JPS6033449U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6033449U JPS6033449U JP12524583U JP12524583U JPS6033449U JP S6033449 U JPS6033449 U JP S6033449U JP 12524583 U JP12524583 U JP 12524583U JP 12524583 U JP12524583 U JP 12524583U JP S6033449 U JPS6033449 U JP S6033449U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor equipment
- heat sink
- recessed portion
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の横断面図、第２図は第１図の側断面図
、第３図は本案の一実′施例を示す平面図、第４図は第
３図の横断面図、第５図は第３図９側断面図である。
図中、１は放熱板、１ａは表面、１ｂは裏面、 −３は
半導体素子、４はリード、６は樹脂材、７は凹入部であ
る。Fig. 1 is a cross-sectional view of the conventional example, Fig. 2 is a side sectional view of Fig. 1, Fig. 3 is a plan view showing an embodiment of the present invention, and Fig. 4 is a cross-sectional view of Fig. 3. , FIG. 5 is a side sectional view of FIG. 39. In the figure, 1 is a heat sink, 1a is a front surface, 1b is a back surface, -3 is a semiconductor element, 4 is a lead, 6 is a resin material, and 7 is a recessed portion.
Claims (2)
導体素子の電極とリードとを電気的に接続し、かつ半導
体素子を含む主要部分を樹脂材にて、放熱板の裏面が露
呈するようにモールド被覆したものにおいて、上記樹脂
材の頂部に周縁を除いて凹入部を形成したことを特徴と
する半導体装置。(1) Fix the semiconductor element on the surface of the heat sink, electrically connect the electrodes and leads of the semiconductor element, and cover the main part including the semiconductor element with a resin material so that the back side of the heat sink is exposed. What is claimed is: 1. A semiconductor device in which a recessed portion is formed at the top of the resin material except for the peripheral edge thereof.
設定したことを特徴とする実用新案登録請求の範囲第１
項記載の半導体装置。(2) Utility model registration claim 1, characterized in that the depth of the recessed portion is set to 10% or more of the resin coating thickness.
1. Semiconductor device described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524583U JPS6033449U (en) | 1983-08-11 | 1983-08-11 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524583U JPS6033449U (en) | 1983-08-11 | 1983-08-11 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6033449U true JPS6033449U (en) | 1985-03-07 |
Family
ID=30285226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12524583U Pending JPS6033449U (en) | 1983-08-11 | 1983-08-11 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033449U (en) |
-
1983
- 1983-08-11 JP JP12524583U patent/JPS6033449U/en active Pending
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