JPS60238445A - Alloy for lead frame for ic with superior corrosion resistance - Google Patents

Alloy for lead frame for ic with superior corrosion resistance

Info

Publication number
JPS60238445A
JPS60238445A JP9394784A JP9394784A JPS60238445A JP S60238445 A JPS60238445 A JP S60238445A JP 9394784 A JP9394784 A JP 9394784A JP 9394784 A JP9394784 A JP 9394784A JP S60238445 A JPS60238445 A JP S60238445A
Authority
JP
Japan
Prior art keywords
alloy
corrosion resistance
lead frame
less
total
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9394784A
Other languages
Japanese (ja)
Inventor
Daiji Sakamoto
坂本 大司
Tsutomu Inui
乾 勉
Kazu Sasaki
計 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP9394784A priority Critical patent/JPS60238445A/en
Publication of JPS60238445A publication Critical patent/JPS60238445A/en
Pending legal-status Critical Current

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  • Heat Treatment Of Steel (AREA)

Abstract

PURPOSE:To obtain an alloy for a lead frame for IC with superior corrosion resistance by adding specified amounts of C, Mn and Ru and/or Pd to an Fe-Ni- Co alloy. CONSTITUTION:The composition of the alloy for the lead frame for IC is composed of, by weight, 25-35% Ni, 10-20% Co, <0.05% C, <2% Mn, 0.005-0.5% in total of Ru and/or Pd and the balance Fe. It is preferable that 0.01-4% in total of one or more among Cr, Mo, Nb, V, Zr, Ti and Ta are further contained in the composition.

Description

【発明の詳細な説明】 本発明けICリードフレームに使用されるFe −Ni
 −Co合金の耐食性の改良に関するものである。
[Detailed description of the invention] Fe-Ni used in the IC lead frame of the present invention
This invention relates to improving the corrosion resistance of -Co alloys.

従来より半導体装置のリードフレーム用材料としては、
半導体素子、ガラスあるいけセラミックス等との熱膨張
整合性の点で42合金(Fe −41% Ni )やコ
バール合金(Fe −29% Ni −17’1Co)
が広く使用されている。
Conventionally, materials for lead frames of semiconductor devices include:
42 alloy (Fe-41% Ni) and Kovar alloy (Fe-29% Ni-17'1Co) in terms of thermal expansion compatibility with semiconductor elements, glass, ceramics, etc.
is widely used.

しかしながらこの合金は耐食性が充分でなく、半導体装
置の製造工程中あるいは各種電子機器に組み込まれfr
後の使用中に、しば17は応力腐食割れによるリードの
折損事故が発生することが知られている。
However, this alloy does not have sufficient corrosion resistance, and is often incorporated into semiconductor device manufacturing processes or various electronic devices.
It is known that Shiba 17 leads to lead breakage due to stress corrosion cracking during subsequent use.

特に最近ではこれら半導体装置は原子力や航空機がどの
分野でこれまで以上に高い信頼性を要求されるように々
す、半導体装置メーカーでも応力腐食割れのひとつの要
因となる腐食性物質による汚染(たと乏げフォトエツチ
ング液、酸洗液、めっき液等の弗存あるいけ封止用樹脂
中の不純物等)を最小限に抑メるための努力が表されて
いる。
Particularly recently, these semiconductor devices are required to have higher reliability than ever before in fields such as nuclear power and aircraft, and semiconductor device manufacturers are also concerned about contamination by corrosive substances, which is one of the causes of stress corrosion cracking. Efforts are being made to minimize the presence of photoetching solutions, pickling solutions, plating solutions, and impurities in sealing resins.

1−7かじこわら腐食性物質による汚染を完全に排除す
ることは不可峠であり、業界では従来のコバ−ル合金よ
りもさらに耐食性の優れた合金の開発が待ち望まれてい
た。
1-7 It is impossible to completely eliminate contamination from corrosive substances, and the industry has been eagerly awaiting the development of an alloy with even better corrosion resistance than the conventional Kovar alloy.

本発明はFe −Ni −Co合金の耐食性を改善11
、前述のよう々欠点を解消するためになされたもので、
重量子にてNi25〜35%、0010〜20%。
The present invention improves the corrosion resistance of Fe-Ni-Co alloy11
, was made to eliminate the drawbacks as mentioned above,
Ni25-35%, 0010-20% by weight.

