JPS60254753A - Epromチツプ搭載パツケ−ジ - Google Patents
Epromチツプ搭載パツケ−ジInfo
- Publication number
- JPS60254753A JPS60254753A JP11167784A JP11167784A JPS60254753A JP S60254753 A JPS60254753 A JP S60254753A JP 11167784 A JP11167784 A JP 11167784A JP 11167784 A JP11167784 A JP 11167784A JP S60254753 A JPS60254753 A JP S60254753A
- Authority
- JP
- Japan
- Prior art keywords
- sapphire
- cap
- eprom chip
- eprom
- mounting package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/18—Circuits for erasing optically
Landscapes
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11167784A JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Epromチツプ搭載パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11167784A JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Epromチツプ搭載パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60254753A true JPS60254753A (ja) | 1985-12-16 |
| JPH031836B2 JPH031836B2 (cs) | 1991-01-11 |
Family
ID=14567382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11167784A Granted JPS60254753A (ja) | 1984-05-31 | 1984-05-31 | Epromチツプ搭載パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60254753A (cs) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158950A (ja) * | 1982-03-16 | 1983-09-21 | Nec Corp | 半導体装置 |
-
1984
- 1984-05-31 JP JP11167784A patent/JPS60254753A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58158950A (ja) * | 1982-03-16 | 1983-09-21 | Nec Corp | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031836B2 (cs) | 1991-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4769272A (en) | Ceramic lid hermetic seal package structure | |
| US4833102A (en) | Process of making a ceramic lid for use in a hermetic seal package | |
| US4992628A (en) | Ceramic-glass integrated circuit package with ground plane | |
| JPH1062655A (ja) | 光半導体アセンブリ | |
| JPH10308419A (ja) | 半導体パッケージ及びその半導体実装構造 | |
| JPH03225854A (ja) | 半導体デバイス及びその製造方法 | |
| US4855869A (en) | Chip carrier | |
| US5258575A (en) | Ceramic glass integrated circuit package with integral ground and power planes | |
| JPS62241354A (ja) | 高周波用回路素子密封パッケージとその製造方法 | |
| US5134246A (en) | Ceramic-glass integrated circuit package with integral ground and power planes | |
| JP3462479B2 (ja) | 表面弾性波フィルターのセラミックパッケージのシーリング方法及び装置 | |
| JP2534881B2 (ja) | 気密封止回路装置 | |
| JPS60254753A (ja) | Epromチツプ搭載パツケ−ジ | |
| JP2668995B2 (ja) | 半導体装置 | |
| JPH07122670A (ja) | ガラス封止型半導体装置の製造方法 | |
| JPH03196664A (ja) | 半導体素子収納用パッケージ | |
| JPH05291425A (ja) | 半導体パッケージおよびその製造方法 | |
| JPS59111350A (ja) | 半導体装置 | |
| JP2770664B2 (ja) | 半導体装置及びその製造方法 | |
| JPH0451056B2 (cs) | ||
| JPS6043660B2 (ja) | 半導体装置 | |
| JP2710893B2 (ja) | リード付き電子部品 | |
| JPS60194545A (ja) | 半導体装置およびその製造方法 | |
| JPS598361Y2 (ja) | Icパツケ−ジ | |
| JPS6083351A (ja) | Eprom装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |