細管現象により、半田めっき液が
端子３と端子３との隙間（Ｇ）を通って上昇し、金めっ
き領域（ＬA ）にも半田めっきが行なわれるからである
ことが分かった。The present inventors have investigated the cause to solve this problem and found that the distance (G) between the terminals 3 formed on the long metal strip 1 is 0.3 mm, for example. because it is an extremely narrow such hereinafter, by capillary action when performing solder plating, solder plating solution rises through the gap (G) between the terminals 3 and 3, the gold-plated region (L a) It was found that the solder plating was also performed.
【０００７】従って、本発明の目的は、半田めっき工程
にて毛細管現象による半田めっき液の上昇を防止するこ
とによって金めっき領域に半田が付着するのを防止し、
長尺金属条に金、半田などのストライプめっきを高精度
且つ高品質にて行なうことのできる長尺金属条ストライ
プめっき方法を提供することである。Therefore, an object of the present invention is to prevent the solder from adhering to the gold plating area by preventing the solder plating solution from rising due to the capillary phenomenon in the solder plating step,
It is an object of the present invention to provide a long metal strip stripe plating method capable of performing strip plating of gold, solder or the like on a long metal strip with high precision and high quality.
【０００８】[0008]
【課題を解決するための手段】上記目的は本発明に係る
長尺金属条ストライプめっき方法にて達成される。要約
すれば、本発明は、連続したキャリヤ部に所定間隔にて
端子が接続された長尺の金属条を連続的に供給して、こ
の金属条に下地Ｎｉめっきをし、その後、金属条の長手
方向にストライプ状の金めっき及び半田めっきを行なう
長尺金属条ストライプめっき方法において、前記各端子
は、金めっき領域と半田領域との間に設けた継ぎ手部に
て連結し、半田めっきを行なう際に半田めっき液が金め
っき領域へと上昇するのを防止するようにしたことを特
徴とする長尺金属条ストライプめっき方法である。好ま
しくは、前記半田めっき処理後、金属条の少なくとも金
めっき領域に封孔処理を行なう。又、金属条のめっき処
理後、前記継ぎ手部は除去される。The above object can be achieved by the long metal strip stripe plating method according to the present invention. In summary, the present invention continuously supplies a long metal strip having terminals connected to a continuous carrier part at a predetermined interval, performs Ni plating on the metal strip, and thereafter, In a long metal strip stripe plating method for performing striped gold plating and solder plating in the longitudinal direction, each terminal is connected by a joint portion provided between a gold plating region and a solder region, and solder plating is performed. In this case, the long metal strip stripe plating method is characterized in that the solder plating solution is prevented from rising to the gold plating area. Preferably, after the solder plating treatment, a sealing treatment is performed on at least the gold-plated region of the metal strip. Further, the joint portion is removed after the plating treatment of the metal strip.
【０００９】[0009]
【発明の実施の形態】以下、本発明に係る長尺金属条ス
トライプめっき方法を図面に則して更に詳しく説明す
る。BEST MODE FOR CARRYING OUT THE INVENTION The long metal strip stripe plating method according to the present invention will now be described in more detail with reference to the drawings.
【００１０】図１に、本発明の長尺金属条ストライプめ
っき方法を実施するめっき設備の一実施例の概略構成を
示す。本実施例のめっき設備にて、図３に示すような電
気機器用接続部品であるコネクタの端子を製造するため
の長尺金属条１に金めっき及び半田めっきを施すものと
する。FIG. 1 shows a schematic configuration of an embodiment of plating equipment for carrying out the long metal strip stripe plating method of the present invention. In the plating equipment of this embodiment, the long metal strip 1 for producing the terminals of the connector, which is a connection component for electric equipment as shown in FIG. 3, is subjected to gold plating and solder plating.
【００１１】本発明に従えば、めっき処理工程に供され
るコネクタ端子用の金属条は、図２に示す構造とされ、
図３に示す金属条とは、各端子３が継ぎ手部７にて互に
連結されている点で異なる。According to the present invention, the metal strip for the connector terminal used in the plating process has the structure shown in FIG.
It differs from the metal strip shown in FIG. 3 in that the terminals 3 are connected to each other by a joint 7.
