JPS60253248A - 熱伝導冷却モジユ−ル装置 - Google Patents

熱伝導冷却モジユ−ル装置

Info

Publication number
JPS60253248A
JPS60253248A JP10839984A JP10839984A JPS60253248A JP S60253248 A JPS60253248 A JP S60253248A JP 10839984 A JP10839984 A JP 10839984A JP 10839984 A JP10839984 A JP 10839984A JP S60253248 A JPS60253248 A JP S60253248A
Authority
JP
Japan
Prior art keywords
heat
housing
heat conduction
chip
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10839984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439783B2 (en, 2012
Inventor
Yasutoshi Kurihara
保敏 栗原
Tasao Soga
太佐男 曽我
Komei Yatsuno
八野　耕明
Kenji Miyata
健治 宮田
Masahiro Okamura
岡村　昌弘
Fumiyuki Kobayashi
小林　二三幸
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10839984A priority Critical patent/JPS60253248A/ja
Publication of JPS60253248A publication Critical patent/JPS60253248A/ja
Publication of JPH0439783B2 publication Critical patent/JPH0439783B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10839984A 1984-05-30 1984-05-30 熱伝導冷却モジユ−ル装置 Granted JPS60253248A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10839984A JPS60253248A (ja) 1984-05-30 1984-05-30 熱伝導冷却モジユ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10839984A JPS60253248A (ja) 1984-05-30 1984-05-30 熱伝導冷却モジユ−ル装置

Publications (2)

Publication Number Publication Date
JPS60253248A true JPS60253248A (ja) 1985-12-13
JPH0439783B2 JPH0439783B2 (en, 2012) 1992-06-30

Family

ID=14483769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10839984A Granted JPS60253248A (ja) 1984-05-30 1984-05-30 熱伝導冷却モジユ−ル装置

Country Status (1)

Country Link
JP (1) JPS60253248A (en, 2012)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169749A (ja) * 1987-01-08 1988-07-13 Fujitsu Ltd 半導体装置
US4996589A (en) * 1987-10-21 1991-02-26 Hitachi, Ltd. Semiconductor module and cooling device of the same
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
US5249100A (en) * 1989-05-19 1993-09-28 Hitachi, Ltd. Electronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solder
US6281575B1 (en) 1998-07-08 2001-08-28 Hitachi, Ltd Multi-chip module
JP2012142532A (ja) * 2010-12-15 2012-07-26 Fujitsu Ltd 半導体装置、冷却装置及び冷却装置の製造方法
CN113903710A (zh) * 2021-09-30 2022-01-07 重庆平创半导体研究院有限责任公司 一种碳化硅封装结构及封装方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63169749A (ja) * 1987-01-08 1988-07-13 Fujitsu Ltd 半導体装置
US4996589A (en) * 1987-10-21 1991-02-26 Hitachi, Ltd. Semiconductor module and cooling device of the same
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
US5249100A (en) * 1989-05-19 1993-09-28 Hitachi, Ltd. Electronic circuit device provided with a ceramic substrate having lead pins bonded thereto by solder
US6281575B1 (en) 1998-07-08 2001-08-28 Hitachi, Ltd Multi-chip module
JP2012142532A (ja) * 2010-12-15 2012-07-26 Fujitsu Ltd 半導体装置、冷却装置及び冷却装置の製造方法
CN113903710A (zh) * 2021-09-30 2022-01-07 重庆平创半导体研究院有限责任公司 一种碳化硅封装结构及封装方法

Also Published As

Publication number Publication date
JPH0439783B2 (en, 2012) 1992-06-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees