JPS6037798A - Printed board and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board and a method for manufacturing the same.

Conventionally, as a printed circuit board, there is a resin printed circuit board in which a wiring layer is formed on a resin board. However, as electronic devices become smaller, the density of component mounting on boards has increased, which has increased the amount of heat emitted from components, whereas resin printed circuit boards have sufficient heat dissipation. As a result, the temperature near the board rises, causing a decline in the functionality of the mounted components, which is a major problem. Also, as the number of mounted components increases, resin printed circuit boards have low bending rigidity, so
Since the board is warped, it becomes impossible to insert the board into the main body, and in the worst case, it may come into contact with an adjacent board, seriously affecting the circuit.

Furthermore, resin printed circuit boards have poor sole effect, so
Noise etc. cannot be prevented.

This invention was made to solve two problems.The first objective is to provide a printed circuit board with good heat dissipation, high bending rigidity, and good shielding effect, and a method for manufacturing the same. do.

In order to achieve this objective, in the present invention, the j-th wiring layer is formed +B! a metal plate bonded to the resin plate via a prepreg; a second wiring layer formed on the metal plate via an insulating film; a through hole provided in the part, a resin filled in the through hole, and a resin provided in the center of the resin, and -1 D, 1. A printed circuit board is configured with through holes that connect the batten portions of the second wiring layer. In addition, in order to manufacture such a printed circuit board, the above-mentioned through hole is formed in the above-mentioned metal plate using a hole position directing means with a drilling device or a press device, Glue through the prebrag, fill the -1- through hole with JN resin, and use the hole position indicating means to penetrate the resin plate at the center position 16 of the -1- resin. A through hole is provided, and a conductive layer is provided on the inner surface of the through hole to form a through hole.

FIG. 1 is a sectional view showing a part of a printed circuit board according to the present invention. In the figure, 1 is a resin plate, 2.3 is a wiring layer formed on both sides of the resin plate 1, 4 and 5 are the button parts of the wiring layers 2 and 3, and 6 is an aluminum plate. It is glued to the resin plate J.

7 is a wiring layer formed on the aluminum plate 6 via an insulating film 8, 9 is a button part of the wiring layer 7, 1o is a through hole provided in the button part 9 of the aluminum plate 6, ]] is a through hole J6 13 is a Surpol installed at the center of the resin H.
．． 9 is connected.

Although this printed circuit board has aluminum tri6 bonded to the resin board 1, it is possible to increase the density of wiring, has good heat dissipation, has high bending rigidity, and has a very good shielding effect. good. Furthermore, since the aluminum plate 6 is used as the metal plate, the weight does not increase.

Finally, a method for manufacturing a printed circuit board according to the present invention will be explained. First, prepare a resin + fi with copper foil 14 provided on both sides as shown in Figure 2 (al), and
The wiring layer 3 is formed by selectively etching one of the copper foils 14 as shown in J: BL.

Further, an aluminum plate 6 having an insulating film 8 provided on one side and copper:
icalcontrol) NC that has data on the center position of the through-hole hole 16 in the drawing or fill-in or manuscript
Create a tape. Next, follow the instructions on the NC tape and place it in the predetermined position on the NC drilling machine for drilling holes as shown in Figure 2 (C).
), fix the aluminum plate 6 shown in FIG. Accordingly, as shown in FIG. 2(e), the resin plate 1
and aluminum plate 6 are bonded to each other via a rib plate 12. Finally, as shown in FIG. 2, the through hole 10 is filled with resin 11 using silk printing or a roller, and the resin 11 is hardened by heat drying or ultraviolet rays. Next, the board shown in FIG.・After attaching a second drill with a smaller diameter than the drill, use the NC tape to drill a hole in the center of the resin H, as shown in Figure 2 (g). A through hole 1G is provided which also passes through the resin plate 1. Next, electroless copper plating is performed and then electrolytic copper plating is performed to provide a copper plating layer J7 as shown in FIG. Finally, copper foil 1
．． 4.15. By selectively etching the copper plating layer 7, the wiring layers 2 and 7 are etched as shown in FIG.
form.

In this manufacturing method, focusing on the fact that the center line of the through hole 10 and the center line of the Surpol hole 16 match, drilling is performed using the same NC tape.
↓■Drilling work is very easy as it has 6 through holes and 1G through holes.
6 can be provided with high accuracy in the center of the six-piece 1o.

In addition, in the double embodiment, the aluminum plate 6 was bonded only to one side of the fingerboard, but the aluminum plate 6 may be bonded to both sides of the resin plate 1, and the aluminum plate may be sandwiched between the resin plates. However, it is better to bond an aluminum plate to the surface of the resin plate for better heat dissipation.Also,
In the double embodiment, wiring layers 2,
3 was formed, however, the wiring layer may be formed only on the piece iR1 of the resin plate 1.