【００１２】つまり、本実施例においても、金属条１
は、図３に関連して説明したように、例えば厚さ０．２
ｍｍ、幅（Ｗ）２５ｍｍのバネ用りん青銅のような銅合
金などからなる長尺の金属条を用い、この長尺金属条を
プレス成形加工して作製される。端子金属条１は、図２
に示すように、連続したキヤリヤ部２に所定の間隔
（Ｇ）にて端子３が接続された形状とされる。ただ、本
発明によれば、各端子３は、金めっき領域（ＬA ）と半
田めっき領域（ＬS ）との間の領域（ＬG ）において互
に継ぎ手部７にて連結されている。That is, also in this embodiment, the metal strip 1
Has a thickness of, for example, 0.2 as described in connection with FIG.
A long metal strip made of a copper alloy such as phosphor bronze for spring having a width of 25 mm and a width (W) of 25 mm is used, and the long metal strip is press-molded. The terminal metal strip 1 is shown in FIG.
As shown in, the terminal 3 is connected to the continuous carrier portion 2 at a predetermined interval (G). However, according to the present invention, the terminals 3 are connected to each other by the joint portion 7 in the region (L G ) between the gold plating region (L A ) and the solder plating region (L S ).
【００１３】本実施例にて、端子３と端子３との間の間
隔（Ｇ）は０．３ｍｍとされ、端子３の長さ（ＬC ）は
１３ｍｍ、端子３の幅（ｗ）は０．６ｍｍとされた。
又、継ぎ手部７の幅（ＬT ）は領域（ＬG ）より小さく
され（ＬT ≦ＬG ）、本実施例では０．５ｍｍとされ
た。In this embodiment, the distance (G) between the terminals 3 is 0.3 mm, the length (L C ) of the terminals 3 is 13 mm, and the width (w) of the terminals 3 is 0 mm. It was set to 0.6 mm.
Further, the width (L T ) of the joint portion 7 is made smaller than the region (L G ) (L T ≤L G ), and is set to 0.5 mm in this embodiment.
【００１４】図２に示す形状にプレス成形された長尺の
端子金属条１は、キヤリヤ部２が駆動装置（図示せず）
に係合駆動され、連続してめっき設備へと供給される。
このとき、端子金属条１は、キヤリヤ部２が上方に位置
するようにして搬送される。本実施例で、端子金属条１
の移送速度は２ｍ／分とされた。In a long terminal metal strip 1 press-molded into the shape shown in FIG. 2, a carrier 2 has a drive unit (not shown).
Is continuously driven to be supplied to the plating equipment.
At this time, the terminal metal strip 1 is conveyed so that the carrier portion 2 is located above. In this embodiment, the terminal metal strip 1
The transfer speed was 2 m / min.
【００１５】図１にて、先ず、端子金属条１は、Ｎｉめ
っき槽１０にて全体がＮｉ下地めっき処理される。例え
ばＮｉめっき槽１０にて厚さ１．２７μｍにＮｉ下地め
っきされた端子金属条１は、水洗処理槽（図示せず）に
より水洗処理され、キヤリヤ部２を上方に位置したまま
搬送され、金めっき槽２０へと搬送される。本実施例に
て金めっき槽２０は３槽配置されているが、これに限定
されるものではない。各金めっき槽２０にて端子金属条
１は、端子先端部、即ち、接点部４が、本実施例では先
端から長さＬA ＝７．１ｍｍの長さに亙って、例えば厚
さ０．５μｍにて長手方向にストライプ状に金めっきさ
れる。次いで、端子金属条１は、水洗処理槽（図示せ
ず）により水洗処理される。In FIG. 1, first, the entire terminal metal strip 1 is subjected to Ni undercoating in a Ni plating bath 10. For example, the terminal metal strip 1 plated with Ni undercoat to a thickness of 1.27 μm in the Ni plating tank 10 is washed in a water washing tank (not shown) and is transported with the carrier portion 2 positioned above. It is transported to the plating tank 20. In this embodiment, three gold plating tanks 20 are arranged, but the number is not limited to this. In each gold plating tank 20, the terminal metal strip 1 has a terminal tip portion, that is, a contact portion 4 in the present embodiment over a length L A = 7.1 mm from the tip, for example, a thickness of 0. Gold plating is performed in a stripe shape in the longitudinal direction at 0.5 μm. Next, the terminal metal strip 1 is washed with water in a washing tank (not shown).
