JPS60251251A - Alloy for lead frame for ic with superior corrosion resistance - Google Patents
Alloy for lead frame for ic with superior corrosion resistanceInfo
- Publication number
- JPS60251251A JPS60251251A JP10592384A JP10592384A JPS60251251A JP S60251251 A JPS60251251 A JP S60251251A JP 10592384 A JP10592384 A JP 10592384A JP 10592384 A JP10592384 A JP 10592384A JP S60251251 A JPS60251251 A JP S60251251A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- corrosion resistance
- lead frame
- superior corrosion
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はICリードフレームに使用されるFe −Ni
合金の耐食性の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to Fe-Ni used in IC lead frames.
This invention relates to improving the corrosion resistance of alloys.
従来より半導体装置のリードフレーム用材料としては半
導体素子、ガラスあるいはセラミックス等との熱膨張整
合性の点で42合金(Fe−41%Ni)が広く使用さ
れている。Conventionally, alloy 42 (Fe-41% Ni) has been widely used as a material for lead frames of semiconductor devices because of its thermal expansion compatibility with semiconductor elements, glass, ceramics, and the like.
しかしながらこの合金は耐食性が充分でなく、半導体装
置の製造工程中あるいは各種電子機器に組み込まれた後
の使用中にしばしば応力腐食割れによるリードの折損事
故が発生することが知られている。However, this alloy does not have sufficient corrosion resistance, and it is known that lead breakage accidents often occur due to stress corrosion cracking during the manufacturing process of semiconductor devices or during use after being incorporated into various electronic devices.
特に最近ではこれら半導体装置は原子力や航空機などの
分野でこれまで以上に高い信頼性を要求されるようにな
り、半導体装置メーカーでも応力腐食割れのひとつの要
因となる腐食性物質による汚染(たとえばフォトエツチ
ング液、酸洗液、めっき液等の残存あるいは封止用樹脂
中の不純物等)を最小限に抑えるための努力がなされて
いる。Particularly recently, these semiconductor devices are required to have higher reliability than ever before in fields such as nuclear power and aircraft, and semiconductor device manufacturers are also concerned about contamination by corrosive substances, which is one of the causes of stress corrosion cracking. Efforts are being made to minimize the amount of remaining etching solution, pickling solution, plating solution, etc., or impurities in the sealing resin.
しかしこれら腐食性物質による汚染を完全に排除するこ
とは不可能であり、業界では従来の42合金よりもさら
に耐食性の優れた合金の開発が待ち望まれていた。However, it is impossible to completely eliminate contamination by these corrosive substances, and the industry has been eagerly awaiting the development of an alloy with even better corrosion resistance than the conventional 42 alloy.
本発明は42合金の耐穴性を改善し前述のような欠点を
解消するためになされたもので、重量係にてNi35〜
55 %、C0,05%以下、 Mn2.0%以下にB
を0.0005〜05係含有し残部が実質的にFeより
なることを特徴とする耐食性の優れたICリードフレー
ム用合金および上記合金にさらK Cr、 Mo、 N
b、 V。The present invention was made to improve the hole resistance of 42 alloy and eliminate the above-mentioned drawbacks.
55%, C0.05% or less, Mn2.0% or less
An alloy for IC lead frames with excellent corrosion resistance, characterized by containing 0.0005 to 0.05% of Cr, the remainder being substantially Fe, and the above alloy, in addition to K Cr, Mo, N.
b.V.
Zr、 Ti、 Ta のうち1種または2種以上を合
計で0.01〜4.0係含有することを特徴とする耐食
性の優れたI CIJ−ドフレーム用合金である。This is an alloy for ICIJ-bond frames with excellent corrosion resistance, which is characterized by containing one or more of Zr, Ti, and Ta in a total amount of 0.01 to 4.0%.
次に本発明合金の成分限定理由について述べる。Next, the reason for limiting the composition of the alloy of the present invention will be described.
Niは本合金の基本成分でありNiが35%未満の場合
または55%を越える場合には合金の熱膨張係数が大き
くなり過ぎ牛導体素子、ガラスあるいはセ1゜ラミック
スとの整合性が保でな(なる。このためNiは35・〜
55チ とした。Ni is a basic component of this alloy, and if Ni is less than 35% or more than 55%, the thermal expansion coefficient of the alloy will become too large, making it difficult to maintain compatibility with conductive elements, glass, or ceramics. So, Ni is 35.
