JPS6096841U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6096841U JPS6096841U JP19056683U JP19056683U JPS6096841U JP S6096841 U JPS6096841 U JP S6096841U JP 19056683 U JP19056683 U JP 19056683U JP 19056683 U JP19056683 U JP 19056683U JP S6096841 U JPS6096841 U JP S6096841U
- Authority
- JP
- Japan
- Prior art keywords
- case
- semiconductor equipment
- semiconductor
- metal substrate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の縦断、面図、第２図はこの
考案に基づ（半導体装置の１実施例の縦断面図である。
１・・・・・・金属基板、２′・・・・・・ケース、６
・・・・・・半導体素子、９，９・・・・・・電極、１
０．１１・・・・・・樹脂層、１５・・・・・・薄肉部
。FIG. 1 is a vertical cross-sectional view and a cross-sectional view of a conventional semiconductor device, and FIG. 2 is a vertical cross-sectional view of one embodiment of a semiconductor device based on this invention. 1...Metal substrate, 2'. ...Case, 6
... Semiconductor element, 9, 9 ... Electrode, 1
0.11... Resin layer, 15... Thin wall portion.
Claims (1)
上記金属基板上に半導体素子を取付け、この半導体素子
から上記ケースの外部に電極を引出し、上記ケース内部
の全面にわたって上記半導体を内部に埋没させるように
樹脂層を船成させてなる半導体装置において、上記ケー
スに薄肉部を設けたことを特徴とする半導体装置。A case is provided on the upper surface of the metal substrate, a semiconductor element is mounted on the metal substrate in the case, an electrode is drawn out from the semiconductor element to the outside of the case, and the semiconductor is buried within the entire surface of the inside of the case. What is claimed is: 1. A semiconductor device comprising a resin layer formed on the surface of the semiconductor device, characterized in that the case is provided with a thin wall portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19056683U JPS6096841U (en) | 1983-12-09 | 1983-12-09 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19056683U JPS6096841U (en) | 1983-12-09 | 1983-12-09 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6096841U true JPS6096841U (en) | 1985-07-02 |
Family
ID=30410578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19056683U Pending JPS6096841U (en) | 1983-12-09 | 1983-12-09 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096841U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55158653A (en) * | 1979-05-30 | 1980-12-10 | Nec Corp | Hybrid integrated circuit device |
-
1983
- 1983-12-09 JP JP19056683U patent/JPS6096841U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55158653A (en) * | 1979-05-30 | 1980-12-10 | Nec Corp | Hybrid integrated circuit device |
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