JPS6035524A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6035524A
JPS6035524A JP58143821A JP14382183A JPS6035524A JP S6035524 A JPS6035524 A JP S6035524A JP 58143821 A JP58143821 A JP 58143821A JP 14382183 A JP14382183 A JP 14382183A JP S6035524 A JPS6035524 A JP S6035524A
Authority
JP
Japan
Prior art keywords
bonding
pads
pad
row
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58143821A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342496B2 (ko
Inventor
Tetsuji Obara
哲治 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58143821A priority Critical patent/JPS6035524A/ja
Publication of JPS6035524A publication Critical patent/JPS6035524A/ja
Publication of JPH0342496B2 publication Critical patent/JPH0342496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/05554—Shape in top view being square
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    • H01L2224/061—Disposition
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    • H01L2224/06153—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry with a staggered arrangement, e.g. depopulated array
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/494—Connecting portions
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58143821A 1983-08-08 1983-08-08 半導体装置 Granted JPS6035524A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58143821A JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58143821A JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS6035524A true JPS6035524A (ja) 1985-02-23
JPH0342496B2 JPH0342496B2 (ko) 1991-06-27

Family

ID=15347737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58143821A Granted JPS6035524A (ja) 1983-08-08 1983-08-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS6035524A (ko)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444633U (ko) * 1987-09-10 1989-03-16
JPH01107549A (ja) * 1987-10-20 1989-04-25 Mitsubishi Electric Corp 半導体集積回路装置
JPH0565540U (ja) * 1992-08-24 1993-08-31 ローム株式会社 ボンディングパッドの配置構造
JPH08109U (ja) * 1995-07-28 1996-01-23 ローム株式会社 熱印字ヘッド
US5669136A (en) * 1994-06-24 1997-09-23 International Business Machines Corporation Method of making high input/output density MLC flat pack
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
US6037669A (en) * 1994-04-07 2000-03-14 Vlsi Technology, Inc. Staggered pad array
US6061246A (en) * 1997-09-13 2000-05-09 Samsung Electronics Co., Ltd. Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same
KR20040007186A (ko) * 2002-07-11 2004-01-24 주식회사 파이컴 전자소자의 패드, 이의 배열구조 및 이의 제조방법
US6798077B2 (en) * 2000-12-04 2004-09-28 Oki Electric Industry Co., Ltd. Semiconductor device with staggered octagonal electrodes and increased wiring width
JP2012183747A (ja) * 2011-03-07 2012-09-27 Ricoh Co Ltd 液滴吐出ヘッド及び液滴吐出装置
JP2015088548A (ja) * 2013-10-29 2015-05-07 株式会社リコー 面発光レーザアレイ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745938A (en) * 1980-09-03 1982-03-16 Hitachi Ltd Semiconductor device
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745938A (en) * 1980-09-03 1982-03-16 Hitachi Ltd Semiconductor device
JPS57199228A (en) * 1981-06-02 1982-12-07 Toshiba Corp Wire bonding pad device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444633U (ko) * 1987-09-10 1989-03-16
JPH01107549A (ja) * 1987-10-20 1989-04-25 Mitsubishi Electric Corp 半導体集積回路装置
JPH0565540U (ja) * 1992-08-24 1993-08-31 ローム株式会社 ボンディングパッドの配置構造
US6037669A (en) * 1994-04-07 2000-03-14 Vlsi Technology, Inc. Staggered pad array
US5669136A (en) * 1994-06-24 1997-09-23 International Business Machines Corporation Method of making high input/output density MLC flat pack
US5790386A (en) * 1994-06-24 1998-08-04 International Business Machines Corporation High I/O density MLC flat pack electronic component
US5818114A (en) * 1995-05-26 1998-10-06 Hewlett-Packard Company Radially staggered bond pad arrangements for integrated circuit pad circuitry
JPH08109U (ja) * 1995-07-28 1996-01-23 ローム株式会社 熱印字ヘッド
US6061246A (en) * 1997-09-13 2000-05-09 Samsung Electronics Co., Ltd. Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same
US6798077B2 (en) * 2000-12-04 2004-09-28 Oki Electric Industry Co., Ltd. Semiconductor device with staggered octagonal electrodes and increased wiring width
KR20040007186A (ko) * 2002-07-11 2004-01-24 주식회사 파이컴 전자소자의 패드, 이의 배열구조 및 이의 제조방법
JP2012183747A (ja) * 2011-03-07 2012-09-27 Ricoh Co Ltd 液滴吐出ヘッド及び液滴吐出装置
JP2015088548A (ja) * 2013-10-29 2015-05-07 株式会社リコー 面発光レーザアレイ

Also Published As

Publication number Publication date
JPH0342496B2 (ko) 1991-06-27

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