JPS6042612B2 - Semiconductor device parts mounting machine - Google Patents
Semiconductor device parts mounting machineInfo
- Publication number
- JPS6042612B2 JPS6042612B2 JP53002239A JP223978A JPS6042612B2 JP S6042612 B2 JPS6042612 B2 JP S6042612B2 JP 53002239 A JP53002239 A JP 53002239A JP 223978 A JP223978 A JP 223978A JP S6042612 B2 JPS6042612 B2 JP S6042612B2
- Authority
- JP
- Japan
- Prior art keywords
- collet
- semiconductor device
- suction
- collets
- mounting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はダイボンディング等の半導体装置部品の装着に
使用する装着機及ひ装着方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting machine and a mounting method used for mounting semiconductor device components such as die bonding.
〔従来の技術〕トランジスタ、ＩＣ等の半導体装置の製
造にあたつて、半導体ペレットその他の半導体装置部品
をパッケージ基板に装着するダイボンディング等の工程
が必要である。ダイボンディング等の工程において、ウ
ェハより所定の大きさに分割されたペレット等の半導体
装置部品をコレットに吸着保持して基板上に移送し、基
板に押しつけて装着する装着機及び方法が従来から使用
されている。〔本発明か解決すべき問題点〕しかし、半
導体ペレットについて言えば、コレットの大きさは吸着
すべきペレットの大きさに合せて正確に製作されており
、ひとつのコレットはある１種類のペレットにしか使用
できない。[Prior Art] In manufacturing semiconductor devices such as transistors and ICs, processes such as die bonding are necessary to attach semiconductor pellets and other semiconductor device components to a package substrate. In processes such as die bonding, mounting machines and methods have traditionally been used in which semiconductor device parts such as pellets, which are divided into predetermined sizes from a wafer, are held by suction in a collet, transferred onto a substrate, and mounted by pressing them onto the substrate. has been done. [Problem to be solved by the present invention] However, when it comes to semiconductor pellets, the size of the collet is manufactured precisely according to the size of the pellet to be adsorbed, and one collet is not suitable for one type of pellet. can only be used.
従つて、別の種類のペレットを装着するためには、すで
に使用していたコレットを装着機から取りはずして、対
応する別のコレットに交換する必要があつた。しかも、
このコレットの交換には約２時間を要し、極めて非能率
的てあり、量産化、省力化の妨げとなつていた。このよ
うな事情から、半導体装置部品の装着機は１品種につい
ての専用機となり、経済的に大きな問題であつた。〔問
題点を解決するための手段〕
本発明はかかる従来の実状にかんがみて、多品種の半導
体装置部品の装着をコレットの交換なしに実施てきる半
導体装置部品装着機及び装着方法を提供するものである
。Therefore, in order to load a different type of pellet, it is necessary to remove the collet that has already been used from the loading machine and replace it with another corresponding collet. Moreover,
It takes about two hours to replace the collet, which is extremely inefficient and hinders mass production and labor saving. Due to these circumstances, the mounting machine for semiconductor device components has become a dedicated machine for one type of product, which has been a big economic problem. [Means for Solving the Problems] In view of the conventional situation, the present invention provides a semiconductor device component mounting machine and a mounting method that can mount a wide variety of semiconductor device components without replacing collets. It is.
即ち、本発明はマルチコレット取り付け本体・と、該マ
ルチコレット取り付け本体に設けられ複数種の半導体装
置部品に対応した複数のコレットと、前記半導体装置部
品を前記コレットに吸引保持するための吸引手段と、前
記複数のコレットの少なくともひとつを選択的に吸引動
作させるため・の吸引選択手段とを具備した半導体装置
部品装着機を提供する。That is, the present invention provides a multi-collet mounting body, a plurality of collets provided on the multi-collet mounting body and corresponding to a plurality of types of semiconductor device components, and a suction means for sucking and holding the semiconductor device components to the collet. and a suction selection means for selectively suctioning at least one of the plurality of collets.
