JPS6039291U - Tightening mechanism for electronic components - Google Patents

Tightening mechanism for electronic components

Info

Publication number
JPS6039291U
JPS6039291U JP13083083U JP13083083U JPS6039291U JP S6039291 U JPS6039291 U JP S6039291U JP 13083083 U JP13083083 U JP 13083083U JP 13083083 U JP13083083 U JP 13083083U JP S6039291 U JPS6039291 U JP S6039291U
Authority
JP
Japan
Prior art keywords
rigid body
tightening mechanism
contact
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13083083U
Other languages
Japanese (ja)
Other versions
JPH0414956Y2 (en
Inventor
桜田　和久
Original Assignee
株式会社トーキン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社トーキン filed Critical 株式会社トーキン
Priority to JP13083083U priority Critical patent/JPS6039291U/en
Publication of JPS6039291U publication Critical patent/JPS6039291U/en
Application granted granted Critical
Publication of JPH0414956Y2 publication Critical patent/JPH0414956Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の回路基板に部品素子の実装態様を示す図
、第２図は本案の一例を示す断面図、第３図は第２剛体
の一例を示す斜視図、第４図は第２剛体の他の例を示す
側面図である。 ２・・・放熱板、３・・・半導体素子、１１・・・第１
の剛体、１２・・・第２の剛体、１２ｂ・・・突起、１
３′・・・ネジ。Fig. 1 is a diagram showing how components and elements are mounted on a conventional circuit board, Fig. 2 is a cross-sectional view showing an example of the present invention, Fig. 3 is a perspective view showing an example of the second rigid body, and Fig. 4 is a diagram showing the second rigid body. FIG. 7 is a side view showing another example of a rigid body. 2... Heat sink, 3... Semiconductor element, 11... First
rigid body, 12... second rigid body, 12b... protrusion, 1
3'...screw.

Claims (1)

【実用新案登録請求の範囲】 １　電子部品を回路基板あるいは放熱板に密着させる締
付機構において、電子部品の背面を前記回路基板又は放
熱板に当接し、電子部品の表面に当接し舌片が外方を向
いているＬ字形の第１の剛体と、前記回路基板あるいは
放熱板に当接する面と第１の剛体とに当接する面を有す
るＬ字形の第２の剛体とで構成し、第１の剛体及び第２
の剛体が当接する面でいずれか一方に突起が形成され、
しかも第１の剛体と第２の剛体とを突起より回路基板あ
るいは放熱板に近い個所でネジ止めすることにより構成
したことを特徴とする電子部品の締付機構。 ２　前記第１あるいは第２の剛体の少なくとも一方が形
状記憶合金材で構成された実用新案登録請求の範囲第１
項記載の電子部品の締付機構。[Claims for Utility Model Registration] 1. In a tightening mechanism that brings an electronic component into close contact with a circuit board or a heat sink, the rear side of the electronic component is brought into contact with the circuit board or the heat sink, and the tongue piece is brought into contact with the surface of the electronic component. an L-shaped first rigid body facing outward; an L-shaped second rigid body having a surface that comes into contact with the circuit board or the heat sink and a surface that comes into contact with the first rigid body; 1 rigid body and the second
A protrusion is formed on either side of the surface that the rigid body contacts,
Moreover, a tightening mechanism for an electronic component is characterized in that the first rigid body and the second rigid body are screwed together at a location closer to the circuit board or the heat sink than the protrusion. 2 Utility model registration claim 1, in which at least one of the first or second rigid body is made of a shape memory alloy material
Tightening mechanism for electronic components as described in section.
JP13083083U 1983-08-24 1983-08-24 Tightening mechanism for electronic components Granted JPS6039291U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13083083U JPS6039291U (en) 1983-08-24 1983-08-24 Tightening mechanism for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13083083U JPS6039291U (en) 1983-08-24 1983-08-24 Tightening mechanism for electronic components

Publications (2)

Publication Number Publication Date
JPS6039291U true JPS6039291U (en) 1985-03-19
JPH0414956Y2 JPH0414956Y2 (en) 1992-04-03

Family

ID=30295989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13083083U Granted JPS6039291U (en) 1983-08-24 1983-08-24 Tightening mechanism for electronic components

Country Status (1)

Country Link
JP (1) JPS6039291U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60163775U (en) * 1984-04-05 1985-10-30 富士通テン株式会社 Fixed structure of stacking equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195887U (en) * 1981-06-05 1982-12-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195887U (en) * 1981-06-05 1982-12-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60163775U (en) * 1984-04-05 1985-10-30 富士通テン株式会社 Fixed structure of stacking equipment

Also Published As

Publication number Publication date
JPH0414956Y2 (en) 1992-04-03

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