It was set at 55 chi.
Cはあまり多く含有すると合金中に炭化物を形成し耐食
性を劣化させるため005係以下とした。If too much C is contained, carbides will form in the alloy and the corrosion resistance will deteriorate, so the content is set to be less than 005.
Mnは合金の熱間加工性向上に効果を有するが、過度に
多く含有せしめると本合金の基本特性である熱膨張係数
の増大をまねくため2,0%以下に限定した。Although Mn has the effect of improving the hot workability of the alloy, Mn is limited to 2.0% or less since containing too much will lead to an increase in the coefficient of thermal expansion, which is a basic characteristic of this alloy.
Bは本発明の目的である耐食性の向上に大きな効果を有
するものであるが0.00054未満では充分なる効果
が得られず一方0.5 %を越えるとその効果は飽和す
るとともに熱間加工性を著しく害するようになるため0
.0005〜0゜5係とした。B has a great effect on improving corrosion resistance, which is the objective of the present invention, but if it is less than 0.00054, a sufficient effect cannot be obtained, while if it exceeds 0.5%, the effect is saturated and hot workability is reduced. 0 as it will cause significant harm to
.. 0005 to 0°5.
またCr、 Mo、 Nb、 V、 Zr、 Tiおよ
びTaも本合金の耐食性を向上させるために含有せしめ
る合金元素であるが1種または2種以上合計で0.01
%未満ではその効果が得られず、逆に4.0係を越える
と熱膨張特性に与える影響が無視できなくなるため0.
01〜4.0係とした。In addition, Cr, Mo, Nb, V, Zr, Ti, and Ta are also alloying elements that are included to improve the corrosion resistance of this alloy, and the total amount of one or more of them is 0.01.
If the ratio is less than 4.0%, the effect cannot be obtained, and if it exceeds 4.0%, the effect on the thermal expansion characteristics cannot be ignored.
01 to 4.0.
以下本発明を実施例により説明する。The present invention will be explained below with reference to Examples.
表に示す組成の合金を真空高周波誘導炉で溶解侮鋳造し
た後1000°C〜1100°Cの温度で鍛造、熱間圧
延を行いさらに冷間圧延と軟化焼鈍を繰り。An alloy having the composition shown in the table was melted and cast in a vacuum high-frequency induction furnace, then forged and hot rolled at a temperature of 1000°C to 1100°C, followed by cold rolling and softening annealing.
返し、最終冷間圧延率30係で厚さ0.1 DBの板材
に。Then, the final cold rolling rate was 30 to make a plate with a thickness of 0.1 DB.
仕上げた。しかるのち本材料から幅I II、長さ40
゜騒の試料をフォトエツチングにより切り出し、150
0゜C〜200″Cの温度にて図に示すような形に樹脂
封。Finished. After that, width I II and length 40 are made from this material.
A sample of 150° was cut out by photoetching.
Resin seal in the shape shown in the figure at a temperature of 0°C to 200″C.
止を行ったものを温度85℃相殺湿度95俤の高温高。The temperature was 85℃ and the humidity was 95℃.
湿中に2000時間放置しその時の試料の割れ発生類1
.。Cracking of the sample after being left in humidity for 2000 hours 1
.. .
度を調査した。なお試験は各合金毎にそれぞれ50個づ
つの試料について行った。結果を表にあわせて示す。We investigated the degree. The test was conducted on 50 samples for each alloy. The results are also shown in the table.
表の結果より明らかなように従来合金(合金番号1)に
(らべ本発明合金(合金番号2〜18)は割れの発性頻
度が低く、良好なる耐食性を有していることがわかる。As is clear from the results in the table, compared to the conventional alloy (alloy number 1), the alloys of the present invention (alloy numbers 2 to 18) have a lower frequency of cracking and have better corrosion resistance.
以上説明したように本発明によればI CIJ−ドフレ
ーム用42合金の熱膨張特性や熱間加工性を害すること
なく耐食性を著しく改善することができ、半導体装置の
高信頼化ひいてはエレクトロニクス・製品の高信頼化が
図れ工業上の効果は極めて大きい。As explained above, according to the present invention, it is possible to significantly improve the corrosion resistance of alloy 42 for ICIJ-deframes without impairing its thermal expansion characteristics or hot workability, thereby improving the reliability of semiconductor devices and, ultimately, electronics and products. High reliability can be achieved, and the industrial effect is extremely large.