CD、05%以下、 R4n 2 、0%以下にRuお
よびPdを1種あるいは2種合計で0.00’5〜0.
5チ含有゛し、残部が実質的KFeより々ることを特徴
とする耐食性の優れたICリードフレーム用合金および
上記合金にさらにCr +Mo +Nb 、V+Zr 
+Ti+Taのうち1種または2種以上を合計で0.0
1〜4.0%含有してなることを特命とする耐食性の優
れたICリードフレーム用合金である。
CD, 0.05% or less, R4n 2 , 0% or less, and one or both of Ru and Pd in a total of 0.00'5 to 0.00%.
An alloy for IC lead frames with excellent corrosion resistance characterized by containing 50% Cr + Mo + Nb and V+Zr with the remainder being substantially KFe.
0.0 in total of one or more of +Ti+Ta
It is an alloy for IC lead frames with excellent corrosion resistance, which is specially designed to contain 1 to 4.0% of C.

次に本発明合金の成分限定理由について述べる。Next, the reason for limiting the composition of the alloy of the present invention will be described.

NiおよびCoは本合金の基本成分であり、Niが25
チ未満の場合または35%を越える場合あるいはCoが
10チ未満かまたは20チを越乏る場合には、合金の熱
膨張係数が大きくなり過ぎ半導体素子、ガラスあるいけ
セラミックスとの整合性が保てなくなる。このためNi
け25〜35%、CoけCはあまり多く含有すると合金
中に炭化物を形成し、耐食性を劣化させるため0.05
%以下とした。
Ni and Co are the basic components of this alloy, with Ni being 25
If Co is less than 35% or more than 35%, or if Co is less than 10% or more than 20%, the coefficient of thermal expansion of the alloy becomes too large and compatibility with semiconductor elements, glass, or ceramics is not maintained. It disappears. For this reason, Ni
25 to 35%, and 0.05 to 35% Co. If too much C is contained, carbides are formed in the alloy and the corrosion resistance is deteriorated.
% or less.

Mnは合金の熱間加工性向上に効果を有するが、過度に
多く含有せしめると本合金の基本特性である熱膨張係数
の増大をオねくため2.0%以下に限定した。
Although Mn has the effect of improving the hot workability of the alloy, Mn is limited to 2.0% or less since containing too much may lead to an increase in the coefficient of thermal expansion, which is a basic characteristic of the present alloy.

RuおよびPdは本発明の目的である耐食性の向上に大
きな効果を有するものであるが、いずれか1′sまたは
2種合計で0.005チ未満では充分なる効果が得られ
ず一方0.5%を越えるとその効果は飽和するとと本に
熱間加工性を著しく害するようになるため0.005〜
0.5%とした。
Ru and Pd have a great effect on improving corrosion resistance, which is the objective of the present invention, but if either 1's or the total of the two is less than 0.005, a sufficient effect cannot be obtained; If it exceeds 0.005%, the effect will reach saturation and the hot workability will be significantly impaired.
It was set to 0.5%.

またCr’ r Mo r Nb T V r Zr 
+ TlおよびTaも本合金の耐食性を向上させるため
に含有せしめる合金元素であるが、1種才たは2#以上
合計で0.01%未満でけその効果が得られず、逆に4
.0チを越えると熱膨張特性に与オる影響が無視できな
く浸るため0.01〜4.0%とした。
Also Cr' r Mor Nb T V r Zr
+ Tl and Ta are also alloying elements that are included in order to improve the corrosion resistance of this alloy, but if the total amount is less than 0.01% of 1st grade or 2# or more, no effect can be obtained;
.. If the content exceeds 0%, the influence on the thermal expansion characteristics cannot be ignored, so the content was set at 0.01% to 4.0%.

以下本発明を実施例により説明する。The present invention will be explained below with reference to Examples.

