JPS6029228B2 - Tape for connecting semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a tape for connecting semiconductor elements, in which a conductor wiring pattern of a predetermined shape is provided on a flexible tape made of a resin material having electrical insulation properties.

The planar structure of the tape for connecting semiconductor elements is shown in FIG. 1, and the cross-sectional structure is shown in FIG. 2.

In the figure, a flexible tape 1 made of an electrically insulating resin material has a hole 2 for feeding the tape and a hole 3 for connecting a semiconductor element (hereinafter referred to as a device hole). ing. Further, a conductor wiring pattern 4 having a predetermined shape is formed on the tape. The conductor pattern is generally formed by bonding the copper foil with an adhesive 5 applied on the tape in advance and using a photoetching method. The connection between the tape and the semiconductor element 6 is achieved by aligning the portion 7 of the wiring pattern provided on the tape that protrudes into the device hole (hereinafter referred to as an inner lead) with the protruding electrode 8 provided on the semiconductor element. They are connected using methods such as thermocompression bonding, eutectic bonding, etc. The general dimensions of the inner leads 7 are about 100 mm in width and about 1 side in length, and the number of leads per semiconductor element is 20 to 40.

However, due to increased functionality of semiconductor devices, when connecting semiconductor devices with a large number of electrodes, it is necessary to provide inner leads 7 equal to the number of electrodes. For this purpose, the width of the inner lead 7 must be reduced. However, the length of the inner lead 7 cannot be shortened due to the position of the protruding electrode of the semiconductor element, and as a result, the inner lead 7 becomes long and thin. Therefore, inner lead 7
becomes extremely bendable, the frequency of bending occurring during the manufacturing process increases, and the occurrence of bending decreases. For this reason, it is difficult to make the width of the inner lead 7 narrower than the current width using the follow-up method, and it is not possible to connect semiconductor elements with a large number of electrodes. The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art,
An object of the present invention is to provide a tape for connecting semiconductor elements, which enables connection of semiconductor elements having a large number of electrodes. In the present invention, the adhesive that was conventionally applied to the flexible tape is applied to the copper foil, and the flexible tape and the copper foil are bonded together, thereby holding the inner leads with a thin adhesive film. It is. As a result, even if the width of the inner lead is narrowed, the inner lead will not bend because it is held by a thin film of twill adhesive.
It becomes possible to connect semiconductor elements with a large number of electrodes. Hereinafter, the present invention will be explained in detail according to Examples. FIGS. 3 and 4 are diagrams showing an embodiment of the present invention. A fugitive tape 1 made of a resin material and a conductor wiring pattern 4 are bonded together with an adhesive 5. The adhesive thin film 9 overhangs the device hole 3 and holds the inner lead 7. The thickness of the adhesive thin film 9 is 5 to 20 mm, while the height of the protruding electrode 8 is 25 to 20 mm.
35 mm, even if the thick adhesive thin film 9 overhangs the device hole 3, there will be no problem in terms of connection. As a result, even if the width of the inner lead becomes narrow, there is no risk of bending during the tape manufacturing process. In order to connect the tip of the inner lead to the protruding electrode 8 of the semiconductor element 5, it protrudes from the adhesive thin film 9 by a length necessary for connection. Next, an example of a method for manufacturing the tape for connecting semiconductor elements of the present invention will be described.

Apply adhesive such as polyimide or epoxy adhesive to a thickness of 5 to 30 mm on a 35 mm thick copper foil.

Then, it is cut into 25 sides to obtain a copper foil tape. On the other hand 12
A polyimide sheet with a thickness of 5 mm is cut into 35 mm sides to obtain a polyimide tape. Next, spray the specified shape onto the polyimide sheet. Drill the socket holes and device holes. This polyimide tape and copper foil tape are bonded together using the adhesive applied to the copper foil tape. FIG. 5 shows a cross section of the device hole portion of the tape after adhesion. In this method, unlike the conventional method, the adhesive thin film 9 is also formed on the copper foil 10 in the device hole 3 portion. Next, as shown in FIG. 6, the adhesive thin film formed on the copper foil in the device hole area is dissolved and removed using an etching solution such as sodium hydroxide to a size larger than the outer periphery of the 8 groups of protruding electrodes of the semiconductor element 6. . Next, a wiring pattern of a predetermined shape is formed by a so-called photoetching process of applying photoresist, pre-baking, exposing, developing, and etching the steel foil using the same machine as the conventional method. Note that the copper foil portion exposed in the device hole is coated with a protective resin before the etching process to prevent the copper foil in the device hole portion from being etched from the back side during the etching process. By using the above method, it is possible to create a tape having a structure in which a wiring pattern extending into a device hole is supported by a thin adhesive film as shown in FIG. 3. Note that the bond between the wiring pattern and the protruding electrode of the semiconductor element is made of Au-Sn.
Performed at a relatively low temperature (about 280 oo) like eutectic bonding,
In addition, when a polyimide adhesive with high heat resistance is used as the adhesive, the adhesive thin film formed in the device hole portion is not dissolved and removed to a greater extent than the outer periphery of the protruding electrode group of the semiconductor element. It is also possible to connect a semiconductor element to the side to which mido tape is not attached and use it.

As explained above, according to the present invention, it has become possible to narrow the inner lead width, and it has become possible to connect semiconductor elements with a large number of electrodes.

Also, the inner lead is bent during the manufacturing process. It is possible to prevent a decrease in manufacturing yield.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing the structure of a conventional tape, Fig. 2 is a sectional view showing the structure of a conventional tape, Fig. 3 is a plan view showing the structure of the tape of the present invention, and Fig. 4 is a plan view showing the structure of the tape of the present invention. 5 and 6 are cross-sectional views showing the structure of the tape, and are diagrams showing a method of manufacturing the tape of the present invention. 1... Flexible resin tape, 2... Sprocket hole, 3... Device hole, 4...
...Wiring pattern, 5...Adhesive, 6...
...Semiconductor element, 7...Inner lead, 8.
... Protruding electrode, 9 ... Adhesive thin film, 10
・・・・・・Steel foil. Juice 1 figure Juice 2 figure Age 3 figure Masturbation figure S figure S figure 6 figure

Claims (1)

[Claims] 1 A flexible tape made of electrically insulating resin, device holes drilled at predetermined locations on this tape, and one side of the tape adhered with an adhesive in the length direction of the tape. In a tape for connecting a semiconductor element, which is made of a conductor wiring pattern in which a portion of the conductor wiring pattern protrudes opposite to the device hole, at least a portion of the conductor wiring pattern that protrudes opposite to the device hole, excluding at least a portion to which a semiconductor element is connected. A tape for connecting semiconductor devices characterized by being lined with the same material as the adhesive layer described above.