矛1図は試料の斜視図である。
11試料、2I封止用樹脂
手続補正書(方式)
%式%
発明(7) 名称 耐食性の浸れた工0リードフレーム
用合金補正をする者
名 称 (!10111 日立金属株式会社代 表 者
河 野 典 夫
代 理 人
補正命令の日付 昭和59年8月28日(発送日)補正
の対象
明細書の「発明の詳細な説明」の欄
補正の内容
明細曹第5頁の表を別紙の通り
訂正する。(内容に変更なし)
手続補正書(自船
13□+ 69.5’+12311
特許庁長官殿
発明+7) 名称 耐良性の優れ7tIO!J−ド7レ
ーム用合金補市をする者
名 称 (fi081 日立金属株式会社代 )2 者
河 野 典 夫
代 理 人
補正の対象
明細書の発明の#m′lk説明の欄。
に訂正。Figure 1 is a perspective view of the sample. 11 Samples, 2I Encapsulation Resin Procedural Correction Form (Method) % Formula % Invention (7) Name Name of person who corrects the corrosion resistant lead frame alloy (!10111 Hitachi Metals Co., Ltd. Representative Kono Date of amendment order: August 28, 1980 (shipment date) Contents of the amendment in the "Detailed Description of the Invention" column of the specification to be amended The table on page 5 of the specification is corrected as shown in the attached sheet. (No change in content) Procedural amendment (Own ship 13□+69.5'+12311 Invention by Commissioner of the Japan Patent Office+7) Name Name of the person who will repair the alloy for 7tIO! J-Door 7Ram with excellent good resistance (fi081 Hitachi Metals Co., Ltd.) 2nd party: Norio Kono (Representative) Corrected the #m'lk explanation column of the invention in the specification subject to personal amendment.
Claims (1)
下、 Mn 2.0 。 チ以下にBを0.0005〜0.5%含有し残部が実質
的にFeよりなることを特徴とする耐食性の優れ。 たI CIJ−ドフレーム用合金。 2、重量係でNi 55〜55% 、 CD、05 %
以下、Mn2.0チ以下にBを0.0005〜0.5%
含有しさらにCr、 。 Mo、 Nb、 V、 Zr、 Ti、 Taのうち1
種または2種以上を合計で001〜4.0係含有し残部
カー質的にFeよりなることを特徴とする耐食性の優れ
たICリードフレーム用合金。[Claims] 1. Ni 35-55%, CO, 0.5% or less, Mn 2.0 by weight i%. Excellent corrosion resistance characterized by containing 0.0005 to 0.5% of B below H, with the balance essentially consisting of Fe. Alloy for ICIJ-de frames. 2. Weight: Ni 55-55%, CD, 05%
Below, 0.0005 to 0.5% B is added to Mn 2.0 or less.
It also contains Cr. One of Mo, Nb, V, Zr, Ti, Ta
An alloy for IC lead frames having excellent corrosion resistance, characterized in that it contains one or more species in a total amount of 001 to 4.0, and the remainder is Fe in terms of carbon content.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10592384A JPS60251251A (en) | 1984-05-25 | 1984-05-25 | Alloy for lead frame for ic with superior corrosion resistance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10592384A JPS60251251A (en) | 1984-05-25 | 1984-05-25 | Alloy for lead frame for ic with superior corrosion resistance |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60251251A true JPS60251251A (en) | 1985-12-11 |
Family
ID=14420380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10592384A Pending JPS60251251A (en) | 1984-05-25 | 1984-05-25 | Alloy for lead frame for ic with superior corrosion resistance |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60251251A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276950A (en) * | 1985-06-03 | 1986-12-06 | Nippon Yakin Kogyo Co Ltd | Fe-ni alloy having good plating property and solderability |
US5264050A (en) * | 1990-06-29 | 1993-11-23 | Kabushiki Kaisha Toshiba | Fe-Ni based alloy |
-
1984
- 1984-05-25 JP JP10592384A patent/JPS60251251A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61276950A (en) * | 1985-06-03 | 1986-12-06 | Nippon Yakin Kogyo Co Ltd | Fe-ni alloy having good plating property and solderability |
JPH0331782B2 (en) * | 1985-06-03 | 1991-05-08 | Nippon Yakin Kogyo Co Ltd | |
US5264050A (en) * | 1990-06-29 | 1993-11-23 | Kabushiki Kaisha Toshiba | Fe-Ni based alloy |
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