また、本発明はマルチコレット取り付け本体、に設けら
れた複数のコレットから取り付けられるべき半導体装置
部品に対応した少なくともひとつのコレットを選択する
工程と、この選択されたコレットに前記半導体装置部品
を吸着保持する工程と、この吸着保持された半導体装置
部品を半導体装置の所定位置に装着する工程を含む、半
導体装置部品の装着方法を提供する。The present invention also includes a step of selecting at least one collet corresponding to a semiconductor device component to be mounted from a plurality of collets provided in the multi-collet mounting body, and holding the semiconductor device component by suction on the selected collet. A method for mounting a semiconductor device component is provided, which includes a step of attaching the suction-held semiconductor device component to a predetermined position of a semiconductor device.
第１図及び第２図に従つて本発明の一実施例を説明する
。An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
略円板状のマルチコレット取り付け本体１の外周にコレ
ット接合部２ａ，２ｂ，２ｃ，２ｄに４個の形状及び大
きさの異なるコレット１０ａ，１０ｂ，１０ｃ，１０ｄ
が設置してある。Four collets 10a, 10b, 10c, 10d having different shapes and sizes are installed at collet joints 2a, 2b, 2c, and 2d on the outer periphery of the substantially disc-shaped multi-collet mounting body 1.
has been installed.
この本体１の裏面中央には装着機のアーム２０の挿入孔
が設けられ、このアーム挿入孔の周囲にはアーム２０に
取り付けた本体固定ナット２１と螺合するネジ部３が設
けられ、マルチコレット取り付け本体１はアーム２０の
回りて回転でき且つ適当なコレットを下記の如く選択固
定てきる。各コレット１０ａ，１０ｂ，１０ｃ，１０ｄ
には半導体装置部品を吸着するための吸引孔が夫々設け
られ装着機の吸引源を含む吸引手段と連絡てきる。即ち
、各コレット１０ａ，１０ｂ，１０ｃ，１０ｄの吸引孔
はアーム挿入孔にマルチコレット取り付け本体，１内の
吸引路４ａ，４ｂ，４ｃ，４ｄを介して連絡し、この吸
引路４ａ，４ｂ，４ｃ，４ｄの任意のひとつは吸引選択
手段てある固定ナット２１とネジ部３によりアーム挿入
孔に挿入されたアーム２０の吸引孔２２と連通させるこ
とにより真空ポ丁ンプなどの吸引源に連絡できる。ある
半導体装置部品８を装着するのに使用するコレット、例
えば２ｃ選択する場合について説明する。An insertion hole for the arm 20 of the mounting machine is provided in the center of the back surface of the main body 1, and a threaded portion 3 is provided around this arm insertion hole to be screwed into the main body fixing nut 21 attached to the arm 20. The mounting body 1 can be rotated around the arm 20 and a suitable collet can be selected and fixed as described below. Each collet 10a, 10b, 10c, 10d
A suction hole for suctioning semiconductor device components is provided in each of the suction holes and communicates with suction means including a suction source of the mounting machine. That is, the suction holes of each collet 10a, 10b, 10c, and 10d communicate with the arm insertion hole via suction passages 4a, 4b, 4c, and 4d in the multi-collet mounting body 1, and these suction passages 4a, 4b, and 4c. , 4d can be connected to a suction source such as a vacuum pump by communicating with the suction hole 22 of the arm 20 inserted into the arm insertion hole through the fixing nut 21 and the screw portion 3, which are suction selection means. A case will be described in which a collet, for example 2c, to be used for mounting a certain semiconductor device component 8 is selected.
即ち、アーム２０に挿入したマルチコレット取り付け本
体１を回転させてコレット２ｃの吸引孔を吸引路４ｃを
介してアーム２０の吸引孔２２と連通させ、その位置て
固定ナット２１を締てマルチコレットを固定する。この
結果、吸引手段と連絡したコレット２ｃのみが吸引動作
できるようになり、他のコレットの吸引孔は吸引手段か
ら遮断される。このようにした選択された特定のコレッ
トのみ導体装置部品を吸着保持し、装着すべき位置に移
動させ、装着を終了する。That is, the multi-collet mounting body 1 inserted into the arm 20 is rotated to communicate the suction hole of the collet 2c with the suction hole 22 of the arm 20 via the suction path 4c, and the fixing nut 21 is tightened at that position to attach the multi-collet. Fix it. As a result, only the collet 2c that communicates with the suction means can perform a suction operation, and the suction holes of the other collets are blocked from the suction means. Only the selected specific collet attracts and holds the conductor device component, moves it to the position where it is to be mounted, and completes the mounting.
