JPS604523A - 絶縁樹脂ペ−スト - Google Patents

絶縁樹脂ペ−スト

Info

Publication number
JPS604523A
JPS604523A JP58111813A JP11181383A JPS604523A JP S604523 A JPS604523 A JP S604523A JP 58111813 A JP58111813 A JP 58111813A JP 11181383 A JP11181383 A JP 11181383A JP S604523 A JPS604523 A JP S604523A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing
resin
paste
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58111813A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038374B2 (enrdf_load_stackoverflow
Inventor
Shigenori Yamaoka
重徳 山岡
Toshinaga Endo
遠藤　歳永
Ryuzo Nakatsuka
中塚　隆三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP58111813A priority Critical patent/JPS604523A/ja
Publication of JPS604523A publication Critical patent/JPS604523A/ja
Publication of JPH038374B2 publication Critical patent/JPH038374B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Organic Insulating Materials (AREA)
JP58111813A 1983-06-23 1983-06-23 絶縁樹脂ペ−スト Granted JPS604523A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58111813A JPS604523A (ja) 1983-06-23 1983-06-23 絶縁樹脂ペ−スト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58111813A JPS604523A (ja) 1983-06-23 1983-06-23 絶縁樹脂ペ−スト

Publications (2)

Publication Number Publication Date
JPS604523A true JPS604523A (ja) 1985-01-11
JPH038374B2 JPH038374B2 (enrdf_load_stackoverflow) 1991-02-05

Family

ID=14570798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58111813A Granted JPS604523A (ja) 1983-06-23 1983-06-23 絶縁樹脂ペ−スト

Country Status (1)

Country Link
JP (1) JPS604523A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61185526A (ja) * 1985-02-13 1986-08-19 Nemoto Tokushu Kagaku Kk 着色ペ−スト
JPS63159428A (ja) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd 絶縁樹脂ペ−スト
JPH01118563A (ja) * 1987-10-30 1989-05-11 Toshiba Chem Corp 絶縁性ペースト
JPH01182358A (ja) * 1988-01-14 1989-07-20 Matsushita Electric Works Ltd エポキシ樹脂成形材料の製造方法
JPH01266727A (ja) * 1988-04-18 1989-10-24 Hitachi Chem Co Ltd 樹脂ペースト
JPH0245575A (ja) * 1988-08-08 1990-02-15 Toto Kasei Kk 自己融着性絶縁塗料
JPH02105430A (ja) * 1988-10-13 1990-04-18 Nec Corp 半導体装置
JPH02110125A (ja) * 1988-10-19 1990-04-23 Mitsubishi Plastics Ind Ltd 高熱伝導性樹脂組成物
US4942190A (en) * 1987-10-27 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Thermosetting insulating resin paste
JP2008266629A (ja) * 2007-03-29 2008-11-06 Nippon Shokubai Co Ltd 樹脂組成物及び光学部材
CN104531022A (zh) * 2014-12-16 2015-04-22 惠州力王佐信科技有限公司 一种绝缘高导热粘接材料及其制备方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61185526A (ja) * 1985-02-13 1986-08-19 Nemoto Tokushu Kagaku Kk 着色ペ−スト
JPS63159428A (ja) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd 絶縁樹脂ペ−スト
US4942190A (en) * 1987-10-27 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Thermosetting insulating resin paste
JPH01118563A (ja) * 1987-10-30 1989-05-11 Toshiba Chem Corp 絶縁性ペースト
JPH01182358A (ja) * 1988-01-14 1989-07-20 Matsushita Electric Works Ltd エポキシ樹脂成形材料の製造方法
JPH01266727A (ja) * 1988-04-18 1989-10-24 Hitachi Chem Co Ltd 樹脂ペースト
JPH0245575A (ja) * 1988-08-08 1990-02-15 Toto Kasei Kk 自己融着性絶縁塗料
JPH02105430A (ja) * 1988-10-13 1990-04-18 Nec Corp 半導体装置
JPH02110125A (ja) * 1988-10-19 1990-04-23 Mitsubishi Plastics Ind Ltd 高熱伝導性樹脂組成物
JP2008266629A (ja) * 2007-03-29 2008-11-06 Nippon Shokubai Co Ltd 樹脂組成物及び光学部材
CN104531022A (zh) * 2014-12-16 2015-04-22 惠州力王佐信科技有限公司 一种绝缘高导热粘接材料及其制备方法

Also Published As

Publication number Publication date
JPH038374B2 (enrdf_load_stackoverflow) 1991-02-05

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