Furthermore, if the wiring layer is formed in multiple layers by using a multilayer resin plate, it is possible to increase the density of the wiring.

In addition, in the above-mentioned embodiments, Aluminum L and Kari 6 were used as the metal plates, but as the metal plates, any metal plate, such as an iron plate or a copper plate, etc., can be used. It is inexpensive and has very good heat dissipation when a copper plate is used. Further, in the -J series of embodiments, the first new surface shape of the through-hole J hole]O is rectangular, but the cross-sectional shape of the through-hole may be trapezoidal. Also,
By bending in a heated state, one sharpener can be made into an L-shape, a U-shape, or a box-shape, and can serve as a holding mechanism, a knoll, and a circuit protector.

Furthermore, in the above embodiment, the through hole 1o was formed using an NC drilling machine, but the through hole 10 was formed using another drilling device.
Alternatively, the through hole 10 may be provided by making a press mold using NC tape and performing press processing using a press machine using the press mold. Also,"
In the double embodiment, an NC tape is used as the hole position indicating means, but other hole position indicating means may be used.

Furthermore, in the above embodiment, a conductive layer is provided on the inner surface of the through-hole hole 16 by plating to form the through-hole 13, or the through-hole hole 16 is filled with conductive paint, and the conductive coating 3', 1 is dried by heat. Alternatively, after curing with ultraviolet rays or the like, a hole may be formed in the center of the conductive paint using a drilling machine such as an NC drilling machine using the NC tape to form the hole pole 13. Further, as in the above embodiment, the wiring layers 2, 7 . After forming the through holes 13, solder may be applied to the through holes 13, and the wiring layers 2, 7. Through holes 13 may also be formed. moreover,
In the above embodiment, the wiring layers 2 and 7 were formed after the through holes 6 were formed, but the wiring layers 2 and 7 may be formed before bonding the resin plate and the aluminum plate 6. .

As explained above, in the bullet board according to the present invention, since I has good heat dissipation, the mounting density of i; There will be no decline.

In addition, since the bending rigidity is high, even if the number of mounted components increases, the board will not warp, so it is easy to insert the board into the main body, and there will be no contact with adjacent boards. Furthermore, since the shielding effect is good, noise etc. can be effectively prevented. Therefore, it is possible to greatly expand the scope of application of printed circuit boards.

Furthermore, in the printed circuit board manufacturing method according to the present invention, the through hole and the through hole are formed using the same hole position indicating means, so the through hole can be formed precisely and very easily in the center of the through hole. Can be done. Therefore, since the precision of the position of the through-hole is extremely high, it is possible to successfully insert components into the board using an automatic component insertion machine. As described above, the effects of this invention are remarkable.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a part of a printed circuit board according to the present invention, and FIG. 2 is an explanatory diagram of a method for manufacturing a printed circuit board according to the present invention. ■-Resin plate 2, 3...Wiring layer 4.5...Button part 6 - Aluminum temporary 7...Wiring layer 8 - Insulating film 9...Button part 10 - Through hole 1] - Resin 12 Break break] 3 ...Through hole 14.15.Copper foil]6.-Through hole hole 17..Junnosuke Nakamura, patent attorney representing the copper foil layer

Claims (1)

[Claims] (1) A resin plate on which a first wiring layer is formed, and the resin plate 1
A metal plate bonded via a dust plate, a second wiring layer formed on the metal plate via an insulating film, a through hole, a resin filled in the through hole, and a medium heat position for the resin; A printed circuit board characterized by comprising a through hole for connecting a button 72[H of a second wiring layer. (2) The printed circuit board recited in claim 1 is characterized in that the first wiring layer is formed in multiple layers. (3) The metal plate is made of aluminum. The printed circuit board according to claim 1 or 2.
A printed circuit board according to claim 1 or 2. (5) The bullet board according to any one of claims 1 to 71, wherein the through hole has a trapezoidal cross-sectional shape. (6) a resin plate on which a first wiring layer is formed, a metal plate bonded to the resin plate via a brie break, a second wiring layer formed on the metal plate via an insulating film; The through hole provided in the button part of the second wiring layer of the metal plate, the saddle lubricant filled in the through hole, and the hole (located at the center of the elbow) 21, the first. In the method of manufacturing a printed circuit board having a through-hole for connecting a button part of a second wiring layer, the through-hole is formed in the metal plate using a hole position indicating means by a drilling device or a press device, and the resin plate described in 2. and the metal plate are bonded together via a brie break, the through hole is filled with resin, and a through hole is inserted through the resin plate at the center position of the resin using a drilling device using a writing position indicating means. A method for producing a printed circuit board, comprising forming a through hole by providing a hole and providing a conductor layer on the inner surface of the through hole.