JPS6043894A - 厚膜回路の形成方法 - Google Patents

厚膜回路の形成方法

Info

Publication number
JPS6043894A
JPS6043894A JP58152021A JP15202183A JPS6043894A JP S6043894 A JPS6043894 A JP S6043894A JP 58152021 A JP58152021 A JP 58152021A JP 15202183 A JP15202183 A JP 15202183A JP S6043894 A JPS6043894 A JP S6043894A
Authority
JP
Japan
Prior art keywords
thick film
drawing nozzle
substrate
nozzle
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58152021A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0370394B2 (https=
Inventor
幸男 前田
慎一 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58152021A priority Critical patent/JPS6043894A/ja
Priority to US06/638,713 priority patent/US4664945A/en
Priority to DE8484305439T priority patent/DE3468153D1/de
Priority to EP84305439A priority patent/EP0136020B1/en
Priority to CA000461027A priority patent/CA1231464A/en
Publication of JPS6043894A publication Critical patent/JPS6043894A/ja
Publication of JPH0370394B2 publication Critical patent/JPH0370394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
JP58152021A 1983-08-19 1983-08-19 厚膜回路の形成方法 Granted JPS6043894A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58152021A JPS6043894A (ja) 1983-08-19 1983-08-19 厚膜回路の形成方法
US06/638,713 US4664945A (en) 1983-08-19 1984-08-08 Method of forming thick film circuits
DE8484305439T DE3468153D1 (en) 1983-08-19 1984-08-09 Method and apparatus of forming patterns in thick film circuit or the like
EP84305439A EP0136020B1 (en) 1983-08-19 1984-08-09 Method and apparatus of forming patterns in thick film circuit or the like
CA000461027A CA1231464A (en) 1983-08-19 1984-08-15 Method and apparatus of forming thick film circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58152021A JPS6043894A (ja) 1983-08-19 1983-08-19 厚膜回路の形成方法

Publications (2)

Publication Number Publication Date
JPS6043894A true JPS6043894A (ja) 1985-03-08
JPH0370394B2 JPH0370394B2 (https=) 1991-11-07

Family

ID=15531323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58152021A Granted JPS6043894A (ja) 1983-08-19 1983-08-19 厚膜回路の形成方法

Country Status (5)

Country Link
US (1) US4664945A (https=)
EP (1) EP0136020B1 (https=)
JP (1) JPS6043894A (https=)
CA (1) CA1231464A (https=)
DE (1) DE3468153D1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018003000A1 (ja) * 2016-06-28 2018-01-04 富士機械製造株式会社 回路形成方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108926A (en) * 1987-09-08 1992-04-28 Board Of Regents, The University Of Texas System Apparatus for the precise positioning of cells
JPH01319990A (ja) * 1988-06-22 1989-12-26 Sumitomo Electric Ind Ltd 厚膜形成方法
US5232736A (en) * 1989-07-24 1993-08-03 Motorola, Inc. Method for controlling solder printer
JPH0494592A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールに対する充填材の充填方法
JPH0496400A (ja) * 1990-08-13 1992-03-27 Cmk Corp シールド層を備えるプリント配線板の製造方法
US5298288A (en) * 1991-02-14 1994-03-29 Microelectronics And Computer Technology Corporation Coating a heat curable liquid dielectric on a substrate
US5151377A (en) * 1991-03-07 1992-09-29 Mobil Solar Energy Corporation Method for forming contacts
US5641644A (en) * 1994-12-09 1997-06-24 Board Of Regents, The University Of Texas System Method and apparatus for the precise positioning of cells
DE10004976C1 (de) 2000-02-04 2001-09-13 Foerdergemeinschaft Baeume Fue Verfahren zum großflächigen Aufforsten
US6701835B2 (en) 2001-07-31 2004-03-09 Pilkington North America, Inc. Method for placing indicia on substrates
JP4039035B2 (ja) * 2001-10-31 2008-01-30 セイコーエプソン株式会社 線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体
US20040238202A1 (en) * 2003-06-02 2004-12-02 Ohmcraft Inc. Method of making an inductor with written wire and an inductor made therefrom
US20070169806A1 (en) * 2006-01-20 2007-07-26 Palo Alto Research Center Incorporated Solar cell production using non-contact patterning and direct-write metallization
US7999175B2 (en) * 2008-09-09 2011-08-16 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with laser ablated grooves
US9150966B2 (en) * 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
US20120038031A1 (en) * 2009-01-06 2012-02-16 1366 Technologies Inc. Dispensing liquid containing material to patterned surfaces using a dispensing tube
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
US20130089656A1 (en) * 2011-10-07 2013-04-11 Sage Electrochromics, Inc. Direct dispense device and method
DE112020003653T5 (de) * 2019-07-29 2022-04-21 Xtpl S.A. Verfahren zum Abgeben einer metallischen Nanopartikelzusammensetzung aus einer Düse auf ein Substrat

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3645232A (en) * 1970-03-10 1972-02-29 Globe Union Inc Apparatus for simultaneously applying a plurality of coatings to a substrate
US3961599A (en) * 1971-08-12 1976-06-08 Air Products And Chemicals, Inc. Apparatus for making miniature layer resistors on insulating chips by digital controls
US3800020A (en) * 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
US3864695A (en) * 1972-09-25 1975-02-04 Asahi Optical Co Ltd Pen having vertical movement control
US3820121A (en) * 1972-10-13 1974-06-25 Gerber Scientific Instr Co Apparatus for expressing a writing fluid
DE2319997C2 (de) * 1973-04-19 1975-06-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung mehrlagiger Leiterbahnenstrukturen auf einem Substrat mittels eines programmgesteuerten, für die Leiterbahnenherstellung herangezogenen Werkzeuges
DE2319998C2 (de) * 1973-04-19 1975-06-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung mehrlagiger Leiterbahnenstrukturen auf einem Substrat mittels eines programmgesteuerten, für die Leiterbahnenherstellung herangezogenen Werkzeuges
US4133910A (en) * 1977-12-01 1979-01-09 The United States Of America As Represented By The Secretary Of The Army Thick film deposition of microelectronic circuit
US4324815A (en) * 1978-01-24 1982-04-13 Mitani Electronics Industry Corp. Screen-printing mask and method
US4327124A (en) * 1978-07-28 1982-04-27 Desmarais Jr Raymond C Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface
US4291642A (en) * 1979-12-26 1981-09-29 Rca Corporation Nozzle for dispensing viscous fluid
US4338351A (en) * 1980-09-10 1982-07-06 Cts Corporation Apparatus and method for producing uniform fired resistors
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018003000A1 (ja) * 2016-06-28 2018-01-04 富士機械製造株式会社 回路形成方法

Also Published As

Publication number Publication date
EP0136020B1 (en) 1987-12-16
DE3468153D1 (en) 1988-01-28
US4664945A (en) 1987-05-12
JPH0370394B2 (https=) 1991-11-07
CA1231464A (en) 1988-01-12
EP0136020A2 (en) 1985-04-03
EP0136020A3 (en) 1985-06-19

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