【００１６】上述のようにしてストライプ条に金めっき
された端子金属条１は、その後、乾燥装置（図示せず）
にて乾燥された後、キヤリヤ部２が下方に位置するよう
に反転装置６０にて反転され、半田めっき槽７０へと搬
送される。半田めっき槽７０では、端子３のキヤリヤ部
側、即ち、図２にて、接続部５及びキヤリヤ部２をも含
めた長さＬS 領域がめっき液（電解液）に浸漬され、こ
の領域（ＬS ）に半田めっきが施される。The terminal metal strip 1 plated with gold on the striped strip as described above is then dried by a drying device (not shown).
After being dried, the carrier portion 2 is inverted by the reversing device 60 so that the carrier portion 2 is located below, and conveyed to the solder plating tank 70. In the solder plating bath 70, the carrier portion side of the terminal 3, that is, the length L S region including the connecting portion 5 and the carrier portion 2 in FIG. 2 is immersed in the plating solution (electrolytic solution), and this region ( solder plating is applied to the L S).
【００１７】本実施例によれば、上述のように各端子３
は継ぎ手部７にて連結されているために、半田めっき槽
７０内のめっき液が毛細管現象によって端子３、３間の
間隙（Ｇ）を上昇したとしても、この継ぎ手部７により
更に金めっき領域ＬA へと上昇するのが阻止される。そ
の結果、接点部４の金めっき層に半田が付着するのを完
全に防止することができる。According to this embodiment, as described above, each terminal 3
Since they are connected by the joint portion 7, even if the plating solution in the solder plating bath 70 raises the gap (G) between the terminals 3 and 3 due to the capillary phenomenon, the joint portion 7 further increases the gold plating area. It is prevented from rising to L A. As a result, it is possible to completely prevent the solder from adhering to the gold plating layer of the contact portion 4.
【００１８】上記半田めっき処理の後は、水洗処理など
をした後、封孔処理槽（図示せず）へと供給され、金め
っき層に生じたピンホールを密封するために、少なくと
も金めっき領域（ＬA ）は封孔処理液中に浸漬し、電解
による封孔処理を行なう。封孔処理には、当業者には周
知の各種の有機系或は無機系の処理液が使用される。After the above-mentioned solder plating treatment, after performing a water washing treatment, etc., it is supplied to a sealing treatment tank (not shown), and at least the gold plating region is provided in order to seal the pinholes formed in the gold plating layer. (L A ) is immersed in a pore-sealing solution and subjected to electrolytic pore-sealing treatment. Various organic or inorganic treatment liquids well known to those skilled in the art are used for the sealing treatment.
【００１９】このようにして作製した端子金属条１は、
次いで、上記継ぎ手部７が除去され、図３に示すよう
に、領域（ＬG ）にノッチ６が形成される。その後、端
子３をキヤリヤ部２から切断し、コネクタの製造に供さ
れる。The terminal metal strip 1 thus produced is
Next, the joint portion 7 is removed, and the notch 6 is formed in the region (L G ) as shown in FIG. Thereafter, the terminal 3 is cut from the carrier portion 2 and used for manufacturing a connector.
【００２０】実際に、このようにして作製した端子３を
使用したコネクタに対して電気的試験、腐食試験などを
行なった。接触抵抗は１０ｍΩ以下であり、又耐食性も
良く、良好な結果を得ることができた。Actually, an electrical test and a corrosion test were conducted on the connector using the terminal 3 thus manufactured. The contact resistance was 10 mΩ or less, and the corrosion resistance was good, and good results could be obtained.
【００２１】[0021]
【発明の効果】以上説明したように、本発明の長尺金属
条のストライプめっき方法は、連続したキャリヤ部に所
定間隔にて端子が接続された長尺の金属条を連続的に供
給して、この金属条に下地Ｎｉめっきをし、その後、金
属条の長手方向にストライプ状の金めっき及び半田めっ
きを行なう長尺金属条ストライプめっき方法において、
前記各端子は、金めっき領域と半田領域との間に設けた
継ぎ手部にて連結し、半田めっきを行なう際に半田めっ
き液が金めっき領域へと上昇するのを防止する構成とさ
れるので、半田めっき工程にて毛細管現象による半田め
っき液の上昇を防止することができ、従って、金めっき
領域に半田が付着するのを防止し、長尺金属条に金、半
田などのストライプめっきを高精度且つ高品質にて行な
うことができる。As described above, according to the striped metal strip method of the present invention, continuous strips having terminals connected to a continuous carrier portion at predetermined intervals are continuously supplied. In this long metal strip stripe plating method, a base Ni plating is applied to this metal strip, and then striped gold plating and solder plating are performed in the longitudinal direction of the metal strip.
