JPH0325412Y2 - - Google Patents

Info

Publication number
JPH0325412Y2
JPH0325412Y2 JP1985140733U JP14073385U JPH0325412Y2 JP H0325412 Y2 JPH0325412 Y2 JP H0325412Y2 JP 1985140733 U JP1985140733 U JP 1985140733U JP 14073385 U JP14073385 U JP 14073385U JP H0325412 Y2 JPH0325412 Y2 JP H0325412Y2
Authority
JP
Japan
Prior art keywords
heat
housing
cooling module
heat conduction
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985140733U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249248U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985140733U priority Critical patent/JPH0325412Y2/ja
Publication of JPS6249248U publication Critical patent/JPS6249248U/ja
Application granted granted Critical
Publication of JPH0325412Y2 publication Critical patent/JPH0325412Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
JP1985140733U 1985-09-17 1985-09-17 Expired JPH0325412Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985140733U JPH0325412Y2 (en, 2012) 1985-09-17 1985-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985140733U JPH0325412Y2 (en, 2012) 1985-09-17 1985-09-17

Publications (2)

Publication Number Publication Date
JPS6249248U JPS6249248U (en, 2012) 1987-03-26
JPH0325412Y2 true JPH0325412Y2 (en, 2012) 1991-06-03

Family

ID=31047860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985140733U Expired JPH0325412Y2 (en, 2012) 1985-09-17 1985-09-17

Country Status (1)

Country Link
JP (1) JPH0325412Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies

Also Published As

Publication number Publication date
JPS6249248U (en, 2012) 1987-03-26

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