JPS6039245U - Wire bonding positioning mark - Google Patents
Wire bonding positioning markInfo
- Publication number
- JPS6039245U JPS6039245U JP13130883U JP13130883U JPS6039245U JP S6039245 U JPS6039245 U JP S6039245U JP 13130883 U JP13130883 U JP 13130883U JP 13130883 U JP13130883 U JP 13130883U JP S6039245 U JPS6039245 U JP S6039245U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- positioning mark
- bonding positioning
- chips
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のワイヤーボンディング前の回路基板の平
面図、第２図は本考案のワイヤーボンディング前の回路
基板の平面図。
１．１１・・・回路基板、２〜４，１２〜１４・・・Ｉ
Ｃチップ、５〜１０．１５〜１８・・・位置決めマーク
。FIG. 1 is a plan view of a conventional circuit board before wire bonding, and FIG. 2 is a plan view of the circuit board of the present invention before wire bonding. 1.11...Circuit board, 2-4, 12-14...I
C chip, 5-10.15-18...positioning mark.
Claims (1)
合に於て、基板上に設けられたワイヤーボンディングの
位置決めマークが複数のＩＣチップに共通に使用される
ことを特徴とするワイヤーボンディングの位置決めマー
ク。Wire bonding characterized in that when a plurality of IC chips are mounted on the same side of a substrate, a wire bonding positioning mark provided on the substrate is commonly used for the plurality of IC chips. positioning mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13130883U JPS6039245U (en) | 1983-08-24 | 1983-08-24 | Wire bonding positioning mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13130883U JPS6039245U (en) | 1983-08-24 | 1983-08-24 | Wire bonding positioning mark |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6039245U true JPS6039245U (en) | 1985-03-19 |
Family
ID=30296902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13130883U Pending JPS6039245U (en) | 1983-08-24 | 1983-08-24 | Wire bonding positioning mark |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039245U (en) |
-
1983
- 1983-08-24 JP JP13130883U patent/JPS6039245U/en active Pending
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