JPS602838U - Semiconductor device with protective film - Google Patents
Semiconductor device with protective filmInfo
- Publication number
- JPS602838U JPS602838U JP9461283U JP9461283U JPS602838U JP S602838 U JPS602838 U JP S602838U JP 9461283 U JP9461283 U JP 9461283U JP 9461283 U JP9461283 U JP 9461283U JP S602838 U JPS602838 U JP S602838U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- protective film
- semiconductor
- semiconductor element
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体素子え示す断面図、第２図は、
本考案の半導体素子の実施例を示す断面図、第３図は、
本考案の半導体素子を平形ケースに組込んだ場合の実施
例を示す断面図である。
尚、図において、１・・・・・・カソード電極、２・・
・・・・アノード電極、３・・・・・・半導体基極、４
・・・・・・樹脂等の保護膜、５・・・・・・樹脂等塗
布用の容器、６・・・・・・平形ケース（絶縁材）、７
・・・・・・外部電極、である。Fig. 1 is a cross-sectional view showing a conventional semiconductor element, and Fig. 2 is a sectional view showing a conventional semiconductor element.
FIG. 3 is a cross-sectional view showing an embodiment of the semiconductor device of the present invention.
FIG. 2 is a cross-sectional view showing an embodiment in which the semiconductor element of the present invention is assembled into a flat case. In the figure, 1... cathode electrode, 2...
... Anode electrode, 3 ... Semiconductor base electrode, 4
...Protective film such as resin, etc., 5 ... Container for applying resin, etc., 6 ... Flat case (insulating material), 7
・・・・・・External electrode.
Claims (1)
数のＰＮ接合を樹脂等により保護するもので、半導体基
板周辺部の下面と上面との間をそれの外周部から半導体
素子を組み込むケースの内壁に接する程度まで厚く保護
膜を形成することを特徴とする半導体装置。In a semiconductor element, one or more PN junctions exposed on the surface are protected by resin, etc., and the inner wall of the case in which the semiconductor element is installed from the outer periphery between the bottom and top surfaces of the semiconductor substrate periphery. A semiconductor device characterized by forming a protective film so thick that it comes in contact with the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9461283U JPS602838U (en) | 1983-06-20 | 1983-06-20 | Semiconductor device with protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9461283U JPS602838U (en) | 1983-06-20 | 1983-06-20 | Semiconductor device with protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS602838U true JPS602838U (en) | 1985-01-10 |
Family
ID=30226387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9461283U Pending JPS602838U (en) | 1983-06-20 | 1983-06-20 | Semiconductor device with protective film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602838U (en) |
-
1983
- 1983-06-20 JP JP9461283U patent/JPS602838U/en active Pending
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