JPS60260336A - 印刷回路基板用片面金属箔張り積層板の反り矯正方法および装置 - Google Patents
印刷回路基板用片面金属箔張り積層板の反り矯正方法および装置Info
- Publication number
- JPS60260336A JPS60260336A JP59118406A JP11840684A JPS60260336A JP S60260336 A JPS60260336 A JP S60260336A JP 59118406 A JP59118406 A JP 59118406A JP 11840684 A JP11840684 A JP 11840684A JP S60260336 A JPS60260336 A JP S60260336A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- warp
- warpage
- printed circuit
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000011888 foil Substances 0.000 title description 4
- 239000000758 substrate Substances 0.000 title 1
- 239000002184 metal Substances 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 and cured Substances 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59118406A JPS60260336A (ja) | 1984-06-08 | 1984-06-08 | 印刷回路基板用片面金属箔張り積層板の反り矯正方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59118406A JPS60260336A (ja) | 1984-06-08 | 1984-06-08 | 印刷回路基板用片面金属箔張り積層板の反り矯正方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60260336A true JPS60260336A (ja) | 1985-12-23 |
| JPH047706B2 JPH047706B2 (enrdf_load_stackoverflow) | 1992-02-12 |
Family
ID=14735855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59118406A Granted JPS60260336A (ja) | 1984-06-08 | 1984-06-08 | 印刷回路基板用片面金属箔張り積層板の反り矯正方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60260336A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002283470A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP2022126403A (ja) * | 2021-02-18 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 樹脂付き金属箔の製造方法、積層板の製造方法、プリント配線板の製造方法及び半導体パッケージの製造方法 |
-
1984
- 1984-06-08 JP JP59118406A patent/JPS60260336A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002283470A (ja) * | 2001-03-26 | 2002-10-03 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP2022126403A (ja) * | 2021-02-18 | 2022-08-30 | 昭和電工マテリアルズ株式会社 | 樹脂付き金属箔の製造方法、積層板の製造方法、プリント配線板の製造方法及び半導体パッケージの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH047706B2 (enrdf_load_stackoverflow) | 1992-02-12 |
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