JPS60254696A - Electronic circuit package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic circuit package, and in particular to a package mounted with a plurality of plate-shaped electronic circuit elements having the same or similar connection terminal arrangement, such as memory ICs, etc. It relates to electronic circuit packages.

2. Description of the Related Art Conventionally, this type of electronic circuit package, as shown in FIG.
They were mounted side by side in the same plane above and connected to an external connection terminal 4 for electrical signals by mutual wiring 2.

In this case, the length of mutual wiring 2 is hereinafter referred to as mutual wiring length)
There are disadvantages such as a delay in signal transmission due to a delay in signal transmission, a difference in signal transmission time due to a difference in mutual wiring length, and a disadvantage that the overall shape of the package is planar and large.

Problems to be Solved by the Invention An object of the present invention is to provide an electronic circuit package that improves the conventional problems by reducing the mutual wiring length and the difference in mutual wiring length, and further reducing the size of the package. Our goal is to provide the following.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention has provided a plurality of plate-shaped electronic circuit elements mounted on a good thermal conductor substrate having external connection terminals for electrical signals, and interconnecting them. In the electronic circuit package, a plurality of electronic circuit elements having the same or similar connection terminal arrangement among the plurality of plate-shaped electronic circuit elements are mounted on top of each other at a constant interval and interconnected. This will be adopted.

Function: In the electronic circuit package of the present invention, by minimizing the stacking interval of the plurality of plate-shaped electronic circuit elements mounted in a stacked manner, the mutual wiring length is smaller than before, and is proportional to that. As a result, the difference in length between other interconnections is also reduced.

In particular, a plurality of plate-shaped electronic circuit elements, such as Memo IJI
If the connection terminal arrangement is the same or similar as in C, the mutual wiring between the connection terminals located at almost the same position on each electronic circuit element will be perpendicular to the laminated surface, so the mutual wiring length will be the minimum. As the wiring length becomes smaller, the difference in the length of each interconnection almost disappears.

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

In FIG. 1 showing a perspective view of a first embodiment of the present invention,
The electronic circuit package of the present invention consists of a plurality of plate-shaped electronic circuit elements 1 and a good thermal conductor substrate 3 having external connection terminals 4 for electric signals, and the plurality of electronic circuit elements 1 are arranged at regular intervals. The electronic circuit element 1 is stacked in a laminated manner and mounted on the good thermal conductor substrate 3, and the connection terminals 5 of the electronic circuit element 1 are connected between each other and between the lowest connection terminal and the external connection terminal 4 for electrical signals. They are connected by mutual wiring 2. Therefore, compared to conventional electronic circuit packages, the mutual wiring length is shorter and the area of the package can also be reduced.

FIG. 2 is a perspective view of a second embodiment of the invention.

A plurality of plate-shaped electronic circuit elements 1 are arranged in the same arrangement, such as in a memory IC, in which one or all of the connection terminals 5 have the same or similar functions, and the other configuration is the same as in the first example. This is similar to the embodiment.

As shown in the figure, the interconnections 2 between the connection terminals 5 having the same or similar functions, such as address and clock, located at the same position of each electronic circuit element 1 are perpendicular to the lamination plane, and the lines The length is the minimum, and the line length of the mutual wiring for stationery is also the same, so there is no difference. Therefore, there is an effect similar to that of the first embodiment.

In addition, in the embodiment shown in FIGS. 1 and 2,
Although one set of multiple electronic circuit element groups stacked in a laminated manner is mounted on the good thermal conductor substrate 3, it is also possible to mount two or more sets of multiple electronic circuit element groups.

Moreover, the mutual wiring 2 does not directly connect the connection terminals 5 of the plurality of plate-shaped electronic circuit elements 1 as shown in the figure, but has a connection relay terminal between each of the plate-shaped electronic circuit elements 1. The connection may be made indirectly, such as by inserting a heat conductor plate.

Furthermore, the shape of the good thermal conductor substrate 3 may be made into a shape suitable for cooling in consideration of the heat dissipation effect of the entire package. - As described in detail, according to the present invention, by arranging and mutually wiring a plurality of plate-shaped electronic circuit elements in a stacked manner, signal transmission delays and signal transmission due to mutual wiring lengths can be reduced. The delay time difference can be made smaller than before, and the size of this type of electronic circuit package can also be made smaller than before.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment of the invention, and FIG. 3 is a perspective view showing a conventional example. 1... Plate-shaped electronic circuit element, 2... Mutual wiring, 3... Good thermal conductor substrate, 4...
- External connection terminal for electrical signals, 5...Connection terminal for electronic circuit elements. Testing 1 concave Φ dormitory 2 times

Claims (1)

[Claims] a plurality of plate-shaped electronic circuit elements and a good thermal conductor substrate having external connection terminals for electrical signals; the plurality of plate-shaped electronic circuit elements are mounted on the good thermal conductor substrate; In the wired electronic circuit package, a plurality of electronic circuit elements having the same or similar connection terminal arrangement among the plurality of plate-shaped electronic circuit elements are mounted on top of each other at a constant interval. electronic circuit package.