JPS57103327A - Pellet positioning jig - Google Patents

Pellet positioning jig

Info

Publication number
JPS57103327A
JPS57103327A JP17886180A JP17886180A JPS57103327A JP S57103327 A JPS57103327 A JP S57103327A JP 17886180 A JP17886180 A JP 17886180A JP 17886180 A JP17886180 A JP 17886180A JP S57103327 A JPS57103327 A JP S57103327A
Authority
JP
Japan
Prior art keywords
pellet
recesses
recess
positoning
positioning jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17886180A
Other languages
Japanese (ja)
Inventor
Hitoshi Horimuki
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17886180A priority Critical patent/JPS57103327A/en
Publication of JPS57103327A publication Critical patent/JPS57103327A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To facilitate the positioning and exhanging of a pellet of various different sizes by providing a plurality of recesses for containing the pellets of different size at the pellet positioning jig for bonding a semiconductor pellet. CONSTITUTION:Positoning recesses 10 of different size are formed at pellet positoning jigs. That is, the recess formed at one end is minimized, and the recesses formed toward the other end are gradually increased to maxmimize the recess formed at the other end. In this structure, the respective recesses are formed in inverted trapezoidal shape in section with square planar shape, the opening area is maximized, and the area is gradually decreased along the oblique surface 12. The bottom, i.e., the pellet placing surface 14 is slightly larger than the pellet to be positioned on a pellet placing surface 14, and a suction hole 16 for sucking the pellet is opened. Individual poitioning unit 20A-20D may be formed for each recess 10, and their length a is the same with each other and is interchangeable.
JP17886180A 1980-12-19 1980-12-19 Pellet positioning jig Pending JPS57103327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17886180A JPS57103327A (en) 1980-12-19 1980-12-19 Pellet positioning jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17886180A JPS57103327A (en) 1980-12-19 1980-12-19 Pellet positioning jig

Publications (1)

Publication Number Publication Date
JPS57103327A true JPS57103327A (en) 1982-06-26

Family

ID=16055960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17886180A Pending JPS57103327A (en) 1980-12-19 1980-12-19 Pellet positioning jig

Country Status (1)

Country Link
JP (1) JPS57103327A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5782152A (en) * 1995-08-15 1998-07-21 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5800661A (en) * 1995-08-15 1998-09-01 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5870937A (en) * 1995-08-15 1999-02-16 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5906363A (en) * 1995-08-15 1999-05-25 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials

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