JPS60238450A - Alloy for lead frame for ic with superior corrosion resistance - Google Patents

Alloy for lead frame for ic with superior corrosion resistance

Info

Publication number
JPS60238450A
JPS60238450A JP9394584A JP9394584A JPS60238450A JP S60238450 A JPS60238450 A JP S60238450A JP 9394584 A JP9394584 A JP 9394584A JP 9394584 A JP9394584 A JP 9394584A JP S60238450 A JPS60238450 A JP S60238450A
Authority
JP
Japan
Prior art keywords
alloy
corrosion resistance
lead frame
less
superior corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9394584A
Other languages
Japanese (ja)
Inventor
Tsutomu Inui
乾 勉
Daiji Sakamoto
坂本 大司
Kazu Sasaki
計 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP9394584A priority Critical patent/JPS60238450A/en
Publication of JPS60238450A publication Critical patent/JPS60238450A/en
Pending legal-status Critical Current

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  • Heat Treatment Of Steel (AREA)

Abstract

PURPOSE:To obtain an alloy for a lead frame for IC with superior corrosion resistance by adding specified amounts of C, Mn and Cu to an Fe-Ni-Co alloy. CONSTITUTION:The composition of the alloy for the lead frame for IC is composed of, by weight, 10-33% Ni, 10-20% Co, <0.05% C, <2% Mn, 2-15% Cu and the balance Fe. The total amount of Ni and Cu is regulated to 25-35%. It is preferable that 0.01-4% in total of one or more among Cr, Mo, Nb, V, Zr, Ti and Ta are further contained in the composition.

Description

【発明の詳細な説明】 本発明はICリードフレームに使用されるFe −Ni
 −Co合金の耐食性の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to Fe-Ni used in IC lead frames.
This invention relates to improving the corrosion resistance of -Co alloys.

しては、半導体素子、ガラスあるいけセラミックス等と
の熱膨張整合性の点で42合金(Fe−414Ni )
やコバール合金(Fe −29’A Ni −17%C
o )が広く使用されている。
42 alloy (Fe-414Ni) in terms of thermal expansion compatibility with semiconductor devices, glass, ceramics, etc.
and Kovar alloy (Fe-29'A Ni-17%C
o) is widely used.

しかし々がらこの合金は耐食性が充分でなく、半導体装
置の製造工程中あるいは各秤電子機器に組み込まれた後
の使用中に、しけしは応力腐食割れによるリードの折損
事故が発生することが知られている。
However, this alloy does not have sufficient corrosion resistance, and it is known that lead breakage accidents due to stress corrosion cracking may occur during the manufacturing process of semiconductor devices or during use after being incorporated into each scale electronic device. It is being

特に最近ではこれら半導体装置は、原子力や航空機など
の分野でこれ捷で以上に高い信頼性を要求されるように
なり、半導体装置メーカーでも応力腐食割れのひとつの
要図となる腐食性物質による汚染(たとえばフォトエツ
チング液、酸性液。
Particularly recently, these semiconductor devices have come to be required to have even higher reliability than ever before in fields such as nuclear power and aircraft, and semiconductor device manufacturers are also concerned about contamination by corrosive substances, which is one of the key signs of stress corrosion cracking. (For example, photo-etching liquid, acidic liquid.

めっき液等の残存あるいは封止用樹脂中の不紳物1等)
を最小限に抑えるだめの努力がなされている、しかしこ
れら腐食性物質による汚染を完全に排除することは不可
能であり、業界では従来のコバール合金よりもさらに耐
食性の優れた合金の開発。
Remaining plating solution, etc. or unsightly items in the sealing resin 1)
However, it is impossible to completely eliminate contamination from these corrosive substances, and the industry is developing alloys that are even more resistant to corrosion than traditional Kovar alloys.

本発明けFe −Ni −Co合金の耐食性を改善し、
前述のような欠点を解消するために表されたもので、重
量%にてNi10〜55%r Co 10〜20 %+
CO,05%以下+ Mn 2.0%以下にCu2〜1
5%を含有しNi%X Cu%が25〜35チ残部が実
質的にFeより々ることを%徴とする耐食性の優れたI
CIJ−ドフレーム用合金、および上記合金にさらにC
r + Mo 、 Nb r V r Zr + Ti
 + Taのうち1種または2種以上を合計で0.01
〜4.0チ含有することを特徴とする耐食性の優れたI
Cリードフレーム用合金である。
The present invention improves the corrosion resistance of the Fe-Ni-Co alloy,
It was expressed in order to eliminate the above-mentioned drawbacks, and in terms of weight% Ni 10-55% r Co 10-20% +
CO, 05% or less + Mn 2.0% or less, Cu2-1
I with excellent corrosion resistance, containing 5% Ni%XCu%, with the balance being substantially more than Fe.
CIJ-deframe alloy, and the above alloy further contains C.
r + Mo, Nb r V r Zr + Ti
+ One or more of Ta in total of 0.01
I with excellent corrosion resistance characterized by containing ~4.0
This is an alloy for C lead frames.