The terminals are connected by a joint provided between the gold plating area and the solder area to prevent the solder plating solution from rising to the gold plating area during solder plating. In the solder plating process, the rise of the solder plating solution due to the capillary phenomenon can be prevented, so that the solder can be prevented from adhering to the gold plating area and the stripe plating of gold, solder, etc. on the long metal strip can be enhanced. It can be performed with high accuracy and high quality.
【図１】本発明の長尺金属条ストライプめっき方法を実
施するためのめっき設備の概略構成図である。FIG. 1 is a schematic configuration diagram of plating equipment for carrying out the long metal strip stripe plating method of the present invention.
【図２】本発明に従っためっき設備に供される長尺金属
条の一実施例を示す正面図である。FIG. 2 is a front view showing an example of a long metal strip provided in a plating facility according to the present invention.
【図３】めっき処理後継ぎ手部を除去した長尺金属条の
一実施例を示す正面図である。FIG. 3 is a front view showing an example of a long metal strip from which a joint portion has been removed after plating.
１ 長尺金属条 ２ キヤリヤ部 ３ 端子 ４ 接点部 ５ 接続部 ６ ノッチ ７ 継ぎ手部 1 Long metal strip 2 Carrier section 3 terminals 4 contact points 5 connection 6 notches 7 joint section
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 5/00 - 7/12 H01L 23/50 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) C25D 5/00-7/12 H01L 23/50
Claims (3)
が接続された長尺の金属条を連続的に供給して、この金
属条に下地Ｎｉめっきをし、その後、金属条の長手方向
にストライプ状の金めっき及び半田めっきを行なう長尺
金属条ストライプめっき方法において、前記各端子は、
金めっき領域と半田領域との間に設けた継ぎ手部にて連
結し、半田めっきを行なう際に半田めっき液が金めっき
領域へと上昇するのを防止するようにしたことを特徴と
する長尺金属条ストライプめっき方法。1. A continuous metal strip, to which terminals are connected at a predetermined interval, is continuously supplied to a continuous carrier part, Ni is plated on the metal strip, and then the metal strip is formed in the longitudinal direction of the metal strip. In the long metal strip stripe plating method for performing striped gold plating and solder plating, each of the terminals is
A long wire which is connected by a joint portion provided between the gold plating area and the solder area to prevent the solder plating solution from rising to the gold plating area during solder plating. Metal strip stripe plating method.
とも金めっき領域に封孔処理を行なう請求項１の長尺金
属条ストライプめっき方法。2. The long metal strip stripe plating method according to claim 1, wherein after the solder plating treatment, a sealing treatment is performed on at least a gold plating region of the metal strip.
除去するようにした請求項１又は２の長尺金属条ストラ
イプめっき方法。3. The long metal strip stripe plating method according to claim 1, wherein the joint portion is removed after the plating of the metal strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05696497A JP3400671B2 (en) | 1997-02-25 | 1997-02-25 | Long metal strip plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05696497A JP3400671B2 (en) | 1997-02-25 | 1997-02-25 | Long metal strip plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10237688A JPH10237688A (en) | 1998-09-08 |
| JP3400671B2 true JP3400671B2 (en) | 2003-04-28 |
Family
ID=13042224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05696497A Expired - Fee Related JP3400671B2 (en) | 1997-02-25 | 1997-02-25 | Long metal strip plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3400671B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006083410A (en) * | 2004-09-14 | 2006-03-30 | Shinei Hitec:Kk | Method for manufacturing electronic part |
| JP2006083409A (en) * | 2004-09-14 | 2006-03-30 | Shinei Hitec:Kk | Ferro-alloy electronic part and surface treatment method therefor |
| JP2007217798A (en) * | 2007-05-23 | 2007-08-30 | Shinei Hitec:Kk | Surface treatment method for connection terminal for connector |
| JP2017107654A (en) * | 2015-12-07 | 2017-06-15 | タイコエレクトロニクスジャパン合同会社 | Contact and method of manufacturing the same |
-
1997
- 1997-02-25 JP JP05696497A patent/JP3400671B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10237688A (en) | 1998-09-08 |
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