この実施例ては４個のコレットを有する例を示したが、
これに限られず更に多数のコレットを備えてもよい。In this example, an example having four collets was shown, but
The present invention is not limited to this, and a larger number of collets may be provided.
本発明によれば、装着すべき半導体装置部品の種類及び
大きさ等に応じて、マルチコレットを回転させて対応す
るコレットを簡単に選択採用できるので、１またはそれ
以上のマルチコレットを備えた１機の装着機て複数種の
半導体装置部品をコレットの交換なく効率的に、作業性
良く装着てきる。According to the present invention, it is possible to easily select and adopt a corresponding collet by rotating the multi-collet according to the type and size of the semiconductor device component to be mounted. To efficiently and efficiently mount multiple types of semiconductor device parts without replacing collets using a mounter.
１機の装着機のみて多種多用の半導体装置部品を装着で
きるのでコスト、場所、時間において非常に経済的であ
る。Since a wide variety of semiconductor device parts can be mounted using only one mounting machine, it is very economical in terms of cost, space, and time.
第１図は本発明の装着機のアームに取り付けたマルチコ
レットの十既略断面図てある。
第２図は第１図の■−■線に沿つた断面図である。１・
・・・・・本体、１０ａ，１０ｂ，１０ｃ，１０ｄ・・
コレット、２０・・・・・・アーム。FIG. 1 is a schematic cross-sectional view of a multi-collet attached to an arm of a mounting machine according to the present invention. FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. 1・
...Main body, 10a, 10b, 10c, 10d...
Colette, 20...arm.
Claims (1)
取り付け本体に設けられ複数種の半導体装置部品に対応
した複数のコレットと、前記半導体装置部品を前記コレ
ットに吸引保持するための吸引手段と、前記複数のコレ
ットの少なくともひとつを選択的に吸引動作させるたの
吸引選択手段とを具備した半導体装置部品装着機。 ２ 前記吸引選択手段はマルチコレット取り付け本体を
回転させて複数のコレットの少なくともひとつのコレッ
トの吸引孔を吸引源と連通させることにより、該少なく
ともひとつのコレットを吸引動作させることを特徴とす
る、特許請求の範囲第１項の半導体装置部品装着機。[Scope of Claims] 1. A multi-collet mounting body, a plurality of collets provided on the multi-collet mounting body and corresponding to a plurality of types of semiconductor device components, and suction means for sucking and holding the semiconductor device components to the collets. and a suction selection means for selectively suctioning at least one of the plurality of collets. 2. The suction selection means rotates the multi-collet mounting body to communicate the suction hole of at least one collet of the plurality of collets with a suction source, thereby causing the at least one collet to perform a suction operation. A semiconductor device component mounting machine according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53002239A JPS6042612B2 (en) | 1978-01-12 | 1978-01-12 | Semiconductor device parts mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53002239A JPS6042612B2 (en) | 1978-01-12 | 1978-01-12 | Semiconductor device parts mounting machine |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1943385A Division JPS60186034A (en) | 1985-02-04 | 1985-02-04 | Multicollet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5494876A JPS5494876A (en) | 1979-07-26 |
| JPS6042612B2 true JPS6042612B2 (en) | 1985-09-24 |
Family
ID=11523797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53002239A Expired JPS6042612B2 (en) | 1978-01-12 | 1978-01-12 | Semiconductor device parts mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042612B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57103327A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Pellet positioning jig |
| JPS58223342A (en) * | 1982-06-22 | 1983-12-24 | Toshiba Corp | Positioning device for lead frame |
| JPS59210647A (en) * | 1983-05-14 | 1984-11-29 | Matsushita Electric Ind Co Ltd | Pellet bonding device |
| JPS60117741A (en) * | 1983-11-30 | 1985-06-25 | Fuji Xerox Co Ltd | Method and device for die bonding |
| JPS6136938A (en) * | 1984-07-30 | 1986-02-21 | Toshiba Corp | Bonding device for semiconductor device |
| JPS6260038U (en) * | 1985-10-04 | 1987-04-14 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50124573A (en) * | 1974-03-11 | 1975-09-30 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51102173U (en) * | 1975-02-14 | 1976-08-17 |
-
1978
- 1978-01-12 JP JP53002239A patent/JPS6042612B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50124573A (en) * | 1974-03-11 | 1975-09-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5494876A (en) | 1979-07-26 |
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