次に本発明合金の成分限定理由について述べる。Next, the reason for limiting the composition of the alloy of the present invention will be described.

NiおよびCo l Cuは本合金の基本特性である熱
膨張係数の点から限定されるものであり、N量チ+Cu
%が25チ未満かまたは35%を越える場合あるいはC
oが10チ未満かまたは20チを越える場合には、合金
の熱膨張係数が大六〈なりすぎ、ヰ導体米子、ガラスあ
るいはセラミックスとの整合性が保てなくなる。このた
めNiけ1o〜33%。
Ni and Co l Cu are limited due to the thermal expansion coefficient, which is a basic property of this alloy, and the amount of N + Cu is limited.
% is less than 25% or more than 35% or C
If o is less than 10 inches or more than 20 inches, the coefficient of thermal expansion of the alloy will be too large, making it impossible to maintain compatibility with the conductor Yonago, glass or ceramics. For this reason, Ni is 10 to 33%.

Cuけ2〜15%r Coは10〜20%でかつNi 
+Cはあまり多く含有すると合金中に炭化物を形成し耐
食性を劣化させるため0.05%以下とした。
Cu is 2-15% r Co is 10-20% and Ni
If too much +C is contained, carbides will form in the alloy and the corrosion resistance will deteriorate, so the content is set to 0.05% or less.

胤は合金の熱間加工性向上に効果を有するが、過度に多
く含有せしめると本合金の基本特性である熱膨張係数の
増大をまねくため2.0%以下に限定した。
Seeds have the effect of improving the hot workability of the alloy, but their content was limited to 2.0% or less because excessively large amounts would lead to an increase in the coefficient of thermal expansion, which is a basic characteristic of this alloy.

Cuは本発明の目的である耐食性の向上に大きな効果を
有するものであるが、2チ未満ではその効果が得られず
、一方15%を越えるとその効果は飽和するとともに熱
間加工性を著し7く害するようKなるため2〜15チと
した。
Cu has a great effect on improving corrosion resistance, which is the objective of the present invention, but if it is less than 2%, this effect cannot be obtained, and on the other hand, if it exceeds 15%, the effect is saturated and hot workability is significantly reduced. It was set at 2 to 15 inches to make it more harmful.

またCr r Mo + Nb+ V * Zr + 
TiおよびTaも本合金の耐食性を向上させるために含
有ぜしめる合金左素であるが、1種貫だけ2種以上合計
で0.01チ未満ではその効果が得られず、逆に4.0
チを越えると熱膨張特性に与オる影響が無視できなくな
るため0.01〜4.0チとした。
Also, Cr r Mo + Nb+ V * Zr +
Ti and Ta are also alloy elements that are included in order to improve the corrosion resistance of this alloy, but if only one type is used and the total of two or more types is less than 0.01 inch, the effect cannot be obtained;
Since the influence on thermal expansion characteristics cannot be ignored if it exceeds 0.01 to 4.0.

以下本発明を実施例により謂、明する。The present invention will be explained below with reference to Examples.

表に示す組成の合金を真空高周波誘導炉で溶解・鋳造し
た後1000℃〜1100℃の温度で鍛造・熱間圧延を
行いさらに塔間圧延と軟化焼鈍を繰り返し、最終冷間圧
延率30%で厚さ0.10mmの板材に仕上けた。しか
るのち本材料から幅1 m 、長さ40Ily+の試料
をフォトエツチングにより切り出し、150℃〜200
℃の温度にて図に示すような形に樹脂封止を行ったもの
を、温度85℃相対湿度95チの高温高湿中に2000
時間放置し、その時の試料の割れ発生頻度を訓育した。
The alloy with the composition shown in the table is melted and cast in a vacuum high-frequency induction furnace, then forged and hot rolled at a temperature of 1000℃ to 1100℃, and then repeated between column rolling and softening annealing, with a final cold rolling rate of 30%. It was finished into a plate material with a thickness of 0.10 mm. After that, a sample with a width of 1 m and a length of 40 Ily+ was cut out from this material by photoetching, and heated at 150°C to 200°C.
The resin-sealed product was molded into the shape shown in the figure at a temperature of 85 °C and a relative humidity of 95 °C for 2000 °C in a high temperature and high humidity environment.
The sample was left for a certain period of time, and the frequency of cracking in the sample at that time was studied.