表に示す組成の合金を真空高周波誘導炉で溶解・鋳造し
た後1000℃〜1100℃の温度で鍛造・熱間圧延を
行い、さらに冷間圧延と軟化焼鈍を繰り返し、最終冷間
圧延率60%で厚さ0.10−の板材に仕上けた。しか
るのち本材料から幅1冒、長さ40期の試料をフォトエ
ツチングにより切り出し、150℃〜200℃の温度に
て図に示すような形に樹脂封止を行ったものを、温度8
5℃相対湿度95%の高温高湿中に2000時間放置し
その時の試料の割れ発生頻度を評査した。なお試験は各
合金毎にそれぞれ50個づつの試料について行った。結
果を表にあわせて示す。
The alloy with the composition shown in the table is melted and cast in a vacuum high-frequency induction furnace, then forged and hot rolled at a temperature of 1000°C to 1100°C, and then cold rolled and softened annealed repeatedly to achieve a final cold rolling reduction of 60%. A plate material with a thickness of 0.10 mm was completed. After that, a sample with a width of 1 inch and a length of 40 mm was cut out from this material by photoetching, and the sample was sealed with resin at a temperature of 150 to 200 degrees Celsius as shown in the figure.
The samples were left in a high temperature and high humidity environment at 5° C. and relative humidity of 95% for 2000 hours, and the frequency of cracking in the samples at that time was evaluated. The test was conducted on 50 samples for each alloy. The results are also shown in the table.

表の結果より明らかなように従来合金(合金番号1)に
くらべ本発明合金(合金番号2〜12)は割れの発性頻
度が低く、良好なる耐食性を有していることがわかる。
As is clear from the results in the table, compared to the conventional alloy (alloy number 1), the alloys of the present invention (alloy numbers 2 to 12) crack less frequently and have better corrosion resistance.

以上説明したように本発明によれば、r’ Cl −ド
フレーム用42合金の熱膨張特性や熱間加工性を害する
ことなく耐食性を著しく改善することができ、半導体装
置の高信朝化ひいてはエレクトロニクス製品の高信頼化
が図れ工業上の効果は極めて大きい。
As explained above, according to the present invention, it is possible to significantly improve the corrosion resistance of alloy 42 for use in r' Cl -de frames without impairing its thermal expansion characteristics and hot workability, thereby improving the reliability of semiconductor devices and, ultimately, electronic products. High reliability can be achieved, and the industrial effect is extremely large.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は試料の斜視図である。 1:試料 2:封止用樹脂 第 l @ FIG. 1 is a perspective view of the sample. 1: Sample 2: Sealing resin Part l @

Claims (1)

【特許請求の範囲】 1 重量%でNi25〜65チ+ Co 10〜20チ
。 C0,05%以下、 Mn 2 、0 %以下にRuお
よびPdを1種あるいは2種合計で0.005〜0.5
チ含有し、残部が実質的にFeよりなることを特′徴と
する耐食性の優れたI CIJ−ドフレーム用合金。 2、重f%でNi25〜65チ、Co10〜20%。 CD、05%以下、 Mn 2 、0%以下にRuおよ
びPdを1mあるいは2種合計で0.005〜0.5チ
含有し、さらにCr + Mo + Nb + V *
 Zr+Ti *Taのうち1挿貫たけ2種以上を合計
で0.01〜4.0%含有し、残部が実質的にFeより
なることを特徴とする耐食性の優ねたICリードフレー
ム用合金。
[Claims] 1% by weight: 25 to 65 inches of Ni + 10 to 20 inches of Co. C 0.05% or less, Mn 2 , 0% or less, Ru and Pd in one or two types total of 0.005 to 0.5
An alloy for use in ICIJ-bonded frames with excellent corrosion resistance, characterized in that it contains iron and the remainder is substantially made of Fe. 2. Weight f% is Ni 25-65%, Co 10-20%. CD, 0.05% or less, Mn 2 , 0% or less, Ru and Pd are contained in 1 m or 0.005 to 0.5 t in total of the two types, and further Cr + Mo + Nb + V *
An alloy for IC lead frames with excellent corrosion resistance, characterized in that it contains two or more types of Zr+Ti *Ta in a total of 0.01 to 4.0% for each penetration, and the remainder is substantially Fe.
JP9394784A 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance Pending JPS60238445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9394784A JPS60238445A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9394784A JPS60238445A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Publications (1)

Publication Number Publication Date
JPS60238445A true JPS60238445A (en) 1985-11-27

Family

ID=14096628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9394784A Pending JPS60238445A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Country Status (1)

Country Link
JP (1) JPS60238445A (en)

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