々お試験は各合金毎に、それぞれ50個づつの試料につ
いて行った。
Each test was conducted on 50 samples for each alloy.

結果を表にあわせて示す。The results are also shown in the table.

表の結果より明らかなように従来合金(合金番号1)に
くらべ本発明合金(合金番号2〜13)は割れの発性頻
度が低く、良好々る耐食性を有していることがわかる。
As is clear from the results in the table, compared to the conventional alloy (alloy number 1), the alloys of the present invention (alloy numbers 2 to 13) crack less frequently and have good corrosion resistance.

以上w9明したように本発明によれば、ICリードフレ
ーム用42合金の熱膨張特性や熱間カロ、工性ル包!i
ト ム )−J−fp/ 市斗イト紀トか羊 1 ど 
μQ拍虹1ト ヌ、−ふ 禍;でき、半導体装置の高信
頼化とたいてはエレクトロニクス製品の高信頼化が図れ
、工業上の効果は極めて大きい。
As explained above, according to the present invention, the thermal expansion characteristics, hot temperature resistance, and workability of alloy 42 for IC lead frames can be improved. i
Tom )-J-fp/ Ichito Itoki Toka Sheep 1 What
It is possible to improve the reliability of semiconductor devices and, in most cases, electronic products, and has extremely large industrial effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は試料の斜視図である。 悴 l 図 FIG. 1 is a perspective view of the sample. 悴  图

Claims (1)

【特許請求の範囲】 1 重量%でNi10〜56チ、Co10〜20%。 CD、05%以下、 Mn 2.0%以下、Cu2〜1
5チを含有しNiとCuの総量が25〜55%残部が実
質的にFeより々ることを特徴とする耐食性の優れたI
Cリードフレーム用合金。 2 重iチでNi10〜33チ、6010〜20%。 CD、05%以下、 Mn 2.0%以下、Cu2〜1
5チを含有しNiとCuの総量が25〜35%で、さら
にCr r Mo + Nb + V * Zr + 
Ti * Taのうち1種寸たけ2種以上を合計で0.
01〜4.0チ含有し、残部が実質的にFeよりなるこ
とを特徴とする耐食性の優れたI 、CIJ−ドフレー
ム用合金。
[Claims] 1% by weight: 10 to 56% Ni and 10 to 20% Co. CD, 05% or less, Mn 2.0% or less, Cu2-1
I with excellent corrosion resistance, characterized in that the total amount of Ni and Cu is 25 to 55% and the balance is substantially more than Fe.
Alloy for C lead frame. 2 Ni 10 to 33 pieces, 6010 to 20%. CD, 05% or less, Mn 2.0% or less, Cu2-1
Cr Mo + Nb + V * Zr +
Ti * One type of Ta and two or more types with a total of 0.
1. An alloy for use in I, CIJ-bonded frames with excellent corrosion resistance, characterized in that it contains 01 to 4.0% Fe, and the remainder consists essentially of Fe.
JP9394584A 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance Pending JPS60238450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9394584A JPS60238450A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9394584A JPS60238450A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Publications (1)

Publication Number Publication Date
JPS60238450A true JPS60238450A (en) 1985-11-27

Family

ID=14096572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9394584A Pending JPS60238450A (en) 1984-05-11 1984-05-11 Alloy for lead frame for ic with superior corrosion resistance

Country Status (1)

Country Link
JP (1) JPS60238450A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314387A (en) * 1986-07-05 1988-01-21 Nisshin Steel Co Ltd Floppy disk center core and its manufacture
JPH03166340A (en) * 1989-06-26 1991-07-18 Hitachi Metals Ltd High strength lead frame material and its manufacture
CN100345991C (en) * 2002-12-08 2007-10-31 卢云光 Color antirust iron and steel without paint
CN107699770A (en) * 2017-08-21 2018-02-16 昆明理工大学 A kind of high entropy alloy material and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314387A (en) * 1986-07-05 1988-01-21 Nisshin Steel Co Ltd Floppy disk center core and its manufacture
JPH03166340A (en) * 1989-06-26 1991-07-18 Hitachi Metals Ltd High strength lead frame material and its manufacture
CN100345991C (en) * 2002-12-08 2007-10-31 卢云光 Color antirust iron and steel without paint
CN107699770A (en) * 2017-08-21 2018-02-16 昆明理工大学 A kind of high entropy alloy material and preparation method thereof
CN107699770B (en) * 2017-08-21 2019-05-14 昆明理工大学 A kind of high entropy alloy material and preparation method thereof

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